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System including power conditioning modules

  • US 6,678,168 B2
  • Filed: 03/27/2002
  • Issued: 01/13/2004
  • Est. Priority Date: 02/07/2002
  • Status: Expired due to Fees
First Claim
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1. A system for conditioning the power to be applied to first and second integrated circuit devices, the system comprises:

  • a primary power supply;

    a first power conditioning module affixed to the first integrated circuit device, the first power conditioning module includes;

    a semiconductor substrate having a first interface and a second interface;

    a plurality of interface vias to provide electrical connection between the first interface and the second interface;

    a first set of pads disposed on the first interface, each of the first set of pads is connected to a corresponding one of the interface vias;

    electrical circuitry disposed within semiconductor substrate, wherein the electrical circuitry receives power from the primary power supply and provides conditioned power to the first integrated circuit device;

    a second power conditioning module affixed to the second integrated circuit device, the second power conditioning module includes;

    a semiconductor substrate having a first interface and a second interface;

    a plurality of interface vias to provide electrical connection between the first interface and the second interface;

    a first set of pads disposed on the first interface, each of the first set of pads is connected to a corresponding one of the interface vias;

    electrical circuitry disposed within semiconductor substrate, wherein the electrical circuitry receives power from the primary power supply and provides conditioned power to the second integrated circuit device.

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