High performance MEMS device fabricatable with high yield

• US 6,686,639 B1
• Filed: 09/30/2002
• Issued: 02/03/2004
• Est. Priority Date: 09/30/2002
• Status: Active Grant

• Current Assignee: Teledyne Scientific & Imaging, LLC (Teledyne Technologies Incorporated)
• Original Assignee: Innovative Technology Licensing LLC
• Inventors: Tsai, Chialun
• Primary Examiner(s): Wilson, Allan R.
• Application Number:
  US10/260,662
• Time in Patent Office: 491 Days
• Field of Search: 257/415, 257/417, 257/418
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/033 Comb drives
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: H02N 1/008 Laterally driven motors, e.g. of the comb-drive type

Abstract

A MEMS device with a electrostatic comb actuator is comprised of a supporting substrate, with device features on only one side, and two silicon device layers locally bonded together by thermal compression bonding of metal pads. Use of a supporting substrate enables the silicon device layers to be relatively thin and eliminates the through-wafer etch procedure, which greatly reduces silicon etch times and improves the accuracy and yield of the etch processes. Use of metal-metal interlayer bonds avoids the need for a wet chemical etch for release of the moveable structure so that the device can be fabricated with high yield. Scanning micromirror devices according to the present invention were fabricated with almost 100% yield and exhibited scanning over a 12° optical range and a mechanical angle of ^±3° at a high resonant frequency of 2.5 kHz with an operating voltage of only 20 VDC.

Claims

1. A micro-electro-mechanical system (MEMS) device, comprising:

a supporting substrate layer;

an electrically insulating layer disposed on said supporting substrate layer;

a stationary actuator comb disposed in a first device layer on said electrically insulating layer;

a first electrical contact to said stationary actuator comb;

at least one first bond pad disposed in the first device layer on said electrically insulating layer;

a moveable structure, including a functional device element and a moveable actuator comb, in a second device layer vertically about said first device layer;

at least one second bond pad in the second device layer;

a spring in the second device layer connecting said moveable structure to at least one second bond pad;

at least one metal bond whereby said first bond pad and said second bond pad are bonded together; and

a second electrical contact to said moveable structure,

such that a voltage applied between said first and second electrical contacts tends to cause the functional device element to move relative to said supporting substrate layer.

2. The device of claim 1, wherein the electrically insulating layer is comprised of silicon oxide.

3. The device of claim 1, wherein at least one layer of the group consisting of the supporting substrate layer, the first device layer, and the second device layer comprises silicon.

4. The device of claim 1, wherein at least one of the first and second electrical contacts comprises a metallic electrical contact pad.

5. The device of claim 4, wherein the metallic electrical contact pad comprises a gold layer and an adhesion layer, said adhesion layer comprising a metal selected from the group consisting of chromium, titanium, nickel and cobalt.

6. The device of claim 1, wherein at least one of said first and second electrical contacts comprises a wire bond.

7. The device of claim 1, wherein the functional device element is selected from the group consisting of scanning micromirror, optical switch, electrical switch, variable capacitor, variable inductor, and high frequency resonator.

8. The device of claim 1, wherein said metal bond comprises a gold layer and an adhesion layer, said adhesion layer comprising a metal selected from the group consisting of chromium, titanium, nickel and cobalt.

9. The device of claim 1, wherein said metal bond is formed by thermal compression bonding.

10. The device of claim 1, wherein said spring includes a torsion spring permitting rotational motion of the functional device element about the axis of the torsion spring.

11. The device of claim 1, wherein said spring further comprises a plurality of springs permitting translational motion of the functional device element.

12. A micro-electro-mechanical system (MEMS) device, comprising:

a silicon supporting substrate layer;

a silicon oxide electrically insulating layer disposed on said silicon supporting substrate layer;

a stationary actuator comb disposed in a first silicon device layer on said silicon oxide electrically insulating layer;

a first electrical contact to said stationary actuator comb;

at least one first silicon bond pad disposed in the first silicon device layer on said silicon oxide electrically insulating layer;

a moveable structure, including a functional device element and a moveable actuator comb, in a second silicon device layer vertically about said first device layer;

at least one second silicon bond pad in the second silicon device layer;

a silicon spring in the second silicon device layer connecting said moveable structure to at least one second silicon bond pad;

at least one metal bond whereby said first silicon bond pad and said second silicon bond pad are bonded together; and

a second electrical contact to said moveable structure,

such that a voltage applied between said first and second electrical contacts tends to cause the functional device element to move relative to said supporting substrate layer.

13. The device of claim 12, wherein at least one of the first and second electrical contacts comprises a metallic electrical contact pad.

14. The device of claim 13, wherein the metallic electrical contact pad comprises a gold layer and an adhesion layer, said adhesion layer comprising a metal selected from the group consisting of chromium, titanium, nickel and cobalt.

15. The device of claim 12, wherein at least one of said first and second electrical contacts comprises a wire bond.

16. The device of claim 12, wherein the functional device element is selected from the group consisting of scanning micromirror, optical switch, electrical switch, variable capacitor, variable inductor, and high frequency resonator.

17. The device of claim 12, wherein said metal bond comprises a gold layer and an adhesion layer, said adhesion layer comprising a metal selected from the group consisting of chromium, titanium, nickel and cobalt.

18. The device of claim 12, wherein said metal bond is formed by thermal compression bonding.

19. The device of claim 12, wherein said spring includes a torsion spring permitting rotational motion of the functional device element about the axis of the torsion spring.

20. The device of claim 12, wherein said spring further comprises a plurality of springs permitting translational motion of the functional device element.

21. A micro-electro-mechanical system (MEMS) device, comprising:

a silicon supporting substrate layer;

a silicon oxide electrically insulating layer disposed on said silicon supporting substrate layer;

a stationary actuator comb disposed in a first silicon device layer on said silicon oxide electrically insulating layer;

a first electrical contact to said stationary actuator comb;

at least one first silicon bond pad disposed in the first silicon device layer on said silicon oxide electrically insulating layer;

a moveable structure, including a functional device element and a moveable actuator comb, in a second silicon device layer vertically about said first device layer;

at least one second silicon bond pad in the second silicon device layer;

a silicon torsion spring in the second silicon device layer connecting said moveable structure to at least one second silicon bond pad;

at least one thermal compression gold bond whereby said first silicon bond pad and said second silicon bond pad are bonded together; and

a second electrical contact to said moveable structure,

such that a voltage applied between said first and second electrical contacts tends to cause the functional device element to move relative to said supporting substrate layer.