Smart memory
First Claim
1. A smart memory integrated-circuit device, comprising:
- a memory array section;
a special-function section that provides a function other than an exclusive memory function and that is packaged with the memory array section in a single smart memory integrated-circuit package; and
wherein said single smart memory integrated-circuit package incorporates all memory functions of a standard memory that are provided by the memory array section in addition to a special function that is provided by the special-function section in the single integrated-circuit package; and
wherein the special-function section that provides a function other than an exclusive memory function is connected to the memory array section through a common internal bus within the smart memory integrated-circuit package to thereby significantly reduce the need for the memory array section to communicate with another external, baseband integrated-circuit through an external common bus that has significantly greater propagation delay, parasitic capacitance, inductance, and resistance and that is required to be driven with higher current interface driving circuits.
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Accused Products
Abstract
A smart memory includes a memory array and one or more memory-intensive additional functions, all packaged in a standard memory package that has substantially the same fit and form as a standard integrated-circuit memory. One type of smart memory chip is a multi-media RAM (MMRAM) chip that provides on a single integrated-circuit chip a memory array and a compressor/decompressor (CODEC) section where connections between the memory array section and the CODEC section are on the single integrated-circuit die. The smart memory eliminates the need for additional special function integrated-circuit packages and significantly reduces the clock rate and the power consumption of a baseband chip in a personal communication device.
21 Citations
29 Claims
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1. A smart memory integrated-circuit device, comprising:
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a memory array section;
a special-function section that provides a function other than an exclusive memory function and that is packaged with the memory array section in a single smart memory integrated-circuit package; and
wherein said single smart memory integrated-circuit package incorporates all memory functions of a standard memory that are provided by the memory array section in addition to a special function that is provided by the special-function section in the single integrated-circuit package; and
wherein the special-function section that provides a function other than an exclusive memory function is connected to the memory array section through a common internal bus within the smart memory integrated-circuit package to thereby significantly reduce the need for the memory array section to communicate with another external, baseband integrated-circuit through an external common bus that has significantly greater propagation delay, parasitic capacitance, inductance, and resistance and that is required to be driven with higher current interface driving circuits. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A smart memory integrated-circuit device, comprising:
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a memory array section;
a special-function section that provides a function other than an exclusive memory function and that is packaged with the memory array section in a single smart memory integrated-circuit package;
wherein said single smart memory integrated-circuit package incorporates all memory functions of a standard memory that are provided by the memory array section in addition to a special function that is provided by the special-function section in the single integrated-circuit package;
wherein the special-function section is connected to the memory array section through a common internal bus within the smart memory integrated-circuit package; and
wherein the single smart memory integrated-circuit package has substantially the same type, fit, and form of a package for only a conventional memory package that has only the memory array section without the special function section.
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13. A multi-media RAM (MM RAM) on a single integrated-circuit chip, comprising:
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a memory array section that is formed on a single integrated-circuit die and that is contained in a multi-media RAM package;
a compressor/decompressor (CODEC) section integrally formed on the same single integrated-circuit die and contained in the same multi-media RAM package as the memory array section, said CODEC section formed on the same single integrated-circuit die with the same fabrication process as the memory array section; and
wherein connections between the memory array section and the CODEC section are provided on the single integrated-circuit die. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A method of enhancing the capability of an integrated-circuit memory, comprising:
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packaging a memory array section together with a special-function section that provides a function other than an exclusive memory function in a single smart-memory integrated-circuit package; and
incorporating in the single smart-memory integrated-circuit package all of the memory functions of a standard memory that are provided by the memory array section in addition to incorporating a special function that is provided by the special function section; and
connecting the special-function section with the memory array section through a common internal bus within the smart-memory integrated-circuit package to significantly reduce the need for the memory array section to communicate with an external, baseband integrated-circuit over a common external bus that has significant propagation delay, parasitic capacitance, inductance, and resistance that further necessitate high current interface driving circuits;
whereby the single smart-memory integrated-circuit package is adapted to replace a standard memory product in a wireless appliance and to incorporate the special-function section in the smart-memory integrated-circuit package without requiring an additional special function IC, without the need to have a more powerful baseband chip, or without the need to significantly alter wireless appliance hardware, software, system architecture, and a printed-circuit design to which the single package is mounted in the wireless appliance. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29)
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Specification