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Semiconductor die including conductive columns

  • US 6,683,375 B2
  • Filed: 06/15/2001
  • Issued: 01/27/2004
  • Est. Priority Date: 06/15/2001
  • Status: Expired due to Term
First Claim
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1. A semiconductor die package comprising:

  • a) a semiconductor die;

    b) a conductive region on the semiconductor die;

    c) a passivation layer comprising an aperture on the semiconductor die, wherein the aperture is disposed over the conductive region; and

    d) a solid pre-formed, conductive column on the conductive region, wherein the conductive column comprises a lead-free, conductive columnar body and a coating comprising metal on the columnar body, wherein at least a portion of the coating is on a side of the columnar body and wherein the coating is an outermost coating of the conductive column.

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