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Semiconductor laser apparatus and method of producing the same

  • US 6,677,184 B2
  • Filed: 11/15/2002
  • Issued: 01/13/2004
  • Est. Priority Date: 02/07/2000
  • Status: Expired due to Fees
First Claim
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1. A method of producing a semiconductor laser apparatus, comprising the steps of:

  • applying a conductive die-bonding paste to a bonding surface in a predetermined position thereof;

    preheating the applied conductive die-bonding paste and then placing a semiconductor laser chip on the preheated conductive die-bonding paste; and

    heating the preheated conductive die-bonding paste to a temperature higher than a temperature at which the conductive die-bonding paste starts a thermosetting reaction to thereby harden the conductive die-bonding paste.

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