Method of reducing process plasma damage using optical spectroscopy

• US 6,673,200 B1
• Filed: 07/12/2002
• Issued: 01/06/2004
• Est. Priority Date: 05/30/2002
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Gu, Shiqun, Fujimoto, Ryan Tadashi, McGrath, Peter Gerard
• Primary Examiner(s): Abraham, Fetsum
• Application Number:
  US10/195,775
• Time in Patent Office: 543 Days
• Field of Search: 156/626-651, 156/552
• US Class Current: 156/345.35
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/32972 Spectral analysis
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: Y10T 156/1734 Means bringing articles into association with web

Abstract

Optical emission spectra from a test wafer during a plasma process are measured using a spectrometer. The plasma charging voltage retained by (detected by) the test wafer is measured after the process step is completed. The emission spectra are correlated with the plasma charging voltage to identify the species contributing to the plasma charging voltage. The optical emission spectra are monitored in real time to optimize the plasma process to prevent plasma charging damage. The optical emission spectra are also monitored to control the plasma process drift.

Claims

1. A method for determining process species associated with plasma charging damage, the method comprising:

measuring a first optical emission spectrum from a plasma directed to a test wafer during a plasma process operation;

measuring a plasma induced charge level on the test wafer;

correlating the optical emission spectrum with the plasma induced charge level; and

from the correlation, identifying a molecular species contributing to the plasma induced charge level.

2. The method recited in claim 1, further comprising:

measuring a second optical emission spectrum from a wafer; and

measuring a second plasma induced charging level on a test wafer before correlating the emission spectra with the measured plasma charging levels.

3. The method recited in claim 1, wherein the test wafer is an EPROM wafer.

4. The method recited in claim 1, wherein the test wafer is a wafer reliability level wafer.

5. The method recited in claim 1, wherein identifying a species contributing to the plasma induced charge level comprises identifying the wavelengths of peaks in the optical emission spectra correlated with the plasma induced charge level.

6. A method for adjusting plasma charge levels on a wafer during a plasma process step by monitoring the optical emission spectral output, the method comprising:

a) measuring a first optical emission spectrum correlated with plasma charging on a wafer during the a plasma process step;

b) using correlation data to determine a plasma induced charge level on the wafer from the measured optical spectrum; and

c) adjusting a plasma process parameter in response to the measured first optical emission spectrum when the plasma induced charge level exceeds a predetermined threshold.

7. The method recited in claim 6 wherein the optical emission spectrum is measured using an optical spectrometer.

8. The method recited in claim 6 wherein the adjusting the process parameters comprises one of adjusting the RF level, the pressure for the species, and the flow rate for a species.

9. The method recited in claim 6 further comprising d) measuring the first optical emission spectrum correlated with plasma charging from a wafer during a plasma process step after the adjustment of the process parameter.

10. The method recited in claim 9 further comprising repeating steps a through d until the plasma charging is reduced.

11. The method recited in claim 9 further comprising repeating steps a through d until the plasma charging is minimized.

12. The method recited in claim 6 wherein the plasma process parameter is adjusted to reduce plasma charging damage to the wafer.

13. A method for monitoring plasma process variation, the method comprising:

performing a first and second measurement of an optical emission spectrum correlated with plasma charging from at least one wafer during a plasma process step; and

determining the relative plasma charge levels on the at least one wafer at the time of the measurements from the the first and second measurements.

14. The method recited in claim 13 wherein the first measurement is taken in a different plasma chamber from the second measurement.

15. The method recited in claim 14 wherein the first and second measurements are taken to match conditions in the chambers.

16. The method recited in claim 13 wherein the first measurement is taken in the same plasma chamber as the second measurement but at a different time than the second measurement.

17. The method recited in claim 13 further comprising, where the relative plasma charge levels exceeds a predetermined threshold, adjusting a plasma process parameter.