IC device, circuit board and IC assembly

• US 6,673,484 B2
• Filed: 07/10/2001
• Issued: 01/06/2004
• Est. Priority Date: 07/10/2000
• Status: Expired due to Term

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Matsuura, Kouji
• Primary Examiner(s): Bell, Bruce F.
• Application Number:
  US09/901,054
• Publication Number:
  US 20020004163A1
• Time in Patent Office: 910 Days
• Field of Search: 429/96, 429/100, 257/499
• US Class Current: 429/96
• CPC Class Codes: H01M 10/4257 Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• CPC Class Codes: H01M 10/44 Methods for charging or discharging circuits for charging H02J7/00
• CPC Class Codes: H01M 10/48 Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals, H01M50/569
• CPC Class Codes: H01M 50/548 on opposite sides of the cell
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2201/10545 Related components mounted on both sides of the PCB
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An IC assembly includes: a circuit board; an IC device mounted on the circuit board, said IC device including an IC placed on the circuit board and a plurality of connecting terminals for fixing the IC onto the circuit board; and a battery cell mounted on the circuit board in such a manner that one of the IC device and the battery cell overlaps the other in a direction substantially perpendicular to the circuit board, wherein a plurality of electrode-connecting terminals are provided to electrically connect the battery cell to the circuit board.

Claims

1. An IC device for use with a battery cell, comprising:

an IC operable to be mounted on a circuit board;

a plurality of connecting terminals, extending from said IC, operable to fix said IC to said circuit board; and

a plurality of electrode-connecting terminals operable to connect said battery cell to said circuit board when said battery cell is mounted on said circuit board in such a manner that one of said battery cell and said IC overlaps the other in a direction substantially perpendicular to said circuit board.

2. An IC device as claimed in claim 1, wherein parts of said plurality of connecting terminals serve as said electrode-connecting terminals.

3. An IC device as claimed in claim 1, wherein said IC device includes a controller operable to control power supply from said battery cell.

4. A circuit board for use with an IC device and a battery cell, comprising:

a first surface onto which said IC device is to be mounted;

a second surface opposite to said first surface; and

a plurality of electrode-connecting terminals operable to connect said battery cell to said circuit board when said battery cell is mounted on said circuit board in such a manner that one of said IC device and said battery cell overlaps the other in a direction substantially perpendicular to said circuit board.

5. A circuit board as claimed in claim 4, wherein said battery cell is mounted on said first surface to be placed on said IC device.

6. A circuit board as claimed in claim 4, wherein said battery cell is mounted on said second surface, and said electrode-connecting terminals are provided on said second surface.

7. A circuit board as claimed in claim 6, further comprising a battery accommodating portion, formed in said second surface, operable to accommodate at least a part of said battery cell.

8. A circuit board as claimed in claim 7, wherein said battery accommodating portion is a dent formed in said second surface.

9. An IC assembly comprising:

a circuit board;

an IC device mounted on said circuit board, said IC device including an IC placed on said circuit board and a plurality of connecting terminals operable to fix said IC onto said circuit board; and

a battery cell mounted on said circuit board in such a manner that one of said IC device and said battery cell overlaps the other in a direction substantially perpendicular to said circuit board, wherein

a plurality of electrode-connecting terminals are provided to connect said battery cell to said circuit board.

10. An IC assembly as claimed in claim 9, wherein said battery cell is placed on said IC of said IC device.

11. An IC assembly as claimed in claim 10, wherein parts of said plurality of connecting terminals of said IC device serve as said electrode-connecting terminals.

12. An IC assembly as claimed in claim 10, wherein said electrode-connecting terminals are provided separately from said connecting terminals.

13. An IC assembly as claimed in claim 9, wherein said circuit board includes a first surface on which said IC device is mounted and a second surface opposite to said first surface, and

said battery cell is mounted on said second surface and said electrode-connecting terminals are provided on said second surface.

14. An IC assembly as claimed in claim 13, wherein said battery cell is mounted on said second surface to be overlapped by said IC device.

15. An IC assembly as claimed in claim 14, wherein said second surface of said circuit board has a battery accommodating portion operable to accommodate at least a part of said battery cell therein.

16. An IC assembly as claimed in claim 15, wherein said battery accommodating portion is an opening passing from said second surface to said first surface.

17. An IC assembly as claimed in claim 15, wherein said battery accommodating portion is a dent formed in said second surface.

18. An IC assembly as claimed in claim 9, wherein said battery cell is a battery cell for backup of a device into which said IC assembly is incorporated.

19. An IC assembly as claimed in claim 18, wherein said IC device has at least a function of controlling power supply from said battery cell to said device.

20. An IC assembly as claimed in claim 18, wherein said battery cell is chargeable, and said IC device has at least a function of controlling charging of said battery cell.