Methods for wireless testing of integrated circuits

• US 6,686,755 B2
• Filed: 01/16/2001
• Issued: 02/03/2004
• Est. Priority Date: 03/23/1998
• Status: Expired due to Term

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Henderson, P. Michael, Hale, Kelly H., Andrews, Jr., Warner B., Siann, Jonathan I., White, Stanley A., Walley, Kenneth S., Johnston, James W.
• Primary Examiner(s): KARLSEN, ERNEST F
• Application Number:
  US09/764,689
• Publication Number:
  US 20010005145A1
• Time in Patent Office: 1,113 Days
• Field of Search: 324/763, 324/765, 714/733, 714/734
• US Class Current: 324/754.31
• CPC Class Codes: G01R 31/2851 Testing of integrated circuits [IC] G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/303 of integrated circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: G01R 31/315 by inductive methods

Abstract

A system for testing a microelectronic circuit includes a test bed for mounting a microelectronic circuit, and a signal source for applying a signal to a microelectronic circuit mounted on the test bed. The system additionally includes a test probe for wirelessly receiving electromagnetic response signals from the microelectronic circuit mounted on the test bed. In a preferred form, the electromagnetic response signals are radio-frequency signals. The test system additionally includes a computer connected to be test probe for analyzing the electromagnetic response signals. An integrated circuit for testing on the test system has a test circuit portion that emits electromagnetic radiation in response to a predetermined signal applied to the test circuit.

Claims

1. A method of testing a semiconductor integrated circuit, the method comprising the steps of:

providing an integrated circuit configured to emit electromagnetic radiation in response to receiving a predetermined signal;

applying said predetermined signal to said integrated circuit via an electrical signal input to said integrated circuit to cause said integrated circuit to emit electromagnetic radiation, wherein said predetermined signal does not provide a power source for said integrated circuit; and

wirelessly detecting, without using an external antenna, said electromagnetic radiation emitted by said integrated circuit by placing an electromagnetic receiver near said integrated circuit.

2. The testing method of claim 1, wherein said electromagnetic radiation emitted by said integrated circuit is radio frequency radiation.

3. The testing method of claim 1, wherein said step of wirelessly detecting said electromagnetic radiation comprises placing said electromagnetic radiation receiver within 10 cm of said integrated circuit.

4. The testing method of claim 1, wherein said step of wirelessly detecting said electromagnetic radiation comprises placing said electromagnetic radiation receiver within 3 cm of said integrated circuit.

5. The method of claim 1, additionally comprising the step of analyzing with a programmed electronic computer said wirelessly detected electromagnetic radiation.

6. The testing method of claim 1, wherein said electromagnetic radiation emitted by said integrated circuit is infrared radiation.

7. The testing method of claim 1, wherein said electromagnetic radiation emitted by said integrated circuit is coherent optical radiation.

8. A method of using test equipment to test an electrical circuit within an electronic device, the method comprising the steps of:

placing a probe of the test equipment within 10 cm of the electrical circuit;

applying a first test signal to the electrical circuit via an electrical signal input to the electrical signal, wherein the first test signal does not provide a power source for said electrical circuit;

generating, by the electrical circuit in response to the first test signal, a radio frequency carrier wave;

encoding, by the electrical circuit, information onto the carrier wave to produce a modulated wave;

wirelessly detecting, without using an external antenna, by the probe, the modulated wave; and

decoding by the test equipment, the information about the modulated wave.

9. The method of claim 8 further comprising the step of using the probe to wirelessly apply a second test signal to the electrical circuit.

10. The method of claim 8 further comprising the step of analyzing, by the test equipment, the decoded information.

11. A method for wireless testing of integrated circuits, comprising the steps of:

applying an electrical input signal from a testing device to an integrated circuit through an electrical signal input of said integrated circuit that is electrically connected to said testing device, wherein said electrical input signal does not provide a power source for said integrated circuit;

applying an electromagnetic input signal from said testing device to said integrated circuit by way of a probe electrically connected to said testing device emitting said electromagnetic input signal and said integrated circuit sensing said electromagnetic input signal; and

receiving an electromagnetic output signal from said integrated circuit to said testing device by way of said integrated circuit emitting said electromagnetic output signal in response to at least one of said electrical input signal and said electromagnetic input signal and said probe, without using an external antenna, sensing said electromagnetic output signal.

12. The method of claim 11, wherein:

said step of applying an electromagnetic input signal further comprises modulating said electromagnetic input signal prior to said probe emitting said electromagnetic input signal and demodulating said electromagnetic input signal after said integrated circuit senses said electromagnetic input signal; and

said step of receiving an electromagnetic output signal further comprises modulating said electromagnetic output signal prior to said integrated circuit emitting said electromagnetic output signal and demodulating said electromagnetic output signal after said probe senses said electromagnetic output signal.

13. The method of claim 11, wherein:

said step of applying an electromagnetic input signal further comprises encoding said electromagnetic input signal prior to said probe emitting said electromagnetic input signal and decoding said electromagnetic input signal after said integrated circuit senses said electromagnetic input signal; and

said step of receiving an electromagnetic output signal further comprises encoding said electromagnetic output signal prior to said integrated circuit emitting said electromagnetic output signal and decoding said electromagnetic output signal after said probe senses said electromagnetic output signal.

14. The method of claim 11, wherein said electromagnetic input signal and said electromagnetic output signal are radio-frequency signals.

15. The method of claim 11, wherein said electromagnetic input signal and said electromagnetic output signal are infra-red signals.

16. The method of claim 11, wherein said electromagnetic input signal and said electromagnetic output signal are optical-radiation signals.

17. The method of claim 11, wherein the step of applying an electromagnetic input signal further comprises positioning said probe within a proximity of no more than 10 cm of said integrated circuit.