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Method and system having switching network for testing semiconductor components on a substrate

  • US 6,677,776 B2
  • Filed: 08/20/2002
  • Issued: 01/13/2004
  • Est. Priority Date: 05/11/1998
  • Status: Expired due to Fees
First Claim
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1. A method for testing semiconductor components comprising:

  • providing a substrate containing the components;

    providing an interconnect comprising a plurality of interconnect contacts configured to electrically engage the components;

    providing a switching network in electrical communication with the interconnect contacts configured to control the interconnect contacts to selectively apply test signals to selected components, to electrically isolate defective components and to transmit read test signals from selected groups of components;

    applying test signals through the switching network and the interconnect contacts to the components; and

    controlling the test signals using the switching network to perform a selected test on the components.

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