Piston for module test

• US 6,683,466 B2
• Filed: 05/17/2002
• Issued: 01/27/2004
• Est. Priority Date: 05/17/2002
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Behun, John Richard
• Primary Examiner(s): Karlsen, Ernest
• Assistant Examiner(s): Tang, Minh N.
• Application Number:
  US10/063,839
• Publication Number:
  US 20030214315A1
• Time in Patent Office: 620 Days
• Field of Search: 324/754-758, 324/761-762, 324/765, 324/158.1, 269/26, 269/66, 269/70, 269/74, 269/236, 269/266-267, 439/247, 439/248, 439/709, 439/711
• US Class Current: 324/754.16
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735

Abstract

A test module having a lid to force a chip in contact with the test pads using a bed of nails to conform to the shape of the chip. The lengths of the nails are cut to conform to be of equal length above the chip with different size heads to apply the proper force. A pressurized bag may be placed above the head of nails to apply force to the chip.

Claims

1. A piston assembly, for contacting and applying force to a semiconductor module having a variety of devices mounted on its top surface each device having a height and sensitivity to force said piston assembly comprising:

a frame having an upper and lower surface and a plurality of apertures of varying diameter extending laterally through the frame;

a plurality of pressure pins loosely positioned through the apertures in the frame, each of said pins having a lower portion, an upper portion, a predetermined length and diameter wherein the length is determined by the height of the device which the lower portion will contact and the pin diameter is determined by the sensitivity to force on the device whereby the lower surface of the pressure pin is conformal to upper surfaces of the devices and applies a variable resultant force to each of the devices.

2. The piston assembly of claim 1 wherein the upper portion of the pressure pins are shaped in a head of nails configuration.

3. The piston assembly of claim 2 wherein the lower portion of the pressure pins has a smaller diameter than the upper portion.

4. The piston assembly of claim 3 wherein a uniform force is applied to the upper portion of the pressure pins.

5. The piston assembly of claim 4 wherein the pressure pins apply a variable force to he upper surfaces of the devices mounted on the module to minimize torque and shear streses.

6. The piston assembly of claim 1 wherein the frame is construted of ceramic material.

7. The piston assembly of claim 3 wherein a uniform force is applied by use of a membrane affixed to the upper portion of the pressure pins.