Microelectronic devices and microelectronic die packages

• US 6,677,675 B2
• Filed: 09/19/2001
• Issued: 01/13/2004
• Est. Priority Date: 06/16/2000
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Bolken, Todd O.
• Primary Examiner(s): Coleman, W. David
• Assistant Examiner(s): Kebede, Brook
• Application Number:
  US09/955,612
• Publication Number:
  US 20020050654A1
• Time in Patent Office: 846 Days
• Field of Search: 257/701, 257/702, 257/719, 257/776, 257/787, 257/792, 257/793, 257/725, 257/726, 257/727, 257/731, 257/730, 438/112, 438/118, 438/123, 438/124-127
• US Class Current: 257/730
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/4951 Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed toward packaging a microelectronic die that is attached to either a first surface or a second surface of a substrate. The die can be encapsulated by positioning the die in a cavity of a substrate and sealing the substrate to the substrate. The method can further include injecting an encapsulation compound into the cavity at a first end of the substrate to move along the first surface of the substrate. This portion of the compound defines a first flow of compound along the first surface that moves in a first direction from a first end of the substrate toward a second end of the substrate. Several embodiments of the method also include driving a portion of the compound through the substrate at a pass-through location or a secondary gate that is spaced apart from the first end of the substrate to generate a second flow of compound along the second surface of the substrate. The second flow of compound moves in a second direction toward the first end of the substrate. As the first and second flows of compound move through the mold, the method includes inhibiting a third flow of compound from moving in the first direction along the second surface of the substrate between the first end of the substrate and the pass-through location.

Claims

1. A microelectronic device, comprising:

a substrate having a first surface, a second surface, and plurality of ball-pads on the second surface;

a microelectronic die having a first side attached to the first surface of the substrate, a second side, a plurality of contacts on the first side, and an integrated circuit coupled to the contacts;

a plurality of connectors coupling the contacts of the die to the ball-pads of the substrate;

a first casing covering the second side of the die and a portion of the first surface of the substrate, the first casing having a first end, a second end, a first gate section at the first end, and a second gate section at the first end, the first and second gate sections being spaced apart from one another along the first end of the first casing; and

a second casing covering the contacts on the first side of the die and the connectors.

2. The microelectronic device of claim 1 wherein:

the substrate further comprises a slot, a plurality of terminal pads adjacent to the slot, and traces coupling the terminal pads to corresponding ball pads;

the contacts on the first side of the die are aligned with the slot;

the connectors extend from the contacts to the terminal pads through a portion of the slot; and

the second casing fills the slot and covers the terminal pads.

5. The microelectronic device of claim 1 wherein the first and second casings are connected at an aperture extending through the substrate.

6. The microelectronic device of claim 1 wherein the first and second casings are connected at an aperture extending through the substrate, the aperture being offset from the microelectronic die.

7. The microelectronic device of claim 1 wherein the substrate further comprises a slot and an aperture, wherein the microelectronic die is attached to the substrate adjacent to the slot, and wherein the first and second casings are connected at the aperture.

8. The microelectronic device of claim 1 wherein the substrate includes a first end and a second end, wherein the first and second gate sections are positioned at least proximate to the first end of the substrate, and wherein the first and second casings are connected at a secondary gate positioned at least proximate to the second end of the substrate.

3. A microelectronic device, comprising:

a substrate having a first surface, a second surface, a slot between the first and second surfaces, a plurality of ball-pads on the second surface, and a plurality of traces coupled to the ball-pads and having terminals proximate to the slot;

a microelectronic die having a first side attached to the first surface of the substrate, a second side, a plurality of contacts on the first side aligned with the slot in the substrate, and an integrated circuit coupled to the contacts;

a plurality of connectors in the slot of the substrate coupling the contacts of the die to the terminals of the traces of the substrate;

a first casing covering the second side of the die and a portion of the first surface of the substrate, the first casing having a first end, a second end, a first gate section at the first end, and a second gate section at the first end, the first and second gate sections be spaced apart from one another along the first end of the first casing; and

a second casing in the slot covering the contacts on the first side of the die, the connectors, and the terminals of the traces of the substrate.

4. The microelectronic device of claim 3 wherein the substrate includes a first end and a second end, and wherein the first and second casings are connected at a secondary gate between the slot and the second end of the substrate.

9. The microelectronic device of claim 3 wherein the first and second gate sections of the first casing are bifurcated portions of a single mold compound flow.

10. The microelectronic device of claim 3 wherein the substrate further includes an aperture offset from the slot, and wherein the first and second casings are connected at the aperture.

11. The microelectronic device of claim 3 wherein the slot includes a first end and a second end, wherein the first and second gate sections of the first casing are positioned toward the first end of the slot, wherein the substrate further includes an aperture positioned toward the second end of the slot, and wherein the first and second casings are connected at the aperture.