Distributed interface for parallel testing of multiple devices using a single tester channel

• US 6,678,850 B2
• Filed: 11/06/2002
• Issued: 01/13/2004
• Est. Priority Date: 03/01/1999
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Roy, Richard S., Miller, Charles A.
• Primary Examiner(s): Baker, Stephen M.
• Assistant Examiner(s): TORRES, JOSEPH D
• Application Number:
  US10/289,823
• Publication Number:
  US 20030126534A1
• Time in Patent Office: 433 Days
• Field of Search: 714/724, 714/730, 714/718, 714/719
• US Class Current: 714/730
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
• CPC Class Codes: G01R 31/31926 Routing signals to or from the device under test [DUT], e.g. switch matrix, pin multiplexing
• CPC Class Codes: G01R 31/3193 with comparison between actual response and known fault free response receiver details G01R31/31924
• CPC Class Codes: G11C 2029/2602 Concurrent test
• CPC Class Codes: G11C 2029/5606 Error catch memory
• CPC Class Codes: G11C 29/48 Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
• CPC Class Codes: G11C 29/56 External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

A system for testing a number of integrated circuit (IC) devices under test (DUTs) having interface circuitry coupled to a single or multi-channel tester for receiving data values from the tester and providing error information concerning the DUTs. The interface circuitry forwards data values (received from the tester over a single channel) to a number of DUTs in parallel. The circuitry performs comparisons using data values read from the DUTs, and in response generates error values indicative of the comparison. The error values may then be returned to the tester over the same or a different channel.

Claims

1. A probe card assembly comprising:

a plurality of electrical contacts configured to make electrical connections with a semiconductor tester;

a plurality of probes disposed to contact a plurality of semiconductor devices to be tested; and

interface circuitry comprising;

receiving circuitry configured to receive from said semiconductor tester through ones of said electrical contacts test data, a location in one of said semiconductor devices, and expected response data;

writing circuitry configured to write through ones of said probes copies of said test data to said location in at least two of said plurality of semiconductor devices; and

reading circuitry configured to read through ones of said probes actual response data generated by each of said at least two of said semiconductor devices in response to said test data.

2. The probe card assembly of claim 1, wherein said interface circuitry further comprises comparing circuitry configured to compare said expected response data received from said tester with said actual response data read from each of said at least two semiconductor devices.

3. The probe card assembly of claim 2, wherein said interface circuitry further comprises transmitting circuitry configured to transmit through ones of said tester electrical contacts a result of said comparison of said expected response data received from said tester with said actual response data read from each of said at least two of said semiconductor devices.

4. The probe card assembly of claim 2, wherein said interface circuitry further comprises an electronic memory configured to store a result of said comparison of said expected response data with said actual response data read from each of said at least two of said semiconductor devices.

5. The probe card assembly of claim 1 further comprising:

an interface board on which said electrical contacts are disposed; and

a space transformer on which said probes are disposed.

6. The probe card assembly of claim 5, wherein at least one of said receiving circuitry, said writing circuitry, and said reading circuitry is disposed on said space transformer.

7. The probe card assembly of claim 5, wherein said receiving circuitry, said writing circuitry, and said reading circuitry compose one or more integrated circuit chips.

8. The probe card assembly of claim 7, wherein each of said one or more integrated circuit chips is disposed on said space transformer.

9. The probe card assembly of claim 8, wherein said plurality of probes is disposed on a first surface of said space transformer, and each of said one or more integrated circuit chips is disposed on a second surface of said space transformer.

10. The probe card assembly of claim 9, wherein said first surface of said space transformer is opposite said second surface of said space transformer.

11. The probe card assembly of claim 1, wherein said plurality of probes is configured to contact said plurality of semiconductor devices while said semiconductor devices are in unsingulated wafer form.

12. A probe card assembly comprising:

tester interface means for making electrical connections with a semiconductor tester;

probe means for contacting a plurality of semiconductor devices to be tested;

receiving means for receiving through said tester interface means test data, a location in one of said semiconductor devices, and expected response data;

writing means for writing through said probe means copies of said test data to said location in at least two of said plurality of semiconductor devices; and

reading means for reading through said probe means actual response data generated by each of said at least two of said semiconductor devices in response to said test data.

13. The probe card assembly of claim 12 further comprising comparing means for comparing said expected response data received from said tester with said actual response data read from each of said at least two semiconductor devices.

14. The probe card assembly of claim 13 further comprising transmitting means for transmitting through said tester interface means a result of said comparison of said expected response data received from said tester with said actual response data read from each of said at least two of said semiconductor devices.

15. The probe card assembly of claim 13 further comprising memory means for storing a result of said comparison of said expected response data received from said tester with said actual response data read from each of said at least two of said semiconductor devices.

16. A method of testing a plurality of semiconductor devices comprising:

generating at a semiconductor tester test data and location data identifying a location on one of said semiconductor devices;

transmitting said test data and said location data to a probe card assembly;

writing said test data from said probe card assembly to said location on at least two of said semiconductor devices;

generating at said semiconductor tester expected response data;

transmitting said expected response data to said probe card assembly; and

reading at said probe card assembly actual response data from each of said at least two of said semiconductor devices.

17. The method of claim 16 further comprising comparing at said probe card assembly said expected response data received with said actual response data read from each of said at least two semiconductor devices.

18. The method of claim 17 further comprising transmitting from said probe card assembly to said semiconductor tester a result of said comparison of said expected response data with said actual response data read from each of said at least two of said semiconductor devices.

19. The method of claim 17 further comprising storing at said probe card assembly a result of said comparison of said expected result data with said actual result data read from each of said at least two of said semiconductor devices.

20. The method of claim 16, wherein said plurality of semiconductor devices are in unsingulated wafer form.