High frequency module having a laminate board with a plurality of dielectric layers

• US 6,683,512 B2
• Filed: 06/14/2002
• Issued: 01/27/2004
• Est. Priority Date: 06/21/2001
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Nakamata, Katsurou, Shimura, Teruyuki, Okuda, Toshio, Isoyama, Shinji
• Primary Examiner(s): Tokar, Michael
• Assistant Examiner(s): Mai, Lam T.
• Application Number:
  US10/172,752
• Publication Number:
  US 20020196085A1
• Time in Patent Office: 592 Days
• Field of Search: 333/134, 333/126, 333/203, 333/219.1, 333/202, 333/204
• US Class Current: 333/126
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H03F 2200/372 : Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 3/602 : Combinations of several amplifiers
• CPC Class Codes: H05K 1/0206 : by printed thermal vias
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 2201/0715 : provided by an outer layer of PCB
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/403 : Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: H05K 3/4611 : by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4629 : laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A high frequency module according to the present invention comprises a laminate board having a plurality of dielectric layers (11 to 18) stacked one on another, a branch filter circuit (DIP10) for separating a plurality of transceiver systems from each other, switch circuits (SW10, SW20) for switching the respective transceiver systems between transmitter branches (TX) and receiver branches (RX), power amplifiers (AMP10, AMP20) each comprising a matching circuit (MAT10, MAT20) and a high frequency amplification semiconductor device for amplifying a transmission signal having a frequency within a pass band of each of the transmitter branches (TX), and couplers (COP10, COP20) for monitoring outputs.

Claims

1. A high frequency module comprising:

a laminate board having a plurality of dielectric layers stacked one on another;

a branch filter circuit for separating a plurality of transceiver systems having different pass bands from each other;

switch circuits connected to the branch filter circuit for switching the respective transceiver systems between transmitter branches and receiver branches; and

power amplifiers respectively connected to the switch circuits and each comprising a matching circuit;

a high frequency amplification semiconductor device for amplifying a transmission signal having a frequency within a pass band of each of the transmitter branches; and

couplers for monitoring outputs of the power amplifiers.

2. A high frequency module as set forth in claim 1, wherein an interference preventing grounding pattern is provided between the power amplifiers and the switch circuits and between the power amplifiers and couplers.

3. A high frequency module as set forth in claim 1, wherein interference preventing grounding patterns are provided on a surface of the laminate board and between the dielectric layers of the laminate board, and connected to each other through via-hole conductors.

4. A high frequency module as set forth in claim 1, wherein the matching circuit comprises distributed constant lines provided around the high frequency amplification semiconductor device on the surface of the laminate board and/or in the laminate board.

5. A high frequency module as set forth in any of claim 1, wherein the matching circuit comprises a distributed constant line provided between the high frequency amplification semiconductor device and the couplers and/or between the high frequency amplification semiconductor device and couplers.

6. A high frequency module as set forth in claim 1, wherein the couplers and the power amplifiers for the respective pass bands are separately disposed as seen from the top of the laminate board.

7. A high frequency module as set forth in claim 1, wherein the power amplifiers, the switch circuits and the branch filter circuit are arranged in this order in the laminate board.

8. A high frequency module as set forth in claim 1, wherein the distributed constant lines of the matching circuit, distributed constant lines of couplers, and distributed constant lines of the switch circuits are disposed in non-overlapped relation to each other as seen from the top of the laminate board.

9. A high frequency module as set forth in claim 1, wherein the branch filter circuit has capacitor conductive patterns and distributed constant lines provided between the dielectric layers, wherein the switch circuits each have a concentrated constant device provided on the surface of the laminate board, wherein the couplers each have the distributed constant lines provided between the dielectric layers and a concentrated constant device provided on the surface of the laminate board, wherein the power amplifiers each have the high frequency amplification semiconductor device provided in a cavity formed in the surface of the laminate board, distributed constant lines provided between the dielectric layers of the laminate board and on the surface of the laminate board, and a concentrated constant device provided on the surface of the laminate board.

10. A high frequency module as set forth in claim 1, wherein the dielectric layers each have a dielectric constant of 15 to 25.

11. A high frequency module as set forth in claim 1, wherein a signal terminal pattern, a grounding terminal pattern and a bias terminal pattern are provided in a peripheral area of a lower surface of the laminate board, and respectively connected to side-face through-hole electrodes provided on a side face of the laminate board, wherein a grounding pattern is provided in a center area of the lower surface of the laminate board and connected to the grounding terminal pattern, wherein the grounding pattern is coated with an overcoat glass so that plural portions thereof are exposed from the overcoat glass, wherein a thermal via is connected to the grounding pattern.

12. A high frequency module comprising:

a laminate board having a plurality of dielectric layers stacked one on another;

a branch filter circuit for separating a plurality of transceiver systems having different pass bands from each other;

switch circuits connected to the branch filter circuit for switching the respective transceiver systems between transmitter branches and receiver branches; and

power amplifiers respectively connected to the switch circuits and each comprising a matching circuit and a high frequency amplification semiconductor device for amplifying a transmission signal having a frequency within a pass band of each of the transmitter branches.

13. A high frequency module as set forth in claim 12, wherein an interference preventing grounding pattern is provided between the power amplifiers and the switch circuits.

14. A high frequency module as set forth in claim 12, wherein interference preventing grounding patterns are provided on a surface of the laminate board and between the dielectric layers of the laminate board, and connected to each other through via-hole conductors.

15. A high frequency module as set forth in claim 12, wherein the matching circuit comprises distributed constant lines provided around the high frequency amplification semiconductor device on the surface of the laminate board and/or in the laminate board.

16. A high frequency module as set forth in claim 12, wherein the matching circuit comprises a distributed constant line provided between the high frequency amplification semiconductor device and the couplers.

17. A high frequency module as set forth in claim 12, wherein the power amplifiers, the switch circuits and the branch filter circuit are arranged in this order in the laminate board.

18. A high frequency module as set forth in claim 12, wherein the distributed constant lines of the matching circuit are disposed in non-overlapped relation with respect to distributed constant lines of the switch circuits as seen from the top of the laminate board.

19. A high frequency module as set forth in claim 12, wherein the branch filter circuit has capacitor conductive patterns and distributed constant lines provided between the dielectric layers, wherein the switch circuits each have a concentrated constant device provided on the surface of the laminate board, wherein the power amplifiers each have the high frequency amplification semiconductor device provided in a cavity formed in the surface of the laminate board, distributed constant lines provided between the dielectric layers of the laminate board and on the surface of the laminate board, and a concentrated constant device provided on the surface of the laminate board.

20. A high frequency module as set forth in claim 12, wherein the dielectric layers each have a dielectric constant of 15 to 25.

21. A high frequency module as set forth in claim 12, wherein a signal terminal pattern, a grounding terminal pattern and a bias terminal pattern are provided in a peripheral area of a lower surface of the laminate board, and respectively connected to side-face through-hole electrodes provided on a side face of the laminate board, wherein a grounding pattern is provided in a center area of the lower surface of the laminate board and connected to the grounding terminal pattern, wherein the grounding pattern is coated with an overcoat glass so that plural portions thereof are exposed from the overcoat glass, wherein a thermal via is connected to the grounding pattern.