Multi-layered micro-channel heat sink, devices and systems incorporating same

• US 6,675,875 B1
• Filed: 02/19/2002
• Issued: 01/13/2004
• Est. Priority Date: 08/06/1999
• Status: Expired due to Fees

• Current Assignee: Ohio State University
• Original Assignee: Ohio State University
• Inventors: Vafai, Kambiz, Zhu, Lu
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): DUONG, THO V
• Application Number:
  US10/078,627
• Time in Patent Office: 693 Days
• Field of Search: 165/80.4, 165/168, 165/80.3, 165/185, 165/104.33, 361/699, 174/15.1
• US Class Current: 165/80.4
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20381 Thermal management, e.g. evaporation control

Abstract

The present invention includes multi-layer micro-channeled heat sinks, multi-layer micro-channeled heat sink devices, and multi-layer micro-channeled heat sink systems. The invention also includes machines or electronic devices using these aspects of the invention. The present invention also includes an electronic device with multi-layered micro-channeled heat sink. The invention utilizes the multi-directional flow of coolant through the individual heat sink layers so as to minimize heat gradients. The present invention is also capable of reducing the undesirable temperature variation in the streamwise direction for the micro-channel heat sink instead of increasing the pressure drop.

Claims

1. A multi-layer micro-channel heat sink for use with a heat generating surface, said micro-channel heat sink comprising:

at least three layers, each said layer adjacent to and in thermal communication with at least one other said layer, wherein one said layer is adjacent to and in thermal communication with said heat generating surface, each said layer comprising an input, an output and at least one micro-channel for transporting a coolant from said input to said output of a respective layer, wherein each said layer is configured such that coolant flowing through said layer flows in a different direction than coolant flowing through an adjacent layer;

a flow splitter, said flow splitter in fluid communication with each said input, said flow splitter adapted to receive a common flow of coolant and to deliver coolant to each said input;

a flow combiner, said flow combiner in fluid communication with each said output, said flow combiner adapted to receive coolant from each said output and combine said received coolant into a common flow of coolant; and

a coolant circulating device for supplying said flow splitter with a common flow of coolant and for receiving said common flow of coolant from said flow combiner so as to circulate coolant across each said layer of said plurality of layers.

2. A multi-layer micro-channel heat sink according to claim 1 further comprising a cooling device attached to said coolant circulating device whereby excess heat is removed from said coolant.

3. A multi-layer micro-channel heat sink according to claim 1 further comprising a heat exchanging device attached to said coolant circulating device whereby excess heat is removed from said coolant.

4. A multi-layer micro-channel heat sink according to claim 1 further comprising a coolant filter attached to said coolant circulating device whereby impurities may be removed from said coolant.

5. A multi-layer micro-channel heat sink according to claim 1 further comprising a coolant reservoir in fluid communication with said coolant circulating device whereby coolant can be stored for later use in said multi-layer micro-channel heat sink.

6. A multi-layer micro-channel heat sink according to claim 1 wherein said multi-layer micro-channel heat sink is constructed from silicon.

7. A multi-layer micro-channel heat sink according to claim 1 wherein said micro-channels individually comprise dimensions less than one-sixteenth of an inch in width and height and proportional to said heat generating surface in length.

8. An electronic device with multi-layer micro-channel heat sink, said electronic device comprising:

electronic circuitry capable of generating heat;

at least three layers, each said layer adjacent to and in thermal communication with at least one other said layer, wherein one said layer is adjacent to and in thermal communication with said electronic circuitry, each said layer comprising an input, an output and at least one micro-channel for transporting a coolant from said input to said output of a respective layer, wherein each said layer is configured such that coolant flowing through said layer flows in a different direction than coolant flowing through an adjacent layer;

a flow splitter, said flow splitter in fluid communication with each said input, said flow splitter adapted to receive a common flow of coolant and to deliver coolant to each said input;

a flow combiner, said flow combiner in fluid communication with each said output, said flow combiner adapted to receive coolant from each said output and combine said received coolant into a common flow of coolant; and

a coolant circulating device for supplying said flow splitter with a common flow of coolant and for receiving said common flow of coolant from said flow combiner so as to circulate coolant across each said layer of said plurality of layers.

9. An electronic device according to claim 8 further comprising a cooling device attached to said coolant circulating device whereby excess heat is removed form said coolant.

10. An electronic device according to claim 8 further comprising a heat exchanging device attached to said coolant circulating device whereby excess heat is removed by said coolant.

11. An electronic device according to claim 8 further comprising a coolant filter attached to said coolant circulating device whereby impurities may be removed from said coolant.

12. An electronic device according to claim 8 further comprising a coolant reservoir attached to said coolant circulating device whereby coolant can be stored for later use in said multi-layer micro-channel heat sink.

13. An electronic device according to claim 8 wherein said multi-layer micro-channel heat sink comprises a heat-conducting material.

14. An electronic device according to claim 13 wherein said heat-conducting material is silicon.

15. An electronic device according to claim 8 wherein said micro-channels individually comprise dimensions less than one-sixteenth of an inch in width and height and proportional to said electronic circuitry in length.