Etch resist using printer technology

• US 6,676,991 B2
• Filed: 10/29/2001
• Issued: 01/13/2004
• Est. Priority Date: 10/29/2001
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: DeHaven, Maxwell S.
• Primary Examiner(s): Hirshfeld, Andrew H.
• Assistant Examiner(s): EVANS, ANDREA HENCE
• Application Number:
  US10/040,086
• Publication Number:
  US 20030079624A1
• Time in Patent Office: 806 Days
• Field of Search: 216/13, 216/41, 427/96, 427/98, 427/282, 101/170, 101/483, 101/163
• US Class Current: 427/96.2
• CPC Class Codes: B41J 3/407 for marking on special material
• CPC Class Codes: H05K 2203/0537 Transfer of pre-fabricated insulating pattern
• CPC Class Codes: H05K 2203/073 Displacement plating, substitution plating or immersion plating, e.g. for finish plating
• CPC Class Codes: H05K 2203/0786 Using an aqueous solution, e.g. for cleaning or during drilling of holes
• CPC Class Codes: H05K 3/0079 characterised by the method of application or removal of the mask H05K3/0091 takes precedence
• CPC Class Codes: H05K 3/062 consisting of metals or alloys or metallic inorganic compounds H05K3/065 takes precedence
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241

Abstract

The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad substrate into the printer, printing an inverse circuit image on the copper-clad substrate, allowing the inverse circuit image to dry, metalizing the copper-clad substrate to adhere a resist mask to exposed, uninked copper to form a metalized circuit image, and etching the copper-clad substrate that has been metalized to remove copper that forms the inverse circuit image.

Claims

1. An inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate, comprising the steps of:

feeding a copper-clad substrate into the printer;

printing an inverse circuit image on the copper-clad substrate;

allowing the inverse circuit image to dry;

immersing the copper-clad substrate in a tinning solution to adhere a resist mask to exposed, uninked copper to form a tinned circuit image; and

etching the copper-clad substrate to remove copper forming the inverse circuit image.

2. The method of claim 1 wherein the printer utilizes water-insoluble ink.

3. The method of claim 1 wherein the printer utilizes India ink.

4. The method of claim 1 wherein an input path for the printer is adjustable to include at least two settings:

a first setting to feed paper through a printing process and a second setting to accommodate a copper-clad substrate having a predetermined size.

5. The method of claim 4 wherein the second setting for the input path for the printer to accommodate a copper-clad substrate is further adjustable to accommodate a plurality of sizes of copper-clad substrates.

6. An inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate, comprising the steps of:

feeding a copper-clad substrate into the printer;

printing an inverse circuit image on the copper-clad substrate;

allowing the inverse circuit image to dry;

metalizing the copper-clad substrate to adhere a resist mask to exposed, uninked copper to form a metalized circuit image; and

etching the copper-clad substrate that has been metalized to remove copper that forms the inverse circuit image.

7. The method of claim 6 wherein the printer utilizes water-insoluble ink.

8. The method of claim 6 wherein the printer utilizes India ink.

9. The method of claim 6 wherein an input path for the printer is adjustable to include at least two settings:

a first setting to feed paper through a printing process and a second setting to accommodate a copper-clad substrate having a predetermined size.

10. The method of claim 9 wherein the at least two settings for the input path for the printer include settings to accommodate a plurality of sizes of copper-clad substrates.

11. The method of claim 6 wherein the step of metalizing the copper-clad substrate to adhere a resist mask to exposed, uninked copper includes coating the exposed, uninked copper with at least one of:

manganese, chromium, aluminum, iron, cobalt, nickel, tin, zinc, cadmium, palladium, and lead.

12. The method of claim 6 wherein the step of metalizing the copper-clad substrate to adhere a resist mask to exposed, uninked copper includes coating the exposed, uninked copper with an alloy of at least one of:

manganese, chromium, aluminum, iron, cobalt, tin, zinc, nickel, cadmium, palladium, and lead.

13. The method of claim 6 wherein the step of metalizing the copper-clad substrate to adhere a resist mask to exposed, uninked copper includes coating the exposed, uninked copper by one of:

soldering, electro-plating and electroless plating.