Micromechanical component including function components suspended movably above a substrate
First Claim
1. A micromechanical component including function components suspended movably above a substrate, comprising:
- a substrate;
a first insulation layer provided above the substrate;
a first micromechanical function layer including at least one conductor region and at least one sacrificial layer region provided above the first insulation layer;
a second insulation layer provided above the conductor region and above the first insulation layer;
a third insulation layer provided above the second insulation layer;
a second micromechanical function layer provided above the third insulation layer, the second micromechanical function layer including the suspended function components, at least one first trench and at least one second trench, the first trench extending at least to the third insulation layer and the second trench extending at least to the third insulation layer above the conductor region; and
a fourth insulation layer arranged above the second micromechanical function layer to one of protect and passivate side walls of the at least one first trench and the at least one second trench.
1 Assignment
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Accused Products
Abstract
A micromechanical component and method for its manufacture, in particular an acceleration sensor or a rotational speed sensor, includes: function components suspended movably above a substrate; a first insulation layer provided above the substrate; a first micromechanical function layer including conductor regions provided above the first insulation layer; a second insulation layer provided above the conductor regions and above the first insulation layer; a third insulation layer provided above the second insulation layer; a second micromechanical function layer including first and second trenches provided above the third insulation layer, the second trenches extending to the third insulation layer above the conductor regions and the first trenches extending to a cavity beneath the movably suspended function components in the second micromechanical function layer.
86 Citations
8 Claims
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1. A micromechanical component including function components suspended movably above a substrate, comprising:
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a substrate;
a first insulation layer provided above the substrate;
a first micromechanical function layer including at least one conductor region and at least one sacrificial layer region provided above the first insulation layer;
a second insulation layer provided above the conductor region and above the first insulation layer;
a third insulation layer provided above the second insulation layer;
a second micromechanical function layer provided above the third insulation layer, the second micromechanical function layer including the suspended function components, at least one first trench and at least one second trench, the first trench extending at least to the third insulation layer and the second trench extending at least to the third insulation layer above the conductor region; and
a fourth insulation layer arranged above the second micromechanical function layer to one of protect and passivate side walls of the at least one first trench and the at least one second trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification
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- Resources
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Current AssigneeRobert Bosch GmbH
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Original AssigneeRobert Bosch GmbH
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InventorsFischer, Frank, Metzger, Lars
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Primary Examiner(s)Zarabian, Amir
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Assistant Examiner(s)Soward, Ida M.
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Application NumberUS10/026,177Publication NumberTime in Patent Office775 DaysField of Search257/414-415, 257/750, 257/756, 257/758, 257/798US Class Current257/415CPC Class CodesB81B 2201/0235 AccelerometersB81B 2203/033 TrenchesB81C 1/00571 Avoid or control under-cuttingB81C 2201/0109 Sacrificial layers not prov...G01P 15/0802 DetailsG01P 15/125 by capacitive pick-upG01P 2015/0814 for translational movement ...
