Production of photoresist coatings

• US 6,686,122 B1
• Filed: 06/21/2001
• Issued: 02/03/2004
• Est. Priority Date: 12/22/1998
• Status: Expired due to Fees

• Current Assignee: Huntsman Advanced Materials Americas, Inc.
• Original Assignee: Vantico Inc.
• Inventors: Setiabudi, Frans
• Primary Examiner(s): Baxter, Janet
• Assistant Examiner(s): Walke, Amanda C.
• Application Number:
  US09/868,817
• Time in Patent Office: 957 Days
• Field of Search: 430/270.1, 430/281.1, 430/311, 430/315, 430/319, 430/322, 430/324, 430/325, 430/328, 430/330, 430/331
• US Class Current: 430/270.1
• CPC Class Codes: G03F 7/168 Finishing the coated layer, e.g. drying, baking, soaking
• CPC Class Codes: G03F 7/38 Treatment before imagewise removal, e.g. prebaking G03F7/265 takes precedence
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: H05K 2203/0505 Double exposure of the same photosensitive layer
• CPC Class Codes: H05K 3/0076 characterised by the composition of the mask
• CPC Class Codes: H05K 3/0082 characterised by the exposure method of radiation-sensitive masks

Abstract

Process for the production of a resist coating, in which

(a) a substrate is coated with a resist composition which comprises at least one component which absorbs radiation in the near infrared region with warming of the coating; and

(b) the resist composition or a composition derived therefrom and obtained during the process is subjected at least once during the process to thermal treatment with the aid of radiation in the near infrared region.

Claims

1. A process for the production of a resist coating, in which

(a) a substrate is coated with a resist composition which comprises at least one component that absorbs radiation in the near infrared region with warming of the coating;

(b) said resist composition or a composition derived therefrom and obtained during the process is subjected at least once during the process to thermal treatment with the aid of radiation in the near infrared region; and

(c) the resist composition comprises at least one photosensitive component system.

2. A process according to claim 1, in which the composition comprises a solvent, and the solvent is removed by thermal treatment of the composition with radiation in the near infrared region, with formation of the resist coating.

3. A process according to claim 2, in which the removal of the solvent is carried out with simultaneous treatment of the surface of the coating with flowing gas.

4. A process according to claim 3, in which the flowing gas is air.

5. A process according to claim 1, in which the composition comprises an inert organic solvent, water or a mixture of two or more than two of the said components.

6. A process according to claim 1, in which the composition comprises a photocurable component system and a thermally curable component system.

7. A process according to claim 6, in which the substrate coated with the composition, after removal of any solvent present in the composition, is exposed imagewise to UV/VIS radiation and, if desired after heating, is structured in accordance with this image with the aid of a developer.

8. A process according to claim 7, in which the heating between the imagewise exposure and the development is carried out with the aid of radiation in the near infrared region.

9. A process according to claim 7, in which, after the imagewise structuring of the resist coating, the thermally curable component system of the resist composition is cured.

10. A process according to claim 9, in which the thermally curable component system of the resist composition is cured with the aid of radiation in the near infrared region.

11. A process according to claim 1, in which the substrate coated with the composition, after removal of any solvent present in the composition, is exposed imagewise to UV/VIS radiation and, if desired after heating, is structured in accordance with this image with the aid of a developer.

12. A process according to claim 11, in which the heating between the imagewise exposure and the development is carried out with the aid of radiation in the near infrared region.

13. A process according to claim 1, in which the resist composition comprises at least one crosslinkable compound containing (meth)acrylic or epoxide groups.

14. A process according to claim 1, in which the composition comprises a thermally curable component system based on an epoxide compound.

15. A process according to claim 1, in which the resist coating is a primary resist coating, a solder-stop resist coating, or a resist coating within a multilayer circuit boards.

16. A process according to claim 1, in which the resist composition does not comprise a photocurable component system and does comprise a thermally curable component system.

17. A process according to claim 16, in which the substrate coated with the composition, after removal of solvent present in the composition, is exposed imagewise to UV/VIS radiation and, if desired after heating, is structured in accordance with this image with the aid of a developer.

18. A process according to claim 17, in which the heating between the imagewise exposure and the development is carried out with the aid of radiation in the near infrared region.

19. A process according to claim 18, in which, after the imagewise structuring of the resist coating, the thermally curable component system of the resist composition is cured.

20. A process according to claim 19, in which the thermally curable component system of the resist composition is cured with the aid of radiation in the near infrared region.