Memory expansion module with stacked memory packages and a serial storage unit
First Claim
1. A memory module comprising:
- a printed circuit board including a connector edge adapted for insertion within a socket of a computer system, wherein said connector edge includes a plurality of electrical contact pads for conveying electrical signals;
a plurality of stacked memory packages mounted upon said printed circuit board, each of said stacked memory packages including a first memory die and a second memory die, and wherein said first memory die of each of said stacked memory packages forms a portion of a first bank of memory and said second memory die of each of said stacked memory packages forms a portion of a second bank of memory;
a clock driver chip;
a serial storage unit, wherein said serial storage unit stores module identification information and signal line routing information which correlates each of at least some of said contact pads of said connector edge to a corresponding pin of a particular stacked memory package; and
, at least one line driver chip configured to drive control signals and/or address signals.
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Accused Products
Abstract
A memory expansion module with stacked memory packages. A memory module is implemented using stacked memory packages. Each of the stacked memory packages contains multiple memory chips, typically DRAMs (dynamic random access memory). The memory may be organized into multiple banks, wherein a given memory chip within a stacked memory package is part of one bank, while another memory chip in the same package is part of another bank. The memory module also includes a clock driver chip and a storage unit. The storage unit is configured to store module identification information, such as a serial number. The storage unit is also configured to store information correlating electrical contact pads on the module with individual signal pins on the stacked memory packages. This may allow an error to be quickly traced to a specific pin on a stacked memory package when an error is detected on the memory bus by an error correction subsystem.
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Citations
21 Claims
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1. A memory module comprising:
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a printed circuit board including a connector edge adapted for insertion within a socket of a computer system, wherein said connector edge includes a plurality of electrical contact pads for conveying electrical signals;
a plurality of stacked memory packages mounted upon said printed circuit board, each of said stacked memory packages including a first memory die and a second memory die, and wherein said first memory die of each of said stacked memory packages forms a portion of a first bank of memory and said second memory die of each of said stacked memory packages forms a portion of a second bank of memory;
a clock driver chip;
a serial storage unit, wherein said serial storage unit stores module identification information and signal line routing information which correlates each of at least some of said contact pads of said connector edge to a corresponding pin of a particular stacked memory package; and
,at least one line driver chip configured to drive control signals and/or address signals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A memory module comprising:
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a printed circuit board including a plurality of signal lines for conveying electrical signals and a connector edge adapted for insertion within a socket of a computer system, said edge connector having a plurality of contact pads for conveying said electrical signals between said memory module and a memory bus;
a plurality of stacked memory packages, each having two memory die, mounted upon said printed circuit board, each of said stacked memory packages having a plurality of signal pins;
a clock driver chip;
a storage unit for storing module identification and information which correlates said electrical contact pads to said signal pins; and
,at least one line driver chip for driving electrical signals to said stacked memory packages. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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Specification