Web fabrication of devices

• US 6,683,663 B1
• Filed: 08/17/2001
• Issued: 01/27/2004
• Est. Priority Date: 02/05/1999
• Status: Expired due to Term

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Chiang, Ann, Craig, Gordon S. W., Jacobsen, Jeffrey Jay, Smith, John Stephen, Tu, Jay, Stewart, Roger Green, Hadley, Mark A.
• Primary Examiner(s): CHOWDHURY, TARIFUR RASHID
• Application Number:
  US09/932,409
• Time in Patent Office: 893 Days
• Field of Search: 349/42, 349/45, 349/187, 257/94, 257/98, 257/13, 438/28, 438/34, 438/142, 438/149, 438/106, 438/110
• US Class Current: 349/45
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/1362 Active matrix addressed cells G02F1/134336, G02F1/134363 take precedence
• CPC Class Codes: H01L 21/2007 Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer H01L21/2011 takes precedence; bonding of semiconductor wafers to semiconductor wafers for junction formation H01L21/187
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: Y10T 29/53178 : Chip component

Abstract

Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming an assembly using different sized blocks in either a flexible or rigid substrate.

Claims

1. A method for fabricating an assembly, comprising:

dispensing a first slurry over a substrate, said first slurry containing a plurality of first objects; and

dispensing a second slurry over a substrate, said second slurry containing a plurality of second objects which are different in shape from said first shaped object.

2. The method of claim 1, further comprising:

dispensing larger blocks into first receptor regions in the substrate; and

dispensing smaller blocks into second receptor regions in the substrate after dispensing larger blocks.

3. The method as in claim 2, wherein said first receptor regions are compatible with only one of said first shaped objects and said second shaped objects.

4. The method as in claim 3, wherein said second receptor regions are compatible with only the other of said first shaped objects and said second shaped objects.

5. The method of claim 1, wherein dispensing of the first plurality of objects and the second plurality of objects occurs in one operation.

6. The method as in claim 1, wherein said substrate is flexible.

7. The method as in claim 1, wherein said substrate is rigid.

8. The method as in claim 1, further comprising:

placing more than one of a first shaped object and a second shaped object onto the substrate using a relocating tool.

9. A method for fabricating an assembly, comprising:

dispensing a slurry over a substrate comprising first receptor regions and second receptor regions, said slurry containing a plurality of first objects compatible with said first receptor regions and a plurality of second object which are different in shape from said first shaped objects and are compatible with said second receptor regions.

10. The method of claim 9, further comprising:

placing at least one of a first shaped block and a second shaped block into one of a first receptor region and a second receptor region.

11. The method of claim 10, wherein placing at least one of a first shaped block and a second shaped block is performed by a robot.

12. The method of claim 9, wherein said first receptor regions are compatible with only said first plurality of objects.

13. The method as in claim 9, wherein the first shaped object comprises a shape and said first receptor region has an opening in said substrate similar to said shape.

14. The method as in claim 9, wherein the second shaped object comprises a shape and said second receptor region has an opening in said substrate similar to said shape.

15. The method as in claim 9, wherein said substrate is flexible.

16. The method as in claim 9, wherein said substrate is rigid.