Side-emitting surface mounted light emitting diode

• US 6,677,707 B1
• Filed: 07/08/2000
• Issued: 01/13/2004
• Est. Priority Date: 11/19/1999
• Status: Expired due to Fees

• Current Assignee: Measurement Specialties Incorporated (TE Connectivity Limited)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Dietiker, Thomas
• Primary Examiner(s): Patel, Nimeshkumar D.
• Assistant Examiner(s): Guharay, Karabi
• Application Number:
  US09/612,163
• Time in Patent Office: 1,284 Days
• Field of Search: 313/498, 313/512, 313/499, 313/503, 257/79, 257/99, 445/22, 362/545, 362/296, 362/255, 362/257, 362/249, 362/800
• US Class Current: 313/498
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10462 Flat component oriented parallel to the PCB surface
• CPC Class Codes: H05K 2201/10651 Component having two leads, e.g. resistor, capacitor
• CPC Class Codes: H05K 2201/10787 Leads having protrusions, e.g. for retention or insert stop
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A unique side mounted LED and side sensing photo-transistor with free-end contacts, useful for thin profile side and back lighting and low-profile touch screen photo-circuits, and a method of manufacturing the side mounted side emitting or sensing photo circuit components.

Claims

1. A surface mounted light emitting diode comprising:

a metallic alloy base anode conductivity bonded to a semi-conductor and a metallic alloy base cathode, forming a light emitting means;

an encapsulation substrate molded around said metallic alloy anode and cathode with generally parallel flat top and bottom surfaces and an optical element;

a pair of conductive leads attached to, or formed as part of, the light emitting means, each conductive lead extending from a side of the encapsulation substrate with a free-end remote from the encapsulation substrate; and

,

extended ends formed at each free-end of a diameter substantially equal to the distance between the flat top and bottom surfaces.

2. The surface mounted light emitting diode of claim 1, wherein the optical element is formed on the top surface.

3. The surface mounted light emitting diode of claim 1, wherein the optical element is roughly parallel to the top and bottom surfaces.

4. The surface mounted light emitting diode of claim 1, wherein the conductive leads form mirror image shapes whereby the surface mounted light emitting diode can mount parallel to the circuit board top side up or top side down.

5. The surface mounted light emitting diode of claim 4, wherein the flat top and bottom surfaces have no gate marks or flashings.

6. The surface mounted light emitting diode of claim 1, wherein the optical element is formed in a shape to distribute the light emitted by the light emitting means at a fan angle between 5 and 90 degrees.

7. The surface mounted light emitting diode of claim 1, wherein the optical element is formed in a shape to distribute the light emitted by the light emitting means substantially oval in the narrowest axis between 5 and 90 degrees.

8. The surface mounted light emitting diode of claim 1, wherein the optical element is formed in a shape to distribute the light emitted by said light emitting means substantially circular at a fan angle between 12 and 90 degrees.

9. The surface mounted light emitting diode of claim 1, wherein the light emitting means and the encapsulation substrate in combination emit a light between 360-2200 nms.

10. The surface mounted light emitting diode of claim 1, wherein said metallic base anode further comprises:

an etched reflective seat formed therein; and

,

the semi-conductor is conductively bonded to the metallic alloy base anode within the etched reflective seat.

11. The surface mounted light emitting diode of claim 1, wherein the metallic alloy anode and cathode are formed of ALLOY-42 and the encapsulation substrate is formed of HYSOL MG-97-8000.

12. The surface mounted light emitting diode of claim 1, wherein the material of the semi-conductor is constructed from is selected from one or more of the group of semi-conductor materials including GA—

Al—

As—

, Ga—

Al—

S, Al—

Ga—

S, Si—

C, Ga—

P, Ga—

As—

P, or InGas.

13. A surface mounted photo-transistor comprising:

an emitter/collector means formed as part of, or affixed to, a metallic alloy;

an encapsulation substrate molded around the emitter/collector means, with generally parallel flat top and bottom surface and an optical element;

a first and a second conductive lead attached to, or formed as part of, the emitter/collector means, each conductive lead extending from a side of the encapsulation substrate with a free-end remote from the encapsulation substrate; and

,

extended ends formed at each free-end of a diameter substantially equal to the distance between the flat top and bottom surfaces.

14. The surface mounted photo-transistor of claim 13, wherein said optical element is roughly parallel to the flat top and bottom surfaces.

15. The surface mounted photo-transistor of claim 13, wherein the extended ends extend perpendicular from the free-ends.

16. The surface mounted photo-transistor of claim 13, wherein the flat top and bottom surfaces are without gate marks or flashings.

17. The surface mounted photo-transistor of claim 13, wherein the optical element is formed in a shape to distribute light to the emitter/collector means at a fan angle between 5 and 90 degrees.

18. The surface mounted photo-transistor of claim 13, wherein said optical element is formed in a shape to distribute light to the emitter/collector means at a fan angle between 5 and 90 degrees substantially oval in the narrowest axis.

19. The surface mounted photo-transistor of claim 13, wherein said optical element is formed in a shape to distribute light to the emitter/collector means at a fan angle between 12 and 40 degrees substantially circular.

20. The surface mounted photo-transistor of claim 13, wherein the emitter/collector means senses a light between 360-2200 nms.

21. The surface mounted photo-transistor of claim 13, wherein the metallic alloy of the emitter/collector means is formed of ALLOY-42 and the encapsulation substrate is formed of HYSOL MG-97-8000.

22. A surface mounted photo-circuit comprising:

a surface mounted light emitting diode comprising;

a metallic alloy base anode conductively bonded to a semi-conductor and a metallic alloy base cathode, forming a light emitting means;

an encapsulation substrate molded around the light emitting means with generally parallel flat top and bottom surfaces and an optical element;

a pair of conductive leads attached to, or formed as part of, the light emitting means each lead extending from a side of the encapsulation substrate, whereby said pair of conductive leads form free-ends which are remote from said encapsulation substrate; and

,

extended ends formed at each free-end of a diameter substantially equal to the distance between the flat top and bottom surfaces;

a surface mounted photo-transistor comprising;

an emitter/collector means formed as part of, or affixed to, a metallic alloy;

an encapsulation substrate molded around the emitter/collector means with generally parallel flat top and bottom surface and an optical element;

a first and a second conductive lead attached to, or formed as part of, the emitter/collector means each lead extending from a side of the encapsulation substrate with a free-end remote from the encapsulation substrate; and

,

extended ends formed at each free-end of a diameter substantially equal to the distance between the flat top and bottom surfaces.

23. The surface mounted photo-circuit of claim 22, wherein each optical element is formed on the top surface.

24. The surface mounted photo-circuit of claim 22, wherein each optical element is roughly parallel to the flat top and bottom.

25. The surface mounted photo-circuit of claim 22, wherein the flat top and bottom surfaces are flat with no gate marks or flashings.

26. A side mount light emitting diode;

a side oriented light emitting means within an encapsulation substrate with two extended lead wires forming a light emitting diode;

a substantially flat top surface of the light emitting diode;

a substantially flat bottom surface of the light emitting diode;

two side surfaces of the light emitting diode with a lead wire extending from each side surface of the light emitting diode; and

,

an extended free end formed on each portion of lead wire extending from the side surface of the light emitting diode, wherein the extended free end has a diameter substantially equal to the distance between the top and bottom surfaces.