Confocal microscopic device
First Claim
1. An automatic inspection process for determining deviations of at least a first height profile from at least one simultaneously or previously detected second height profile, for detecting and/or monitoring defects in semiconductor wafers utilizing a confocal microscope comprising:
- an illumination arrangement for illuminating an object in a confocal raster pattern;
first means for generating a first wavelength-selective splitting of the illumination light;
second means for generating a second wavelength-selective splitting of the light coming from the object in a simultaneous manner for a plurality of points at varying heights of the object, the light coming from the object containing spectrally coded height information for the plurality of points of the object; and
detection means for detecting the light distribution generated by the second means, said process including the steps of;
illuminating a first object in a wavelength-selective manner by the illumination arrangement; and
detecting the light originating from the first object with an array of detectors and comparing detected light electronically with a previously or simultaneously detected second object.
1 Assignment
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Accused Products
Abstract
An autofocus for a confocal microscope is realized by means of a confocal microscope arrangement comprising an illumination arrangement for illuminating an object in a raster pattern, first means for generating a first wavelength-selective splitting of the illumination light and second means for generating a second wavelength-selective splitting of the light coming from the object in a parallel manner for a plurality of points of the object, and detection means for detecting the light distribution generated by the second means, wherein an at least point-by-point spectral splitting and detection of an object image in a wavelength-selective manner is carried out and a control signal is generated from the determination of the frequency deviation and/or intensity deviation from a predetermined reference value corresponding to the object position in order to adjust the focal position by means of the vertical object position and/or the imaging system of the microscope. Further, a process is realized for determining deviations of at least a first height profile from at least one simultaneously or previously detected second height profile, preferably for detecting and/or monitoring defects in semiconductor structures, wherein a first object is illuminated in a wavelength-selective manner by a light source and the light originating from the first object is detected and is compared electronically with a previously or simultaneously detected second object.
90 Citations
12 Claims
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1. An automatic inspection process for determining deviations of at least a first height profile from at least one simultaneously or previously detected second height profile, for detecting and/or monitoring defects in semiconductor wafers utilizing a confocal microscope comprising:
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an illumination arrangement for illuminating an object in a confocal raster pattern;
first means for generating a first wavelength-selective splitting of the illumination light;
second means for generating a second wavelength-selective splitting of the light coming from the object in a simultaneous manner for a plurality of points at varying heights of the object, the light coming from the object containing spectrally coded height information for the plurality of points of the object; and
detection means for detecting the light distribution generated by the second means, said process including the steps of;
illuminating a first object in a wavelength-selective manner by the illumination arrangement; and
detecting the light originating from the first object with an array of detectors and comparing detected light electronically with a previously or simultaneously detected second object. - View Dependent Claims (2, 3, 4, 5)
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6. A method of determining a height deviation of a first semiconductor object in a wafer from a reference semiconductor object in a wafer utilizing a confocal microscope, the method comprising:
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simultaneously illuminating with light from a light source a plurality of points at varying heights of a first semiconductor object in a wavelength selective manner using a confocal microscope;
simultaneously receiving the light coming from the plurality of points of the first object, the received light containing spectrally coded height information for the plurality of points of the first object; and
comparing the light distribution from the received light with the light distribution of a reference semiconductor object to determine a height deviation of the first object from the reference object. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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Specification