Light-emitting diode (LED) package and packaging method for shaping the external light intensity distribution

• US 6,674,096 B2
• Filed: 06/08/2001
• Issued: 01/06/2004
• Est. Priority Date: 06/08/2001
• Status: Active Grant

• Current Assignee: Current Lighting Solutions, LLC (f/k/a GE Lighting Solutions, LLC) (American Industrial Partners)
• Original Assignee: Gelcore (General Electric Company)
• Inventors: Sommers, Mathew L.
• Primary Examiner(s): CRANE, SARA W
• Application Number:
  US09/681,806
• Publication Number:
  US 20020185651A1
• Time in Patent Office: 942 Days
• Field of Search: 257/98, 257/81, 257/95, 257/99, 257/100, 362/800
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

An LED package (10) includes LED die (12) mounted onto lead frame (14) and electrically connected thereto whereby LED die (12) is electrically energized through leads (16, 18). An encapsulant (20), preferably an epoxy resin, encapsulates and preferably hermetically seals LED die (12). Encapsulant (20) includes depression (24) defined by preselected curved surfaces (28), at least a portion of which are coated by reflective coating (26). Encapsulant (20) preferably also includes sides (22) with preselected curvature. In operation, LED die (12) emits light (32) directed approximately along LED die surface normal (36). Light rays (32) reflect from reflective surface (26) and reflected rays (38) are subsequently refracted by refracting surface (22) so that refracted rays (40) exit the capsule. The reflecting surface (26) and refracting surface (22) cooperate to convert LED die light distribution (32) into light distribution (40) which appears to emanate from an approximate point source (42).

Claims

1. A light emitting diode (LED) package comprising:

a transparent, hemispherically shaped encapsulant surrounding the LED; and

a reflective surface disposed on the encapsulant surface opposite the LED surface, wherein the encapsulant surface near the reflective surface is spatially depressed with respect to the hemispherical shape such that LED radiation incident upon the reflective surface is reflected essentially toward a side of the package.

2. The LED package of claim 1, wherein the reflective surface and the curvature of the encapsulant surface are arranged so that LED radiation reflected from the reflective surface and subsequently exiting the encapsulant appears to an associated viewer as emanating from an approximate point light source.

3. The LED package of claim 1, wherein the reflective surface and the curvature of the encapsulant surface are arranged so that LED radiation reflected from the reflective surface and subsequently exiting the encapsulant appears to an associated viewer as emanating from an approximate line light source.

4. The LED package claim 1, wherein the reflective surface is coated with a reflective coating.

5. The LED package claim 1, wherein the encapsulant is an epoxy.

6. The LED package of claim 1, wherein the encapsulant is essentially radially symmetric about an LED surface normal.

7. The LED package of claim 4, wherein:

the encapsulant exhibits reflection symmetry about a plane containing an LED die surface normal and the reflective surface includes an essentially linear depression; and

the reflective coating is disposed upon at least a portion of the linear depression.

8. The LED package of claim 1, wherein the encapsulant hermetically seals the LED die.

21. The LED package of claim 2, wherein the spatially depressed encapsulant surface near the reflective surface defines a depression, and the reflective surface includes:

a reflective filling material disposed in the depression.

9. A light emitting diode (LED) capsule comprising:

an LED die;

a hemispherically shaped transparent encapsulant which encapsulates the LED die;

a reflective surface disposed on a portion of the encapsulant outer surface opposite a light emitting surface of the LED die, the reflective surface reflecting LED radiation emitting from the light emitting surface toward curved sidewalls of the LED capsule; and

a refracting surface defined by the curved sidewalls which cooperates with the reflective surface to convert the distribution of the LED die light emission intensity into a preselected external light emission intensity distribution.

10. The LED capsule of claim 9, further including:

a lead frame on which the LED die is mounted and electrically connected with, the lead frame including reflective lead frame portions that cooperate with the reflective and refracting surfaces to convert the distribution of the LED die light emission intensity into the preselected external light emission intensity distribution.

11. The LED capsule of claim 9, wherein the refracting surface is a portion of the encapsulant outer surface which has a preselected curvature.

12. The LED capsule of claim 9, wherein the preselected external light emission intensity distribution is an apparent approximate point source light emission intensity distribution.

14. The LED capsule of claim 9, wherein the transparent encapsulant hermetically seals the LED die.

13. A light emitting diode (LED) capsule including:

a lead frame;

an LED die mounted onto the lead frame and electrically connected thereto;

a transparent encapsulant which encapsulates the LED die and at least a portion of the lead frame;

a reflective surface disposed on a portion of the encapsulant outer surface generally opposite to a light-emitting surface of the LED die; and

a refracting surface which cooperates with the reflective surface to convert a distribution of LED die light emission intensity into an apparent approximate line source light emission intensity distribution.

15. A light emitting diode (LED) capsule for producing an approximate extended light source with essentially uniform intensity distribution over an extended solid viewing angle, the LED capsule comprising:

an LED die;

a transparent encapsulant which encapsulates the LED die; and

a roughened diffusely reflective surface disposed on at least a portion of the encapsulant outer surface generally opposite the LED die.

20. The method of claim 15, wherein the encapsulant hermetically seals at least the LED die.

16. A light emitting diode (LED) capsule for producing an approximate extended light source with essentially uniform intensity distribution over an extended solid viewing angle, the LED capsule including:

a lead frame;

an LED die mounted onto the lead frame and electrically connected thereto;

a transparent encapsulant which encapsulates the LED die and at least a portion of the lead frame; and

a roughened surface depression in the encapsulant positioned essentially opposite the LED die.

17. The LED capsule of claim 16, wherein the depression is conically shaped.

18. The LED capsule of claim 16, further comprising:

a reflective filling disposed within the depression and essentially conforming with the roughness of the roughened surface.

19. A light emitting diode (LED) capsule for producing an approximate extended light source with substantially uniform intensity distribution over an extended solid viewing angle, the LED capsule including:

a lead frame;

an LED die mounted onto the lead frame and electrically connected thereto;

a transparent encapsulant which encapsulates the LED die and at least a portion of the lead frame;

a roughened surface disposed on at least a portion of the encapsulant outer surface; and

a coating of reflective material disposed upon at least a portion of the roughened surface.