×

Heat-reduction methods and systems related to microfluidic devices

  • US 6,692,700 B2
  • Filed: 02/14/2001
  • Issued: 02/17/2004
  • Est. Priority Date: 02/14/2001
  • Status: Expired due to Term
First Claim
Patent Images

1. A microfluidic device comprising:

  • a first planar substrate having a first side;

    a second planar substrate having a first side and an opposing second side;

    a third planar substrate having a first side;

    wherein (a) the respective first sides of the first and second planar substrates abut one another and (b) the second side of the second planar substrate and the first side of the third planar substrate abut one another and further wherein the respective first sides of the first and second planar substrates comprise therebetween a microfluidic complex having a heating region, said heating region including a heating surface;

    a heating element sandwiched between the first side of the second planar substrate and the second side of the second planar substrate and separated from fluid present within the heating region by a portion of the second planar substrate, the heating element configured to provide heat to said heating region through said heating surface; and

    a conductive lead for supplying electric current from a current source to said heating element, said conductive lead being substantially more conductive than said heating element so as to reduce heat emitted by said conductive lead.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×