Semiconductor component and method of manufacturing same

• US 6,683,370 B1
• Filed: 04/15/2003
• Issued: 01/27/2004
• Est. Priority Date: 04/15/2003
• Status: Expired due to Term

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: McDonald, William G., Chapman, Michael
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US10/417,992
• Time in Patent Office: 287 Days
• Field of Search: 257/676, 257/666, 257/672, 257/684, 257/704
• US Class Current: 257/676
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

A semiconductor component includes a non-leaded leadframe (100, 200, 300) having at least one interior electrical contact (110) and a plurality of exterior electrical contacts (120), a semiconductor chip (410) mounted onto the leadframe, a mold compound (510) disposed around the semiconductor chip, a cavity (520) in the mold compound exposing a portion of the at least one interior electrical contact, an electronic chip (710) mounted in the cavity, and a cover (810) disposed over the cavity. In one embodiment, the leadframe is part of an array including a plurality of leadframes spaced apart from each other by a plurality of dam bars.

Claims

1. A semiconductor component comprising:

a non-leaded leadframe having at least one interior electrical contact and a plurality of exterior electrical contacts;

a semiconductor chip mounted over the non-leaded leadframe;

a first compound disposed around the semiconductor chip, the first compound comprising a lower surface, an upper surface, and a cavity in the upper surface exposing a portion of the at least one interior electrical contact;

an electronic chip mounted in the cavity; and

a cover disposed over the cavity.

2. The semiconductor component of claim 1 wherein:

the semiconductor chip is electrically coupled to the at least one interior electrical contact; and

the electronic chip is electrically coupled to the portion of the at least one interior electrical contact.

3. The semiconductor component of claim 1 wherein:

the electronic chip comprises a sensor.

4. The semiconductor component of claim 3 wherein:

the cover over the cavity comprises an aperture.

5. The semiconductor component of claim 1 further comprising:

a second compound disposed in the cavity around the electronic chip.

6. The semiconductor component of claim 1 further comprising:

a vent in the lower surface of the first compound underneath the cavity.

7. The semiconductor component of claim 1 wherein:

the cover comprises a membrane.

8. The semiconductor component of claim 1 further comprising:

a notch in the at least one interior electrical contact, wherein;

the first compound is disposed around the at least one interior electrical contact such that the first compound at least partially fills the notch.

9. The semiconductor component of claim 1 further comprising:

a second electronic chip mounted to the non-leaded leadframe, wherein;

the second electronic chip is electrically coupled to the non-leaded leadframe.

10. The semiconductor component of claim 9 further comprising:

a second compound over the second electronic chip.

11. A semiconductor component comprising:

a quad flat non-leaded leadframe having at least one interior electrical contact and a plurality of exterior electrical contacts;

a semiconductor chip mounted over the quad flat non-leaded leadframe;

a first compound disposed around the semiconductor chip, the first compound comprising a lower surface, an upper surface, and a cavity in the upper surface exposing a portion of the at least one interior electrical contact, and a vent in the lower surface underneath the cavity, the plurality of exterior electrical contacts extending through the lower surface of the first compound;

a sensor mounted in the cavity; and

a cover disposed over the cavity.

12. The semiconductor component of claim 11 wherein:

the semiconductor chip is electrically coupled to the at least one interior electrical contact and to at least a first one of the plurality of exterior electrical contacts; and

the sensor is electrically coupled to the portion of the at least one interior electrical contact and to at least a second one of the plurality of exterior electrical contacts.

13. The semiconductor component of claim 11 wherein:

the cover over the cavity comprises an aperture.

14. The semiconductor component of claim 13 wherein:

the cover comprises a membrane.

15. The semiconductor component of claim 11 further comprising:

a second compound disposed in the cavity around the sensor.

16. The semiconductor component of claim 11 further comprising:

a notch in the at least one interior electrical contact, wherein;

the first compound is disposed around the at least one interior electrical contact such that the first compound at least partially fills the notch.

17. The semiconductor component of claim 16 further comprising:

a second electronic chip mounted to the quad flat non-leaded leadframe, wherein;

the second electronic chip is electrically coupled to the quad flat non-leaded leadframe.

18. The semiconductor component of claim 17 further comprising:

a second compound over the second electronic chip.

19. A method of manufacturing a semiconductor component, the method comprising:

providing a non-leaded leadframe having at least one interior electrical contact and a plurality of exterior electrical contacts;

mounting a semiconductor chip over the non-leaded leadframe;

disposing a first compound around the semiconductor chip, the first compound comprising a lower surface, an upper surface, and a cavity in the upper surface exposing a portion of the at least one interior electrical contact;

mounting an electronic chip in the cavity;

disposing a cover over the cavity; and

separating the at least one interior electrical contact from the non-leaded leadframe.

20. The method of claim 19 further comprising:

electrically coupling the semiconductor chip to the at least one interior electrical contact before disposing the first compound.

21. The method of claim 19 further comprising:

electrically coupling the electronic chip to the portion of the at least one interior electrical contact after disposing the first compound.

22. The method of claim 19 wherein:

the electronic chip comprises a sensor.

23. The method of claim 22 wherein:

disposing the cover over the cavity further comprises;

providing an aperture in the cover.

24. The method of claim 19 further comprising:

disposing a second compound in the cavity around the electronic chip.

25. The method of claim 19 wherein:

disposing the first compound around the semiconductor chip comprises;

providing a vent in the lower surface of the first compound underneath the cavity.

26. The method of claim 19 wherein:

the cover comprises a membrane.

27. The method of claim 19 wherein:

providing the non-leaded leadframe comprises;

providing a notch in the at least one interior electrical contract; and

separating the at least one interior electrical contact from the non-leaded leadframe comprises;

passing a cutting tool through the notch.

28. The method of claim 19 further comprising:

mounting a second electronic chip over the non-leaded leadframe; and

electrically coupling the second electronic chip to the non-leaded leadframe.

29. The method of claim 28 further comprising:

disposing a second compound over the second electronic chip.