Methods of fixturing flexible substrates and methods of processing flexible substrates

• US 6,687,969 B1
• Filed: 05/16/1997
• Issued: 02/10/2004
• Est. Priority Date: 05/16/1997
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Dando, Ross S.
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US08/858,022
• Time in Patent Office: 2,461 Days
• Field of Search: 294/23, 295/59, 298/40, 297/39, 298/31, 299/00, 298/32, 298/33, 269/903, 269/286, 269/289.R, 269/302.1, 269/47, 269/94
• US Class Current: 29/423
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 2203/016 Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: Y10T 29/4981 Utilizing transitory attached element or associated separate material
• CPC Class Codes: Y10T 29/49998 Work holding

Abstract

The present invention relates to methods of fixturing and processing flexible circuit substrates. Flexible circuit substrates are removably coupled with a processing carrier in certain aspects of the invention. Such coupling is preferably void of any adhesive. According to preferred embodiments of the present invention, the coupling surface is configured for reuse and a second flexible circuit substrate is positioned upon the coupling surface following the removal of the first flexible circuit substrate therefrom. Ideally, the coupling surface remains upon the processing carrier during the separation of a flexible circuit substrate from the coupling surface. One disclosed method of fixturing a flexible circuit substrate comprises: providing a processing carrier having a coupling surface, the coupling surface comprising silicone; positioning a flexible circuit substrate upon the coupling surface; and separating the flexible circuit substrate and the coupling surface while maintaining the coupling surface upon the processing carrier.

Claims

1. A method of processing a flexible substrate comprising:

providing a processing carrier having a silicone-comprising surface;

providing a flexible substrate having a pair of opposing surfaces, the opposing surfaces being a first surface and a second surface;

cleaning the first surface of the flexible substrate;

adhering the first surface of the flexible substrate to the silicone-comprising surface of the processing carrier after the cleaning; and

processing the second surface of the flexible substrate while the first surface of the flexible substrate is adhered with the silicone-comprising surface of the processing carrier.

2. The method of claim 1 wherein the flexible substrate comprises polyester.

3. The method of claim 1 wherein the silicone-comprising surface consists essentially of silicone.

4. The method of claim 1 wherein the adhering comprises adhering substantially an entirety of the first surface of the flexible substrate with the silicone-comprising surface.

5. The method of claim 1 further comprising cleaning the silicone-comprising surface prior to adhering the first surface of the flexible substrate to the silicone-comprising surface.

6. The method of claim 1 further comprising:

after the processing, removing the flexible substrate from the silicone-comprising surface;

after removing the flexible substrate, adhering another flexible substrate to the silicone-comprising surface, said other flexible substrate having a first surface contacting the silicone-comprising surface and a second surface opposing the first surface; and

processing the second surface of the other flexible substrate while the first surface of the other flexible substrate is adhered with the silicone-comprising surface of the processing carrier.

7. A method of processing a flexible substrate comprising:

providing a processing carrier having a surface;

providing a coupling member having an adhesive layer and a silicone-comprising surface;

first adhering the adhesive layer of the coupling member with the surface of the processing carrier;

providing a flexible substrate having a pair of opposing surfaces, the opposing surfaces being a first surface and a second surface;

second adhering the first surface of the flexible substrate to the silicone-comprising surface of the coupling member after the first adhering; and

processing the second surface of the flexible substrate while the first surface of the flexible substrate is adhered with the silicone-comprising surface of the processing carrier.

8. The method of claim 7 wherein the flexible substrate comprises polyester.

9. The method of claim 7 wherein the silicone-comprising surface consists essentially of silicone.

10. The method of claim 7 wherein the second adhering comprises adhering substantially an entirety of the first surface of the flexible substrate with the silicone-comprising surface.

11. The method of claim 7 further comprising cleaning the first surface of the flexible substrate prior to adhering the first surface to the silicone-comprising surface.

12. The method of claim 7 further comprising cleaning the silicone-comprising surface prior to adhering the first surface of the flexible substrate to the silicone-comprising surface.

13. The method of claim 7 further comprising:

after the processing, removing the flexible substrate from the silicone-comprising surface;

after removing the flexible substrate, adhering another flexible substrate to the silicone-comprising surface, said other flexible substrate having a first surface contacting the silicone-comprising surface and a second surface opposing the first surface; and

processing the second surface of the other flexible substrate while the first surface of the other flexible substrate is adhered with the silicone-comprising surface of the processing carrier.

14. A method of fixturing a flexible substrate comprising:

providing a processing carrier having a surface;

providing a coupling member having a silicone-comprising surface;

first applying the coupling member to the surface of the processing carrier using a roller leaving the silicone-comprising surface outwardly exposed;

providing a flexible substrate having a surface; and

second applying the surface of the flexible substrate to the silicone-comprising surface of the coupling member after the first applying.

15. The method of claim 14 wherein the silicone-comprising surface consists essentially of silicone.

16. The method of claim 14 wherein the adhering comprises adhering substantially an entirety of the surface of the flexible substrate with the silicone-comprising surface.

17. The method of claim 14 further comprising cleaning the surface of the flexible substrate prior to adhering the surface to the silicone-comprising surface.

18. The method of claim 14 further comprising cleaning the silicone-comprising surface prior to adhering the surface of the flexible substrate to the silicone-comprising surface.

19. A method of fixturing a flexible substrate comprising:

providing a processing carrier having a silicone-comprising surface;

providing a flexible substrate having a surface;

cleaning the surface of the flexible substrate; and

adhering the surface of the flexible substrate to the silicone-comprising surface of the processing carrier after the cleaning.

20. A method of fixturing a flexible substrate comprising:

providing a processing carrier having a surface;

first cleaning the surface of the processing carrier;

providing a coupling member having an adhesive layer and a silicone comprising surface;

first adhering the adhesive layer of the coupling member with the surface of the processing carrier using a roller after the first cleaning;

providing a flexible substrate having a surface;

second cleaning the surface of the flexible substrate; and

second adhering the surface of the flexible substrate to the silicone-comprising surface of the coupling member after the first adhering and the second cleaning.

21. The method according to claim 20 wherein the adhesive layer of the coupling member comprises a rubber based pressure sensitive adhesive layer.

22. The method according to claim 20 wherein the first and second cleanings individually comprise using a cleansing roller.

23. The method according to claim 20 wherein the first and second cleanings individually comprise using a cleansing agent.