Interferometric modulation of radiation

• US 6,674,562 B1
• Filed: 04/08/1998
• Issued: 01/06/2004
• Est. Priority Date: 05/05/1994
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Iridigm Display Corporation (Qualcomm, Inc.)
• Inventors: Miles, Mark W.
• Primary Examiner(s): LESTER, EVELYN A
• Application Number:
  US09/056,975
• Time in Patent Office: 2,099 Days
• Field of Search: 359/290, 359/291, 359/295, 359/247, 359/248, 359/263, 359/298, 216/2, 216/24, 216/72, 216/74, 216/79, 216/80, 216/58, 216/60, 216/61, 216/76, 216/69, 438/739
• US Class Current: 359/291
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G01J 3/26 using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 26/02 for controlling the intensity of light G02B26/004 takes precedence
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 26/085 the reflecting means being moved or deformed by electromagnetic means
• CPC Class Codes: G02B 26/0858 the reflecting means being moved or deformed by piezoelectric means
• CPC Class Codes: G02B 27/01 Head-up displays
• CPC Class Codes: G02B 27/017 Head mounted
• CPC Class Codes: G02B 6/12 of the integrated circuit kind electric integrated circuits H01L27/00
• CPC Class Codes: G02F 1/13725 based on guest-host interaction G02F1/13762, G02F1/13737, take precedence
• CPC Class Codes: G02F 1/169 based on orientable non-spherical particles having a common optical characteristic, e.g. suspended particles of reflective metal flakes
• CPC Class Codes: G02F 1/216 using liquid crystals, e.g. liquid crystal Fabry-Perot filters
• CPC Class Codes: G02F 2203/03 scattering
• CPC Class Codes: G06F 3/1431 using a single graphics controller
• CPC Class Codes: G06F 3/1446 display composed of modules, e.g. video walls
• CPC Class Codes: G06F 3/147 using display panels
• CPC Class Codes: G09G 2300/0408 Integration of the drivers onto the display substrate
• CPC Class Codes: G09G 2300/0452 : Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
• CPC Class Codes: G09G 3/001 : using specific devices not provided for in groups G09G3/02 - G09G3/36, e.g. using an intermediate record carrier such as a film slide; Projection systems; Display of non-alphanumerical information, solely or in combination with alphanumerical information, e.g. digital display on projected diapositive as background slide projectors per se G03B23/00 = 42 HP
• CPC Class Codes: G09G 3/2014 : by modulation of the duration of a single pulse during which the logic level remains constant
• CPC Class Codes: G09G 3/2074 : using sub-pixels
• CPC Class Codes: G09G 3/2077 : by a combination of two or more gradation control methods
• CPC Class Codes: G09G 3/3466 : based on interferometric effect
• CPC Class Codes: G09G 5/02 : characterised by the way in which colour is displayed details of colour display specific for CRTs G09G1/28; specific for flat matrix panels other than liquid crystal displays G09G3/2003; specific for liquid crystal displays G09G3/3607
• CPC Class Codes: H01Q 9/26 : with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength resonant loop antennas H01Q7/00

Abstract

Improvements in an interferometric modulator that has a cavity defined by two walls.

Claims

1. A method of making arrays of microelectromechanical structure on a production line comprising

forming electronic features on a surface of a glass or plastic substrate that is at least as large as 14″

×

16″

, and

micromachining electromechanical structures on the substrate.

2. The method of claim 1 in which the microelectromechanical structure comprises interference modulators.

3. The method of claim 1 in which steps of forming the electronic features are overlapping with steps of micromachining the structures.

4. The method of claim 1 in which steps of forming the electronic features are non-overlapping with steps of micromachining the structures.

5. The method of claim 1, further comprising depositing a sacrificial layer to space components of the microelectromechanical structure;

and using a gas phase etchant to remove the sacrificial layer without the use of a plasma to activate the etch process.

6. The method of claim 1, wherein the sacrificial layer is selected from the group comprising molybdenum, silicon, and tungsten.

7. The method of claim 1, wherein the gas phase echant is selected from the group comprising XeF2, BrF3, ClF3, BrF5, and IF5.

8. A microelectromechanical systems device comprising:

a substrate; and

an array of microelectromechanical structures formed on the substrate, wherein the array is at least as large as 14″

×

16″

.

9. The microelectromechanical device of claim 8, wherein the microelectromechanical structures comprise interference modulators.

10. The microelectromechanical systems device of claim 8, further comprising a backplane to cover the array of microelectromechanical structures, wherein edges of the backplane and the substrate form a seal.