System for uniformly interconnecting and cooling

• US 6,674,164 B1
• Filed: 10/08/1999
• Issued: 01/06/2004
• Est. Priority Date: 04/26/1999
• Status: Expired due to Fees

• Current Assignee: Aerovironment
• Original Assignee: Aerovironment
• Inventors: Rippel, Wally E., Buchanan, Darrell
• Primary Examiner(s): Wille, Douglas A.
• Application Number:
  US09/416,209
• Time in Patent Office: 1,551 Days
• Field of Search: 257/713, 361/696, 361/701, 361/679, 361/688, 361/689, 361/690
• US Class Current: 257/713
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A means is discussed for electrically interconnecting, cooling and mechanically supporting a multiplicity of heat producing electronic and/or electrical components which is amenable to automated assembly. A structure is identified which consists of one or more fluid-cooled heatsinks; which are in proximate contact with heat producing components and one or more U-shaped spring clips which mechanically force thermal contact between the heat producing components and heatsinks. In turn, each heatsink contains two fluid-filled cavities separated by a common wall, wherein fluid in the first cavity flows in one direction, while fluid in the second cavity flows in the reverse direction. The components are powered by a bus that compensates for the location of the components, providing an equal voltage drop between a power source and each component. The bus is a flat plate that has been stamped to include slots that increase the voltage drop between selected portions of the bus.

Claims

1. An apparatus for electrically interconnecting, thermally cooling and mechanically supporting a plurality of electrical components that require cooling, comprising:

a circuit board mounting the plurality of components, wherein the circuit board is in electrical communication with each component; and

a fluid-cooled heatsink in thermal communication with the plurality of components;

wherein the plurality of electrical components that require cooling, and all other components on the circuit board, are on the same side of the circuit board so as to allow wave soldering of the circuit board;

wherein the heatsink defines a first fluid-filled cavity and a second fluid-filled cavity that are separated by a common wall;

wherein the heatsink is configured such that fluids in the second cavity flow in a direction along the common wall that is opposite of the direction of fluids flowing in the first cavity; and

wherein the heatsink is configured such that each of the plurality of electrical components can be located along ends of the wall.

2. The apparatus of claim 1, and further comprising a power bus extending to the circuit board at a plurality of locations, wherein the power bus is on the same side of the circuit board as the plurality of electrical components that require cooling.

3. The apparatus of claim 2, wherein:

the power bus comprises a plate composed of an electrically conductive material characterized by electrical resistance;

the plate defines a primary terminal configured to attach to a power source;

the plate defines a plurality of connecting terminals, each connecting terminal being spaced from the primary terminal so as to connect to the plurality of locations on the circuit board; and

the plate is configured to provide electrical resistance levels between the primary terminal and each connecting terminal having a prescribed relationship.

4. The apparatus of claim 3, wherein the plate is configured to provide equal voltage drops between the primary terminal and each connecting terminal.

5. A semiconductor power processing device, comprising:

a plurality of power semiconductor devices;

a circuit board mounting the plurality of devices, wherein the circuit board is in electrical communication with each of the plurality of device, and wherein the plurality of devices forming two rows of devices extending away from the circuit board in a direction normal to a surface of the circuit board; and

a fluid-cooled heatsink in thermal communication with each of the plurality of devices, the heatsink extending between the two rows of devices and contacting the plurality of devices on heatsink surfaces normal to the surface of the circuit board; and

a cooling fluid flowing through the heatsink;

wherein the plurality of electrical devices that require cooling, and all other components on the circuit board, are on the same side of the circuit board so as to allow wave soldering of the circuit board.

6. The device of claim 5, and further comprising additional components on the circuit board, the additional components having no direct thermal contact with the heatsink.

7. The device of claim 5, wherein the circuit board is composed of an insulating sheet and a single layer of copper foil pattern that is bonded to a face of the insulating sheet.

8. The device of claim 5, wherein the circuit board is composed of an insulating sheet and two layers of copper foil pattern that are bonded to opposite faces of the insulating sheet.

9. The device of claim 5, wherein the circuit board is composed of at least two insulating sheets interspaced with at least three layers of copper foil pattern.

10. The device of claim 5, wherein the cooling fluid is a water-based fluid.

11. The device of claim 5, wherein the cooling fluid is an oil.

12. The device of claim 5, wherein the fluid filled heatsink is partially evacuated, and wherein the cooling fluid boils at temperature lower than the temperature of the plurality of power semiconductor devices when they are in normal operation.

13. The device of claim 5, wherein the circuit board foil patterns and the plurality of power semiconductor devices are configured to effect switch-mode power conversion.

14. The device of claim 5, wherein the circuit board foil patterns and the plurality of power semiconductor devices are configured such that the power devices operate in a linear range.

15. The device of claim 5, wherein:

the heatsink includes a fluid inlet at one longitudinal end of the heatsink;

the heatsink includes a fluid outlet at the opposite end of the said heatsink; and

the heatsink defines a cavity placing the inlet in fluid communication with the outlet.

16. The device of claim 5, and further comprising a power bus extending to the circuit board at a plurality of locations, the power bus comprising a plate composed of an electrically conductive material characterized by electrical resistance, wherein the plate defines a primary terminal configured to attach to a power source, and the plate defines a plurality of connecting terminals, each connecting terminal being spaced from the primary terminal so as to connect to the plurality of locations on the circuit board, and wherein the plate is configured to provide electrical resistance levels between the primary terminal and each connecting terminal having a prescribed relationship such that the plate is configured to provide equal voltage drops between the primary terminal and each connecting terminal.