Method of producing high-frequency modules
First Claim
1. A method of producing high-frequency modules comprising:
- a first step of fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates formed of substantially a rectangular shape and having an identical pattern of circuit developed thereon, providing on each of two side edges of the sub substrates, a set of signal terminals connected to a first circuit so that the set of signal terminals at each of the two side edges is formed integral with a set of signal terminals provided on a side edge of an adjacent sub substrate and is connected to a second circuit, and electrically isolating any two adjacent sub substrates from each other at their longitudinal end edges;
a second step of, after said first step, mounting electronic components on each of the sub substrates;
a third step of, after said second step, electrically isolating the signal terminals at each of the two side edges of the sub substrates from the signal terminals provided on the side edge of the adjacent sub substrate while the connector regions of the master substrate remain linked to the sub substrates;
a fourth step of, after said third step, conducting an inspection with pins of an inspection tooling engaged in direct contact with the signal terminals of the sub substrates; and
a fifth step of, after said fourth step, separating the sub substrates from the master substrate by cutting along the longitudinal end edges of each of the sub substrates.
1 Assignment
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Accused Products
Abstract
A method of producing high-frequency modules at a higher efficiency is provided comprising: an electronic components mounting step 62 of fabricating on a master substrate 21 rows of sub substrates 22, each the sub substrate 22 having an identical pattern of circuit developed thereon, and mounting electronic components on the sub substrate 22; a step 64 of, after the step 62, providing slits for electrically isolating signal terminals formed integrally; a laser trimming step 66 of, after the step 64, engaging pins 39 of an inspection tooling in direct contact with the signal terminals to conduct an inspection; and a separating step 72 of, after the step 66, separating the sub substrates 22 from the master substrate 21. Accordingly, the productivity for the high-frequency modules will be improved.
57 Citations
37 Claims
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1. A method of producing high-frequency modules comprising:
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a first step of fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates formed of substantially a rectangular shape and having an identical pattern of circuit developed thereon, providing on each of two side edges of the sub substrates, a set of signal terminals connected to a first circuit so that the set of signal terminals at each of the two side edges is formed integral with a set of signal terminals provided on a side edge of an adjacent sub substrate and is connected to a second circuit, and electrically isolating any two adjacent sub substrates from each other at their longitudinal end edges;
a second step of, after said first step, mounting electronic components on each of the sub substrates;
a third step of, after said second step, electrically isolating the signal terminals at each of the two side edges of the sub substrates from the signal terminals provided on the side edge of the adjacent sub substrate while the connector regions of the master substrate remain linked to the sub substrates;
a fourth step of, after said third step, conducting an inspection with pins of an inspection tooling engaged in direct contact with the signal terminals of the sub substrates; and
a fifth step of, after said fourth step, separating the sub substrates from the master substrate by cutting along the longitudinal end edges of each of the sub substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of producing high-frequency modules comprising:
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a first step of fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates formed of substantially a rectangular shape and having an identical pattern of circuit developed thereon, and mounting electronic components on each of the sub substrates;
a second step of, after said first step, covering each of the sub substrates with a metal shielding case while the sub substrates are in a worksheet form; and
a third step of, after said second step, separating the sub substrates from the master substrate by cutting along side edges of the sub substrates.
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16. A method for producing high-frequency modules, said method comprising:
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fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, wherein each of the sub substrates has an identical pattern of circuit developed thereon, provided on each of two side edges of the sub substrates is a set of signal terminals connected to a first circuit so that the set of signal terminals at each of the two side edges is formed integral with a set of signal terminals provided on a side edge of an adjacent sub substrate and is connected to a second circuit, and any two adjacent sub substrates are electrically isolated from each other at their longitudinal end edges;
mounting electronic components on each of the sub substrates;
electrically isolating the signal terminals at each of the two side edges of the sub substrates from the signal terminals provided on the side edge of the adjacent sub substrate while the connector regions of the master substrate remain linked to the sub substrates;
conducting an inspection with pins of an inspection tool engaged in direct contact with the signal terminals of the sub substrates; and
separating the sub substrates from the master substrate by cutting along the longitudinal end edges of each of the sub substrates. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method for producing high-frequency modules, said method comprising:
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fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates provided to have an identical pattern of circuit developed thereon, and mounting electronic components on each of the sub substrates;
covering each of the sub substrates having electronic components mounted thereon with a metal shielding case while the sub substrates are in a worksheet form; and
separating the sub substrates from the master substrate, after said covering, by cutting along the side edges of the sub substrates. - View Dependent Claims (27)
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28. A method for producing high-frequency modules, said method comprising:
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fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates provided to have an identical pattern of circuit developed thereon, and mounting electronic components on each of the sub substrates;
covering each of the sub substrates having electronic components mounted thereon with a metal shielding case; and
marking on a top side of the metal shielding case of each of the sub substrates;
separating the sub substrates from the master substrate, after said marking, by cutting along the side edges of the sub substrates.
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29. A method of producing high-frequency modules comprising:
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a first step of fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates formed of substantially a rectangular shape and having an identical pattern of circuit developed thereon, and mounting electronic components on each of the sub substrates;
a second step of, after said first step, covering each of the sub substrates with a metal shielding case; and
a third step of, after said second step, separating the sub substrates from the master substrate by cutting along side edges of the sub substrates;
wherein the metal shielding case is fabricated by bending a metal sheet to form legs, and ground terminals are provided on the side edges of the sub substrates; and
wherein a burr is created on an edge of the metal sheet during the fabrication of the shielding case and the burr generates a gap between an edge of each grounding terminal and the corresponding leg. - View Dependent Claims (30, 31, 32, 33, 34)
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35. A method for producing high-frequency modules, said method comprising:
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fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates provided to have an identical pattern of circuit developed thereon, and mounting electronic components on each of the sub substrates;
covering each of the sub substrates having electronic components mounted thereon with a metal shielding case; and
separating the sub substrates from the master substrate, after said covering, by cutting along the side edges of the sub substrates;
wherein the metal shielding case is fabricated by bending a metal sheet to form legs, and ground terminals are provided on the side edges of the sub substrates; and
wherein a burr is created on an edge of the metal sheet during the fabrication of the shielding case and the burr generates a gap between an edge of each grounding terminal and the corresponding leg.
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36. A method of producing high-frequency modules comprising:
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a first step of fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates formed of substantially a rectangular shape and having an identical pattern of circuit developed thereon, and mounting electronic components on each of the sub substrates;
a second step of, after said first step, covering each of the sub substrates with a metal shielding case;
a third step of engaging pins of an inspection tool in direct contact with signal terminals of the sub substrates to conduct an inspection such that grounding pins of the engaging pins come into contact the earliest with, and depart at the latest from, the signal terminals; and
a fourth step of, after said second step, separating the sub substrates from the master substrate by cutting along side edges of the sub substrates.
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37. A method for producing high-frequency modules, said method comprising:
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fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each of the sub substrates provided to have an identical pattern of circuit developed thereon, and mounting electronic components on each of the sub substrates;
covering each of the sub substrates having electronic components mounted thereon with a metal shielding case;
engaging pins of an inspection tool in direct contact with signal terminals of the sub substrates to conduct an inspection such that grounding pins of the engaging pins come into contact the earliest with, and depart at the latest from, the signal terminals; and
separating the sub substrates from the master substrate, after said covering, by cutting along the side edges of the sub substrates.
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Specification