Molding apparatus for molding light emitting diode lamps
First Claim
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1. A system for molding light emitting diode lamps using light emitting diode (LED) chips comprising:
- a mold frame;
a first mold insert locatable in the mold frame, the first mold insert defining first mold voids locatable about the LED chips;
a second mold insert locatable in the mold frame, the second mold insert defining second mold voids; and
an injector;
wherein the injector injects light converting material into the first mold voids and injects lens material into the second mold voids.
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Abstract
The present invention provides a method and system for molding light emitting diode (LED) lamps. A mold frame is provided around each LED chip in an array. A first mold insert is placed in the mold frame and light converting material comprising a carrier and light converting particles is injected into the first mold insert to form a light converting molding around each LED chip. The first mold insert is removed. A second mold insert is placed in the mold frame and lens material is injected into the first mold insert to form a lens molding around the light converting molding for each LED chip.
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Citations
4 Claims
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1. A system for molding light emitting diode lamps using light emitting diode (LED) chips comprising:
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a mold frame;
a first mold insert locatable in the mold frame, the first mold insert defining first mold voids locatable about the LED chips;
a second mold insert locatable in the mold frame, the second mold insert defining second mold voids; and
an injector;
wherein the injector injects light converting material into the first mold voids and injects lens material into the second mold voids. - View Dependent Claims (2, 3, 4)
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Specification