×

Vacuum processing system having improved substrate heating and cooling

  • US 6,688,375 B1
  • Filed: 10/14/1997
  • Issued: 02/10/2004
  • Est. Priority Date: 10/14/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. An evacuable chamber of a vacuum processing system capable of simultaneously heating and cooling different substrates and including a first vacuum sealable passage on a first side of said chamber and a second vacuum sealable passage on a second side of said chamber for passing said substrates through said passages, comprising:

  • a first section in said chamber having first sidewalls including heating means incorporated therein capable of increasing a temperature of any of one or more first substrates disposed in said first section;

    a second section in said chamber having second sidewalls including cooling means incorporated therein capable of decreasing a temperature of any of one or more second substrates disposed in said second section, wherein said first section lacks cooling means corresponding to those provided in said second section and said second section lacks heating means corresponding to those provided in said first section;

    a plurality of shelves in said first section to support respective ones of said first substrates thereon;

    a plurality of shelves in said second section to support respective ones of said second substrates thereon; and

    means including a wall between said first and second sections for thermally isolating said first section from said second section.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×