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Methods and structures for electronic probing arrays

  • US 6,690,186 B2
  • Filed: 10/24/2001
  • Issued: 02/10/2004
  • Est. Priority Date: 07/07/1994
  • Status: Expired due to Fees
First Claim
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1. A method of testing an electronic element comprising:

  • (a) providing a probe card including a substrate having electrical circuitry thereon, a encapsulant layer overlying a surface of said substrate, and a plurality of leads permanently bonded to said electrical circuitry extending upwardly from said substrate through said encapsulant layer, said leads having terminals remote from said substrate projecting from said encapsulant layer said leads having flexible portions disposed within the encapsulant layer;

    (b) temporarily engaging said terminals with contact pads on the electronic element by urging said substrate and said electronic element towards one another, so as to deform said flexible portions of said leads and said encapsulant layer; and

    (c) while said terminals are engaged with said contact pads, operating said electronic element so that signals are sent between said electronic element and said circuitry on said substrate through said engaged contact pads and terminals and through said leads.

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