Electronics assembly with cooling arrangement

• US 6,678,157 B1
• Filed: 09/17/2002
• Issued: 01/13/2004
• Est. Priority Date: 09/17/2002
• Status: Expired due to Term

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Bestwick, Graham Spencer
• Primary Examiner(s): Chervinsky, Boris
• Application Number:
  US10/245,234
• Time in Patent Office: 483 Days
• Field of Search: 361/690-692, 361/694, 361/695, 361/719, 361/720, 174/16.1, 174/16.3, 165/80.3, 165/104.33, 165/122, 454/184
• US Class Current: 361/695
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 7/20163 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

An electronics assembly, for example a computer, comprises an enclosure, and a heat-generating component located within the enclosure. A duct extends from the region of an aperture in a wall of the enclosure to the component and a fan is located within the duct to cause a flow of air from outside the enclosure directly to the heat-generating component.

Claims

1. An electronics assembly which comprises:

(i) an enclosure having a removable lid;

(ii) a heat generating component located within the enclosure;

(iii) a duct that extends from the region of an aperture in a wall of the enclosure to the component, a part of the duct being attached to, or being formed by, the lid of the enclosure; and

(iv) a fan that is located within the duct to cause a flow of air from outside the enclosure directly to the heat generating component;

wherein the duct has a plurality of guides to allow insertion and removal of the fan in a direction transverse to the duct.

2. An assembly as claimed in claim 1, wherein the duct causes air to flow from outside the enclosure to the component with substantially no mixing thereof with air in the rest of the enclosure, at least until after it has passed the heat generating component.

3. An assembly as claimed in claim 1, wherein the heat generating component is mounted on a generally planar circuit board, and the duct causes air to flow in a direction generally parallel to the circuit board.

4. An assembly as claimed in claim 1, wherein the heat generating component includes a heat sink, and the duct causes air to flow over the heat sink.

5. An assembly as claimed in claim 4, wherein the heat sink has fins that extend in a direction away from a surface of the component, and the duct causes air to flow between the fins and in a direction parallel to the surface of the component.

6. An assembly as claimed in claim 1, wherein the duct extends from a first side wall of the enclosure toward an opposite side wall, and one or more enclosure fans are located in the opposite side wall of the enclosure.

7. An assembly as claimed in claim 1, wherein the fan has a body and the duct has a bore that is substantially filled by the body of the fan.

8. An assembly as claimed in claim 1, wherein different parts of the duct are joined together along an axis of the duct.

9. An assembly as claimed in claim 1, wherein a part of the duct is located on a circuit board of the assembly, and a portion of the duct is raised off the circuit board.

10. An assembly as claimed in claim 1, wherein the enclosure has a generally flat shape to allow it to be stacked with one or more other such enclosures while allowing access to one or more side walls thereof.

11. An assembly as claimed in claim 1, wherein the heat generating component is a microprocessor.

12. A method of cooling a heat generating component in an electronics assembly enclosure, which comprises:

(i) providing a duct that extends from an aperture in a wall of the enclosure to the heat generating component, wherein a part of the duct is attached to, or is formed by, a lid of the enclosure; and

(ii) causing air to flow along the duct from outside the enclosure to the heat generating component using a fan inserted into the duct having a plurality of guides in the duct to allow insertion and removal of the fan in a direction transverse to the duct.

13. A method as claimed in claim 12, wherein the heat generating component is located on a circuit board in the enclosure, and the air is caused to flow in a direction generally parallel to the plane of the circuit board.

14. A method as claimed in claim 12, wherein the air is caused to flow along the duct by means of a fan that is located within the duct.