Semiconductor device and method of manufacturing the same

• US 6,690,031 B1
• Filed: 04/20/1999
• Issued: 02/10/2004
• Est. Priority Date: 04/28/1998
• Status: Expired due to Term

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.), Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Ohtani, Hisashi, Nakazawa, Misako
• Primary Examiner(s): Baumeister, B. William
• Assistant Examiner(s): Lee, Eugene
• Application Number:
  US09/294,335
• Time in Patent Office: 1,757 Days
• Field of Search: 257/59, 257/72, 257/71, 257/353, 257/350, 257/68, 349/38, 349/39
• US Class Current: 257/71
• CPC Class Codes: G02F 1/136213 Storage capacitors associated with the pixel electrode
• CPC Class Codes: G02F 1/136227 Through-hole connection of the pixel electrode to the active element through an insulation layer
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors

Abstract

An electro-optical device including an auxiliary capacitance using a pair of transparent conductive films is improved to provide a semiconductor device with high quality. A first transparent conductive film and a capacitance insulating film are formed into a laminate on a leveling film, and an opening portion is formed. An insulating film is formed thereon, and a second transparent conductive film is patterned to form a pixel electrode. At this time, the auxiliary capacitance made of a structure in which the capacitance insulating film is sandwiched between the first transparent conductive film and the pixel electrode is formed.

Claims

1. A semiconductor device comprising:

at least a thin film transistor formed on an insulating film;

a first interlayer insulating film covering the thin film transistor;

a first transparent conductive film formed on the first interlayer insulating film;

a capacitance insulating film formed on the first transparent conductive film;

an opening portion formed by patterning the first transparent conductive film and the capacitance insulating film;

a second interlayer insulating film covering the opening portion and overlapping a portion of the first transparent conductive film and the capacitance insulating film;

a contact hole formed in the first interlayer insulating film and the second interlayer insulating film to reach the thin film transistor;

a second transparent conductive film formed on the capacitance insulating film and being electrically connected to the thin film transistor,

wherein a capacitor is formed between the first and second transparent conductive films with the capacitance insulating film interposed therebetween,

wherein the opening portion has a larger diameter than the contact hole.

2. A device according to claim 1, wherein the capacitance insulating film has a smaller thickness than the first transparent conductive film.

3. A device according to claim 1, wherein the capacitance insulating film is a transparent insulating film.

4. A device according to claim 1, wherein each of the first and second interlayer insulating films comprises a resin material.

5. A device according to claim 1, wherein the capacitance insulating film comprises one selected from the group consisting of silicon oxide, silicon nitride, silicon nitride oxide, tantalum oxide and aluminum oxide (alumina).

6. A device according to claim 1, wherein the capacitance insulating film has a thickness in a range of 10-200 nm.

7. A device according to claim 1, wherein the semiconductor device is one selected from the group consisting of an active matrix type liquid crystal display, an active matrix type EL display, and an active matrix type EC display.

8. A device according to claim 1, wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector (rear type or front type), a head mount display (a goggle type display), a car navigation system, a personal computer, a portable information terminal such as a mobile computer, a portable telephone, or an electric book.

13. A device according to claim 1, wherein the capacitance insulating film is a transparent insulating film.

9. A semiconductor device comprising:

at least a thin film transistor formed on an insulating surface;

a first interlayer insulating film covering the thin film transistor;

a first transparent conductive film formed on the first interlayer insulating film;

a capacitance insulating film formed on the first transparent conductive film;

an opening portion formed in the first transparent conductive film and the capacitance insulating film;

a second interlayer insulating film covering the opening portion and overlapping a portion of the first transparent conductive film and the capacitance insulating film;

a contact hole formed in the first interlayer insulating film and the second interlayer insulating film to reach the thin film transistor;

a second transparent conductive film formed on the capacitance insulating film and being electrically connected to the thin film transistor, wherein said second transparent conductive film extends over said second interlayer insulating film,

wherein a capacitor is formed between the first and second transparent conductive films with the capacitance insulating film interposed therebetween,

wherein the second interlayer insulating film comprises a light shielding resin material.

10. A device according to claim 9, wherein the second interlayer insulating film includes one selected from the group consisting of a light shielding resin film, and a laminated structure of a light shielding resin film and a transparent resin film.

11. A device according to claim 9, wherein a portion of the second interlayer insulating film is removed with the second transparent conductive film as a mask.

12. A device according to claim 9, wherein the capacitance insulating film has a smaller thickness than the first transparent conductive film.

14. A device according to claim 9, wherein each of the first and second interlayer insulating films comprises a resin material.

15. A device according to claim 9, wherein the capacitance insulating film comprises one selected from the group consisting of silicon oxide, silicon nitride, silicon nitride oxide, tantalum oxide and aluminum oxide (alumina).

16. A device according to claim 9, wherein the capacitance insulating film has a thickness in a range of 10-200 nm.

17. A device according to claim 9, wherein the semiconductor device is one selected from the group consisting of an active matrix type liquid crystal display, an active matrix type EL display, and an active matrix type EC display.

18. A device according to claim 9, wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector (rear type or front type), a head mount display (a goggle type display), a car navigation system, a personal computer, a portable information terminal such as a mobile computer, a portable telephone, or an electric book.

19. A semiconductor device comprising:

at least a thin film transistor formed on an insulating surface;

a first interlayer insulating film covering the thin film transistor;

a first transparent conductive film formed on the first interlayer insulating film;

a capacitance insulating film formed on the first transparent conductive film;

an opening portion formed by patterning the first transparent conductive film and the capacitance insulating film;

a second interlayer insulating film covering the opening portion and overlapping a portion of the first transparent conductive film and the capacitance insulating film;

a contact hole formed in the first interlayer insulating film and the second interlayer insulating film to reach the thin film transistor;

a second transparent conductive film formed on the capacitance insulating film and being electrically connected to the thin film transistor,

wherein a capacitor is formed between the first and second transparent conductive films with the capacitance insulating film interposed therebetween,

wherein the opening portion has a step-like shape.

20. A device according to claim 19, wherein each of the first and second interlayer insulating film comprises a resin material.

21. A device according to claim 19, wherein the capacitance insulating film is a transparent insulating film.

22. A device according to claim 19, wherein the capacitance insulating film comprises one selected from the group consisting of silicon oxide, silicon nitride, silicon nitride oxide, tantalum oxide and aluminum oxide (alumina).

23. A device according to claim 19, wherein the capacitance insulating film has a thickness in a range of 10-200 nm.

24. A device according to claim 19, wherein the semiconductor device is one selected from the group consisting of an active matrix type liquid crystal display, an active matrix type EL display, and an active matrix type EC display.

25. A device according to claim 19, wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector (rear type or front type), a head mount display (a goggle type display), a car navigation system, a personal computer, a portable information terminal such as a mobile computer, a portable telephone, or an electric book.

26. A semiconductor device comprising:

at least a thin film transistor formed on an insulating film;

a first interlayer insulating film covering the thin film transistor;

a first transparent conductive film formed on the first interlayer insulating film;

a capacitance insulating film formed on the first transparent conductive film;

an opening portion formed in the first transparent conductive film and the capacitance insulating film;

a second interlayer insulating film covering the opening portion and overlapping a portion of the first transparent conductive film and the capacitance insulating film;

a contact hole formed in the first interlayer insulating film and the second interlayer insulating film to reach the thin film transistor;

a second transparent conductive film formed on the capacitance insulating film and being electrically connected to the thin film transistor,

wherein a capacitor is formed between the first and second transparent conductive films with the capacitance insulating film interposed therebetween,

wherein the first transparent conductive film and the capacitance insulating film have a same pattern shape.

27. A device according to claim 26, wherein the capacitance insulating film has a smaller thickness than the first transparent conductive film.

28. A device according to claim 26, wherein the capacitance insulating film is a transparent insulating film.

29. A device according to claim 26, wherein the capacitance insulating film comprises one selected from the group consisting of silicon oxide, silicon nitride, silicon nitride oxide, tantalum oxide and aluminum oxide (alumina).

30. A device according to claim 26, wherein the capacitance insulating film has a thickness in a range of 10-200 nm.

31. A device according to claim 26, wherein the semiconductor device is one selected from the group consisting of an active matrix type liquid crystal display, an active matrix type EL display, and an active matrix type EC display.

32. A device according to claim 26, wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector (rear type or front type), a head mount display (a goggle type display), a car navigation system, a personal computer, a portable information terminal such as a mobile computer, a portable telephone, or an electric book.