Electro-optical device and method of manufacture thereof, and electronic instrument

• US 6,690,032 B1
• Filed: 03/22/2001
• Issued: 02/10/2004
• Est. Priority Date: 07/22/1999
• Status: Expired due to Term

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Umetsu, Kazushige
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): SEFER, AHMED N
• Application Number:
  US09/787,744
• Time in Patent Office: 1,055 Days
• Field of Search: 257/72, 257/621, 257/684, 349/128
• US Class Current: 257/72
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 2201/42 Arrangements for providing conduction through an insulating substrate

Abstract

An electro-optical device comprises first and second substrates (10, 20) disposed facing each other, an interconnect (14) formed on the surface of the first substrate (10) opposing the second substrate (20), and a conductive member (40) passing through the second substrate (20) and reaching both surfaces of the second substrate (20), and the conductive member (40) and interconnect (14) are electrically connected between the first and second substrates (10, 20).

Claims

1. An electro-optical device comprising:

first and second substrates disposed to oppose each other;

an interconnect formed on a surface of the first substrate opposing the second substrate;

a conductive member provided to pass through the second substrate;

a conductor disposed on an opposite side of the second substrate from the first substrate, the conductor electrically connected to the conductive member, the conductor extending to overlap with the interconnect; and

a vertical conductive member provided between the interconnect and the conductive member, the vertical conductive member provided on the conductive member,

wherein the conductive member and the interconnect are electrically connected between the first and second substrates.

2. The electro-optical device as defined in claim 1, further comprising an integrated circuit chip disposed on an opposite side of the second substrate from the first substrate,

wherein the conductor is electrically connected to the integrated circuit chip.

3. The electro-optical device as defined in claim 1,

wherein a plurality of the interconnects are formed, and

wherein a plurality of the conductive members electrically connected to the plurality of interconnects are provided.

4. The electro-optical device as defined in claim 3,

wherein the plurality of conductive members are arranged in a zigzag.

5. The electro-optical device as defined in claim 1,

wherein the conductive member is formed on a part of the second substrate which overlaps with the first substrate.

6. The electro-optical device as defined in claim 1,

wherein the first and second substrates are adhered together by a sealant, and

wherein the conductive member is formed on a portion of the second substrate which overlaps with the sealant.

7. The electro-optical device as defined in claim 6,

wherein the sealant is an anisotropic conductive adhesive material.

8. An electronic instrument comprising the electro-optical device as defined in claim 1.

9. An electro-optical device comprising:

first and second substrates disposed to oppose each other, the second substrate having a penetrating hole formed therein;

an interconnect formed on the surface of the first substrate opposing the second substrate;

a conductive member provided in the penetrating hole; and

a vertical conductive member provided between the interconnect and the conductive member, the vertical conductive member provided on the conductive member,

wherein the conductive member and the interconnect are electrically connected between the first and second substrates,

wherein the first and second substrates are adhered together by a sealant, and

wherein the conductive member is formed closer to an end of the second substrate than the sealant.

10. An electronic instrument comprising the electro-optical device as defined in claim 9.

11. An electro-optical device comprising:

first and second substrates disposed to oppose each other;

an interconnect formed on a surface of the first substrate opposing the second substrate;

a conductive member provided to pass through the second substrate; and

a vertical conductive member provided between the interconnect and the conductive member, the vertical conductive member provided on the conductive member,

wherein the conductive member and the interconnect are electrically connected between the first and second substrates,

wherein the first and second substrates are adhered together by a sealant, and

wherein the conductive member is formed closer to a center of the substrate than the sealant.

12. An electronic instrument comprising the electro-optical device as defined in claim 11.