Single crystal, tunneling and capacitive, three-axes sensor using eutectic bonding and a method of making same

• US 6,674,141 B1
• Filed: 08/01/2000
• Issued: 01/06/2004
• Est. Priority Date: 08/01/2000
• Status: Expired due to Fees

• Current Assignee: HRL Laboratories LLC (The Boeing Co.)
• Original Assignee: HRL Laboratories LLC (The Boeing Co.)
• Inventors: Kubena, Randall L., Chang, David T.
• Primary Examiner(s): COLEMAN, WILLIAM D
• Application Number:
  US09/629,683
• Time in Patent Office: 1,253 Days
• Field of Search: 250/234, 216/11, 216/2, 438/12, 257/414, 257/415, 257/417, 257/587
• US Class Current: 257/417
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/036 Fusion bonding
• CPC Class Codes: B81C 2203/058 Aligning components using methods not provided for in B81C2203/051 - B81C2203/052
• CPC Class Codes: B81C 3/002 Aligning microparts
• CPC Class Codes: G01C 19/5656 the devices involving a micromechanical structure
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/0894 by non-contact electron transfer, i.e. electron tunneling
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 59/0009 making use of micromechanics

Abstract

A three axis MEM tunneling/capacitive sensor and method of making same. Cantilevered beam structures for at least two orthogonally arranged sensors and associated mating structures are defined on a first substrate or wafer, the at least two orthogonally arranged sensors having orthogonal directions of sensor sensitivity. A resonator structure of at least a third sensor is also defined, the third sensor being sensitive in a third direction orthogonal to the orthogonal directions of sensor sensitivity of the two orthogonally arranged sensors and the resonator structure having a mating structure thereon. Contact structures for at least two orthogonally arranged sensors are formed together with mating structures on a second substrate or wafer, the mating structures on the second substrate or wafer being of a complementary shape to the mating structures on the first substrate or wafer. The mating structures of the first substrate are disposed in a confronting relationship with the mating structures of the second substrate or wafer. A eutectic bonding layer associated with one of the mating structures facilitates bonding between the respective mating structures. At least a portion of the first substrate or wafer is removed to release the cantilevered beam structures and the resonator structure.

Claims

1. A three axis MEM tunneling sensor assembly for making a three axis MEM tunneling sensor therefrom, the assembly comprising:

(a) orthogonally arranged beam structures, a resonator structure and associated mating structures defined on a first substrate or wafer;

(b) contact structures and mating structures defined on a second substrate or wafer, the mating structures on the second substrate or wafer being of a complementary shape to the mating structures on the first substrate or wafer; and

(c) a pressure/heat sensitive bonding layer disposed on said mating structures on at least one of said first and second substrates or wafers for bonding the mating structures defined on the first substrate or wafer to mating structures on the second substrate or wafer in response to the application of pressure/heat therebetween.

2. A three axis MEM tunneling sensor assembly as claimed in claim 1 wherein the second substrate or wafer is formed of silicon.

3. A three axis MEM tunneling sensor assembly as claimed in claim 2 wherein the silicon forming the second substrate or wafer is of a single crystalline structure.

4. A three axis MEM tunneling sensor assembly as claimed in claim 3 wherein the crystalline structure of the silicon is <

100>

.

5. A three axis MEM tunneling sensor assembly as claimed in claim 4 wherein the silicon is n-type.

6. A three axis MEM tunneling sensor assembly as claimed in claim 1 wherein the first substrate or wafer is formed of silicon.

7. A three axis MEM tunneling sensor assembly as claimed in claim 6 wherein the silicon forming the first substrate or wafer is of a single crystalline structure.

8. A three axis MEM tunneling sensor assembly as claimed in claim 7 wherein the crystalline structure of the silicon in the first substrate or wafer is <

100>

.

9. A three axis MEM tunneling sensor assembly as claimed in claim 8 wherein the silicon of the first substrate or wafer is n-type silicon.

10. A three axis MEM tunneling sensor assembly as claimed in claim 1 wherein the cantilevered beam and resonator structures are formed from an epitaxial layer of silicon on said first substrate or wafer, said epitaxial layer being doped with a dopant.

11. A three axis MEM tunneling sensor assembly as claimed in claim 10 wherein a pointed contact is disposed on an end of said beam structure.

12. A three axis MEM tunneling sensor assembly as claimed in claim 10 wherein the epitaxial layer is doped with Boron at a sufficient concentration to reduce the resistivity of the epitaxial layer to less than 0.05 Ω

-cm.

13. A three axis MEM tunneling sensor assembly as claimed in claim 12 further including first and second ohmic Ti/Pt/Au contacts on said epitaxial layer, said second ohmic contact being disposed near a distal end of the beam structure and said first ohmic contact forming the mating structure on the first substrate or wafer.

14. A three axis MEM tunneling sensor assembly as claimed in claim 13 wherein a relatively thick layer of Ti/Pt/Au is disposed on the first and second ohmic Ti/Pt/Au contacts, a first portion of the relatively thick layer of Ti/Pt/Au being disposed on said first ohmic Ti/Pt/Au contact and providing the mating structure on the first substrate and a second portion of the relatively thick layer of Ti/Pt/Au forming a pointed contact on said second ohmic Ti/Pt/Au contact.

15. A three axis MEM tunneling sensor assembly as claimed in claim 14 further including Ti/Pt/Au contacts disposed on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining the mating structure on the second substrate or wafer.

16. A three axis MEM tunneling sensor assembly as claimed in claim 15 wherein the bonding layer is provided by a layer of Au—

Si eutectic disposed on the Ti/Pt/Au contact on said second substrate and/or by a layer of Au—

Si eutectic disposed on the first portion of the relatively thick layer of Ti/Pt/Au on the first substrate or wafer.

17. A three axis MEM tunneling sensor assembly as claimed in claim 15 wherein the silicon for the eutectic bond is provided by the silicon substrate of the first or second substrates or wafers at the mating structure.

18. A three axis MEM tunneling sensor assembly as claimed in claim 12 further including first and second ohmic contacts on said epitaxial layer, said second ohmic contact being disposed near a distal end of the beam structure and said first ohmic contact forming the mating structure on the first substrate or wafer.

19. A three axis MEM tunneling sensor assembly as claimed in claim 18 further including a protruding portion which protrudes from a major surface of said second substrate or wafer and Ti/Pt/Au contacts on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining, in combination with the protruding portion, the mating structure on the second substrate or wafer.

20. A three axis MEM tunneling sensor assembly as claimed in claim 19 wherein the bonding layer is provided by a layer of Au—

Si eutectic disposed on the Ti/Pt/Au contact on said second substrate and/or by a layer of Au—

Si eutectic disposed on first ohmic contact.

21. A three axis MEM tunneling sensor assembly as claimed in claim 10 wherein first and second interconnected Ti/Pt/Au contacts are disposed on said epitaxial layer, the contacts being interconnected by an elongate ribbon layer of Ti/Pt/Au, said second interconnected contact being disposed near a distal end of the beam structure, the elongate ribbon being disposed longitudinally on the beam structure and said first interconnected contact forming the mating structure on the first substrate or wafer.

22. A three axis MEM tunneling sensor assembly as claimed in claim 21 wherein a protruding portion protrudes from a major surface of said second substrate or wafer, Ti/Pt/Au contacts are disposed on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining, in combination with the protruding portion, the mating structure on the second substrate or wafer.

23. A three axis MEM tunneling sensor assembly as claimed in claim 22 wherein the bonding layer is provided by a layer of Au—

Si eutectic disposed on the Ti/Pt/Au contact on said second substrate and/or by a layer of Au—

Si eutectic disposed on first interconnected contact.

24. A three axis MEM tunneling sensor assembly as claimed in claim 1 wherein a center post in a resonator structure is bonded to the mating structure on the second substrate or wafer.

25. A three axis MEM tunneling sensor assembly as claimed in claim 1 wherein an outer frame of the resonator structure is bonded to the mating structure on the second substrate or wafer.

44. A three axis MEM tunneling/capacitive sensor as claimed in claim 1 in which a third wafer is bonded to the top of the sensor in a vacuum to vacuum seal the sensor.

26. A three axis MEM tunneling sensor assembly comprising:

(a) orthogonally arranged beam structures, an associated resonator structure and associated mating structures arranged on a first substrate or wafer;

(b) contact structures and associated mating structures defined on a second substrate or wafer, the mating structures on the second substrate or wafer being of a complementary shape to the mating structures on the first substrate or wafer; and

(c) an eutectic bonding layer disposed on said mating structures on at least one of the substrates or wafers for bonding the mating structures defined on the first substrate or wafer to mating structures on the second substrate or wafer in response to the application of pressure and heat therebetween, the mating structures being joined one to another at said eutectic bonding layer.

27. A three axis MEM tunneling sensor assembly as claimed in claim 26 wherein the first and second substrates or wafers are each formed of single crystal silicon.

28. A three axis MEM tunneling sensor assembly as claimed in claim 26 wherein the crystalline structure of the silicon is <

100>

.

29. A three axis MEM tunneling sensor assembly as claimed in claim 26 wherein the cantilevered beam structure is formed from an epitaxial layer of silicon on said first substrate or wafer, said epitaxial layer being doped with a dopant.

30. A three axis MEM tunneling sensor assembly as claimed in claim 29 wherein the epitaxial layer is doped with Boron at a sufficient concentration to reduce the resistivity of the epitaxial layer to less than 0.05 Ω

-cm.

31. A three axis MEM tunneling sensor assembly as claimed in claim 29 further including first and second ohmic contacts on said epitaxial layer, said second ohmic contact being disposed near a distal end of the beam structure and said first ohmic contact forming the mating structure on the first substrate or wafer.

32. A three axis MEM tunneling sensor assembly as claimed in claim 31 wherein a relatively thick layer of metal is disposed on the first and second ohmic contacts, a first portion of the relatively thick layer of metal being disposed on said first ohmic contact and providing the mating structures on the first substrate or wafer and a second portion of the relatively thick layer of metal forming a pointed contact on said second ohmic contact.

33. A three axis MEM tunneling sensor assembly as claimed in claim 32 further including metal contacts disposed on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining the mating structure on the second substrate or wafer.

34. A three axis MEM tunneling sensor assembly as claimed in claim 33 wherein the bonding layer is provided by a layer of Au—

Si eutectic disposed on the metal contact on said second substrate and/or by a layer of Au—

Si eutectic disposed on the first portion of the relatively thick layer of metal on the first substrate or wafer.

35. A three axis MEM tunneling sensor assembly as claimed in claim 33 wherein the silicon for the eutectic bond is provided by the silicon substrate of the first or second substrates or wafers at the mating structure.

36. A three axis MEM tunneling sensor assembly as claimed in claim 30 further including first and second ohmic contacts on said epitaxial layer, said second ohmic contact being disposed near a distal end of the beam structure and said first ohmic contact forming the mating structure on the first substrate or wafer.

37. A three axis MEM tunneling sensor assembly as claimed in claim 26 further including a protruding portion which protrudes from a major surface of said second substrate or wafer and metal contacts on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining, in combination with the protruding portion, the mating structure on the second substrate or wafer.

38. A three axis MEM tunneling sensor assembly as claimed in claim 37 wherein the bonding layer is provided by a layer of Au—

Si eutectic disposed on the metal contact on said second substrate and/or by a layer of Au—

Si eutectic disposed on first ohmic contact.

39. A three axis MEM tunneling sensor assembly as claimed in claim 26 wherein first and second interconnected metal contacts are disposed on said epitaxial layer, the contacts being interconnected by an elongate ribbon of metal, said second interconnected contact being disposed near a distal end of the beam structure, the elongate ribbon being disposed longitudinally on the beam structure and said first interconnected contact forming the mating structure on the first substrate.

40. A three axis MEM tunneling sensor assembly as claimed in claim 39 wherein a protruding portion protrudes from a major surface of said second substrate or wafer, metal contacts are disposed on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining, in combination with the protruding portion, the mating structure on the second substrate or wafer.

41. A three axis MEM tunneling sensor assembly as claimed in claim 40 wherein the bonding layer is provided by a layer of Au—

Si eutectic disposed on the metal contact on said second substrate and/or by a layer of Au—

Si eutectic disposed on first interconnected contact.

42. A three axis MEM tunneling sensor assembly as claimed in claim 26 wherein a center post in the resonator structure is bonded to the mating structure on the second substrate or wafer.

43. A three axis MEM tunneling sensor assembly as claimed in claim 26 wherein an outer frame of the resonator structure is bonded to the mating structure on the second substrate or wafer.

45. A three axis MEM tunneling/capacitive sensor, the sensor comprising:

(a) a X-axis tunneling gyro disposed on a first substrate or wafer;

(b) a Y-axis tunneling gyro disposed on the first substrate or wafer;

(c) a Z-axis capacitive gyro disposed on the first substrate or wafer;

(d) a second substrate or wafer; and

(e) mating structures on at least one of said first and second substrates or wafers for mating the first substrate or wafer to the second substrate or wafer.

46. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 45 wherein the second substrate or water is formed of silicon.

47. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 46 wherein the silicon forming the second substrate or wafer consists of a single crystalline structure.

48. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 47 wherein the crystalline structure of the silicon is <

100>

.

49. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 48 wherein the silicon is n-type.

50. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 45 wherein the first substrate or wafer is formed of silicon.

51. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 50 wherein the silicon forming the first substrate or wafer consists of a single crystalline structure.

52. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 51 wherein the crystalline structure of the silicon in the first substrate or wafer is <

100>

.

53. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 52 wherein the silicon of the first substrate or wafer is n-type silicon.

54. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 45 wherein the X-axis tunneling gyro and the Y-axis tunneling gyro each include a cantilevered beam structure and wherein the Z-axis capacitive gyro includes a cantilevered beam and a resonator structure formed from an epitaxial layer of silicon on said first substrate or wafer, said epitaxial layer being doped with a dopant.

55. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 54 wherein a pointed contact is disposed on an end of said beam structure.

56. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 54 wherein the epitaxial layer is doped with Boron at a sufficient concentration to reduce the resistivity of the epitaxial layer to less than 0.05 Ω

-cm.

57. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 56 further including first and second ohmic Ti/Pt/Au contacts on said epitaxial layer, said second ohmic contact being disposed near a distal end of the beam structure and said first ohmic contact forming the mating structure on the first substrate or wafer.

58. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 57 wherein a relatively thick layer of Ti/Pt/Au is disposed on the first and second ohmic Ti/Pt/Au contacts, a first portion of the relatively thick layer of Ti/Pt/Au being disposed on said first ohmic Ti/Pt/Au contact and providing the mating structure on the first substrate and a second portion of the relatively thick layer of Ti/Pt/Au forming a pointed contact on said second ohmic Ti/Pt/Au contact.

59. A three axis MEM tunneling sensor assembly as claimed in claim 58 further including Ti/Pt/Au contacts disposed on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining the mating structure on the second substrate or wafer.

60. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 59 wherein a bonding layer is provided by a layer of Au—

Si eutectic disposed on the Ti/Pt/Au contact on said second substrate or wafer and/or by a layer of Au—

Si eutectic disposed on the first portion of the relatively thick layer of Ti/Pt/Au on the first substrate or wafer.

61. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 59 wherein the silicon for the eutectic bond is provided by the silicon substrate of the first or second substrates or wafers at the mating structure.

62. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 56 further including first and second ohmic contacts on said epitaxial layer, said second ohmic contact being disposed near a distal end of the beam structure and said first ohmic contact forming the mating structure on the first substrate or wafer.

63. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 62 further including a protruding portion which protrudes from a major surface of said second substrate or wafer and Ti/Pt/Au contacts on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining, in combination with the protruding portion, the mating structure on the second substrate or wafer.

64. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 63 wherein a bonding layer is provided by a layer of Au—

Si eutectic disposed on the Ti/Pt/Au contact on said second substrate or wafer and/or by a layer of Au—

Si eutectic disposed on first ohmic contact.

65. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 54 wherein first and second interconnected Ti/Pt/Au contacts are disposed on said epitaxial layer, the contacts being interconnected by an elongate ribbon layer of Ti/Pt/Au, said second interconnected contact being disposed near a distal end of the beam structure, the elongate ribbon being disposed longitudinally on the beam structure and said first interconnected contact forming the mating structure on the first substrate or wafer.

66. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 65 wherein a protruding portion protrudes from a major surface of said second substrate or water, Ti/Pt/Au contacts are disposed on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining, in combination with the protruding portion, the mating structure on the second substrate or wafer.

67. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 66 wherein a bonding layer is provided by a layer of Au—

Si eutectic disposed on the Ti/Pt/Au contact on said second substrate and/or by a layer of Au—

Si eutectic disposed on first interconnected contact.

68. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 45 wherein a center post in a resonator structure of the Z-axis capacitive gyro is bonded to the mating structure on the second substrate or wafer.

69. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 45 wherein an outer frame of a resonator structure of the Z-axis capacitive gyro is bonded to the mating structure on the second substrate or wafer.

70. A three axis MEM tunneling/capacitive sensor assembly comprising:

(a) a first substrate or wafer formed of silicon;

(b) two orthogonally arranged tunneling sensors, each tunneling sensor including at least a cantilevered beam structure formed of silicon on said first substrate or wafer;

(c) an orthogonally arranged capacitive gyro having a resonator structure, the capacitive gyro being sensitive on an axis which is orthogonally disposed to the beam structures of the two tunneling sensors, the resonator structure being formed of silicon on said first substrate or wafer;

(d) a mating structure arranged on the first substrate or wafer;

(e) at least one contact structure and an associated mating structure defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer;

(f) an eutectic bonding layer disposed on said mating structure of at least one of the substrates or wafers for bonding the mating structure defined on the first substrate or wafer to the mating structure on the second substrate in response to the application of pressure and heat therebetween, the mating structures of the first and second substrates or wafers being joined one to another at said eutectic bonding layer; and

(g) the first substrate or wafer being dissolvable by a solvent while the beam structures and resonator structure formed on the first substrate or wafer are resistant to being dissolved by said solvent.

71. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 70 wherein the first and second substrates or wafers are each formed of single crystal silicon.

72. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 71 wherein the crystalline structure of the silicon is <

100>

.

73. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 70 wherein the cantilevered beam structure is formed from an epitaxial layer of silicon on said first substrate or wafer, said epitaxial layer being doped with a dopant.

74. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 73 wherein the epitaxial layer is doped with Boron at a sufficient concentration to reduce the resistivity of the epitaxial layer to less than 0.05 Ω

-cm.

75. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 73 further including first and second ohmic contacts on said epitaxial layer, said second ohmic contact being disposed near a distal end of the beam structure and said first ohmic contact forming the mating structure on the first substrate or wafer.

76. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 75 wherein a relatively thick layer of metal is disposed on the first and second ohmic contacts, a first portion of the relatively thick layer of metal being disposed on said first ohmic contact and providing the mating structure on the first substrate or wafer and a second portion of the relatively thick layer of metal forming a pointed contact on said second ohmic contact.

77. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 76 further including metal contacts disposed on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining the mating structure on the second substrate or wafer.

78. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 77 wherein the eutectic bonding layer is provided by a layer of Au—

Si eutectic disposed on the metal contact on said second substrate or wafer and/or by a layer of Au—

Si eutectic disposed on the first portion of the relatively thick layer of metal on the first substrate or wafer.

79. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 77 wherein the silicon for the eutectic bond is provided by the silicon substrate of the first or second substrates or wafers at the mating structure.

80. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 74 further including first and second ohmic contacts on said epitaxial layer, said second ohmic contact being disposed near a distal end of the beam structure and said first ohmic contact forming the mating structure on the first substrate or wafer.

81. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 70 further including a protruding portion which protrudes from a major surface of said second substrate or wafer and metal contacts on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining, in combination with the protruding portion, the mating structure on the second substrate or wafer.

82. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 81 wherein the bonding layer is provided by a layer of Au—

Si eutectic disposed on the metal contact on said second substrate or wafer and/or by a layer of Au—

Si eutectic disposed on first ohmic contact.

83. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 70 wherein first and second interconnected metal contacts are disposed on said epitaxial layer, the contacts being interconnected by an elongate ribbon of metal, said second interconnected contact being disposed near a distal end of the beam structure, the elongate ribbon being disposed longitudinally on the beam structure and said first interconnected contact forming the mating structure on the first substrate or wafer.

84. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 83 wherein a protruding portion protrudes from a major surface of said second substrate or wafer, metal contacts are disposed on said second substrate or wafer, at least one of said contacts on the second substrate or wafer defining, in combination with the protruding portion, the mating structure on the second substrate or wafer.

85. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 84 wherein the eutectic bonding layer is provided by a layer of Au—

Si eutectic disposed on the metal contact on said second substrate and/or by a layer of Au—

Si eutectic disposed on first interconnected contact.

86. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 70 wherein a center post in the resonator structure is bonded to the mating structure on the second substrate or wafer.

87. A three axis MEM tunneling/capacitive sensor assembly as claimed in claim 70 wherein an outer frame of the resonator structure is bonded to the mating structure on the second substrate or wafer.

88. A three axis MEM tunneling/capacitive sensor as claimed in claim 70 in which a third wafer is bonded to the top of the sensor in a vacuum to vacuum seal the sensor.