Semiconductor die including conductive columns
First Claim
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1. A semiconductor die package comprising:
- a) a semiconductor die;
b) a conductive region on the semiconductor die;
c) a passivation layer comprising an aperture on the semiconductor die, wherein the aperture is disposed over the conductive region; and
d) a solid pre-formed, conductive column on the conductive region, wherein the conductive column comprises a lead-free, conductive columnar body and a coating comprising metal on the columnar body, wherein at least a portion of the coating is on a side of the columnar body and wherein the coating is an outermost coating of the conductive column.
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Abstract
A method for processing a semiconductor substrate is disclosed. The method includes providing a mask having an aperture on a semiconductor substrate having a conductive region. An aperture in the mask is disposed over the conductive region. A pre-formed conductive column is placed in the aperture and is bonded to the conductive region.
183 Citations
9 Claims
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1. A semiconductor die package comprising:
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a) a semiconductor die;
b) a conductive region on the semiconductor die;
c) a passivation layer comprising an aperture on the semiconductor die, wherein the aperture is disposed over the conductive region; and
d) a solid pre-formed, conductive column on the conductive region, wherein the conductive column comprises a lead-free, conductive columnar body and a coating comprising metal on the columnar body, wherein at least a portion of the coating is on a side of the columnar body and wherein the coating is an outermost coating of the conductive column. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification