System and methods for fabrication of a thin film pattern

• US 6,677,238 B2
• Filed: 04/30/2003
• Issued: 01/13/2004
• Est. Priority Date: 03/31/2000
• Status: Active Grant

• Current Assignee: Intellectual Keystone Technology LLC
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Seki, Shunichi
• Primary Examiner(s): LEBENTRITT, MICHAEL
• Application Number:
  US10/425,622
• Publication Number:
  US 20030199162A1
• Time in Patent Office: 258 Days
• Field of Search: 438/687, 438/780, 438/681, 438/722, 438/737, 438/975, 438/976, 438/723, 438/778, 438/761, 438/255, 438/240, 438/680, 438/635
• US Class Current: 438/681
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane

Abstract

The present invention provides a method for fabricating a thin film pattern including forming a pattern made of an organic molecule film on a substrate. The method further includes supplying a solution for forming a thin film onto the organic molecule film pattern, and selectively forming the thin film on the organic molecule film pattern.

Claims

1. A microstructure, comprising:

a substrate;

an organic molecule film pattern formed on said substrate; and

a thin film pattern having a pattern based on said organic molecule film pattern.

2. The structure according to claim 1, wherein said thin film is made of a metal thin film.

3. The structure according to claim 1, wherein said organic molecule film pattern includes a film portion of a thiol-based coupling agent and a thin film portion of said thin film pattern on the film portion of the thiol-based coupling agent.

4. The structure according to claim 1, wherein said organic molecule film pattern is made of a film portion of a thiol-based coupling agent and a film portion having a fluoro group, and includes a thin film portion of said thin film pattern on the film portion of the thiol-based coupling agent.

5. An electronic device, comprising:

a substrate;

an organic molecule film pattern formed on said substrate; and

a thin film pattern having a pattern based on said organic molecule film pattern.

6. The electronic device according to claim 5, wherein said thin film is made of a metal thin film.

7. The electronic device according to claim 5, wherein said organic molecule film pattern includes a film portion of a thiol-based coupling agent and a thin film portion of said thin film pattern on the film portion of the thiol-based coupling agent.

8. The electronic device according to claim 5, wherein said organic molecule film pattern is made of a film portion of a thiol-based coupling agent and a film portion having a fluoro group, and includes a thin film portion of said thin film pattern on the film portion of the thiol-based coupling agent.