Stacked structure of an image sensor

• US 6,680,525 B1
• Filed: 01/09/2003
• Issued: 01/20/2004
• Est. Priority Date: 01/09/2003
• Status: Expired due to Fees

• Current Assignee: Kingpak Technology Inc.
• Original Assignee: Kingpak Technology Inc.
• Inventors: Chen, Bruce, Wu, Jichen, Hsieh, Jackson
• Primary Examiner(s): Clark, Jasmine
• Application Number:
  US10/340,251
• Time in Patent Office: 376 Days
• Field of Search: 257/680, 257/686, 257/685, 257/723, 257/777, 257/787, 257/98, 257/678
• US Class Current: 257/680
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.

Claims

1. An image sensor to be mounted to a printed circuit board, the image sensor comprising:

a substrate composed of a plurality of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets, each of the plurality of metal sheets having a first board and a second board positioned at a different height from that of the first board, and a slot being formed under the substrate;

an integrated circuit arranged within the slot under the substrate and electrically connected to the substrate;

a frame layer surrounding the substrate and the integrated circuit, the first boards and second boards being exposed out of the frame layer, and the second boards being electrically connected to the printed circuit board;

a photosensitive chip placed on the middle board of the substrate;

a plurality of wires for electrically connecting the first boards to the photosensitive chip; and

a transparent layer placed on the frame layer to cover the photosensitive chip.

2. The image sensor according to claim 1, wherein the frame layer is formed of a thermal plastic material by way of injection molding.

3. The image sensor according to claim 1, wherein each of the metal sheets further has a third board connecting the first board to the second board.

4. The image sensor according to claim 1, wherein the transparent layer is a piece of transparent glass.

5. The image sensor according to claim 1, wherein the plurality of metal sheets and the middle board are integrally formed by way of press forming.

6. The image sensor according to claim 1, wherein the integrated circuit is a signal processor.

7. The image sensor according to claim 1, wherein the middle board and the first board are positioned at the same horizontal height.

8. The image sensor according to claim 1, wherein the integrated circuit is electrically connected to the first boards of the substrate in a flip-chip manner.