Methods of fabricating optoelectronic IC modules

• US 6,692,979 B2
• Filed: 08/13/2001
• Issued: 02/17/2004
• Est. Priority Date: 08/13/2001
• Status: Expired due to Fees

• Current Assignee: Kaiwood Technology Company Limited
• Original Assignee: Optics Technology, Inc.
• Inventors: Zhai, Jinhui, Yeh, Jang-Hun, Wen, Xueya
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): VESPERMAN, WILLIAM C
• Application Number:
  US09/928,528
• Publication Number:
  US 20030032209A1
• Time in Patent Office: 918 Days
• Field of Search: 438/24, 438/25, 438/26, 438/27, 438/29, 438/33, 438/34, 438/55, 438/56, 438/69, 438/71, 438/459
• US Class Current: 438/27
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: H01S 5/0216 using an intermediate compound, e.g. a glue or solder
• CPC Class Codes: H01S 5/0217 Removal of the substrate
• CPC Class Codes: H01S 5/141 using a wavelength selective device, e.g. a grating or etalon H01S5/146 takes precedence
• CPC Class Codes: H01S 5/18305 with emission through the substrate, i.e. bottom emission
• CPC Class Codes: H01S 5/18311 using selective oxidation
• CPC Class Codes: H01S 5/423 having a vertical cavity

Abstract

A optoelectronic module comprises one or more VCSELs electrically connected to an IC and optically connected to a fiber optic faceplate. The fiber optic faceplate, comprising a closely packed bundle of optical fibers, permits efficient capture of light from the VCSELs. Precise alignment of the faceplate with respect to the VCSELs is not needed since light not collected by one fiber is captured by another nearby optical fiber. One method of fabricating the module comprises forming substrate layers on both sides of the VCSELs such that features can be formed on the first substrate layer while the second temporary substrate layer provides structural support. The method further comprises forming apertures on the first substrate layer by etching. An etch stop buffer layer positioned between the first substrate layer and the VCSELs protects the VCSELs from being etched in the process. The second temporary substrate layer is removed after the fiber optic faceplate is mounted on the first substrate side. An alternate method of VCSEL fabrication comprises forming an aperture by patterning a dielectric layer above an active layer within the VCSEL. The aperture in the dielectric layer can be formed with a high degree of precisely using conventional patterning techniques. The dielectric layer is part of a current confinement element that concentrates current in an active region. A top DBR can also be formed of multiple layers of dielectric.

Claims

1. A method of forming an optoelectronic module, comprising:

forming a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) on a substrate;

removing a portion of the substrate;

etching openings through the thickness of the substrate for light from the VCSELs to pass;

mounting a fiber optic faceplate which receives light from said etched openings at the location of the removed substrate to provide optical access to said VCSELs;

stabilizing the VCSELs prior to mounting the fiber optic faceplate by affixing a temporary substrate to the VCSELs; and

removing said temporary substrate after mounting the fiber optic faceplate to the VCSELs.

2. The method of claim 1, wherein a layer of the substrate is removed so that said substrate is less than about 150 μ

m thick.

3. The method of claim 1, wherein said temporary substrate comprises glass.

4. A method of forming an optoelectronic module, comprising:

forming a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) on a substrate;

removing a layer of the substrate so that said substrate is less than about 150 μ

m thick;

mounting a substantially optically transmissive element at the location of the removed substrate to provide optical access to said VCSELs; and

stabilizing the VCSELs prior to mounting the optically transmissive element by affixing a temporary substrate to the VCSELs,

wherein interstices between adjacent VCSELs are filled with a filler material and a temporary substrate is adhered to said filler material.

5. The method of claim 4, further comprising removing said temporary substrate after the optically transmissive element is mounted to the VCSELs.

6. The method of claim 4, wherein said temporary substrate comprises glass.

7. The method of claim 6, wherein said filler material comprises wax and glue.

8. A method of forming an optoelectronic module, comprising:

forming a plurality of optoelectronic devices comprising Vertical Cavity Surface Emitting Lasers (VCSELs) and optical detectors on a substrate;

removing a portion of the substrate;

etching openings through the thickness of the substrate for light to pass;

mounting a fiber faceplate that directs light into said etched openings at the location of the removed substrate to provide optical access to said optoelectronic devices; and

stabilizing the optoelectronic devices prior to mounting the fiber faceplate by affixing a temporary substrate to the optoelectronic devices.

9. The method of claim 8, wherein a layer of the substrate is removed so that said substrate is less than about 150 μ

m thick.

10. The method of claim 8, further comprising removing said temporary substrate after the fiber faceplate is mounted to the VCSELs.

11. A method of forming an optoelectronic module, comprising:

forming a plurality of optoelectronic devices comprising Vertical Cavity Surface Emitting Lasers (VCSELs) and optical detectors devices on a substrate;

removing a portion of the substrate;

etching openings through the thickness of the substrate for light to pass;

mounting a substantially optically transmissive element at the location of the removed substrate to provide optical access to said optoelectronic devices; and

stabilizing the optoelectronic devices prior to mounting the optically transmissive element by affixing a temporary substrate to the optoelectronic devices,

wherein interstices between adjacent optical detectors are filled with a filler material and a temporary substrate is adhered to said filler material.

12. The method of claim 11, wherein said temporary substrate comprises glass.

13. The method of claim 11, wherein said temporary substrate comprises glass.

14. The method of claim 11, wherein said filler material comprises material selected from the group consisting of wax and glue.

15. A method of forming an optoelectronic module, comprising:

forming a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) on a substrate;

removing a layer of the substrate so that said substrate is less than about 150 μ

m tick;

mounting a faceplate at the location of the removed substrate to provide optical access to said VCSELs;

stabilizing the VCSELs prior to mounting the faceplate by affixing a temporary substrate to the VCSELs; and

mounting on said faceplate an optical element that redirects said light from said VCSELS in a substantially perpendicular direction.

16. The method of claim 15, comprising mounting a wedge-shaped fiber optic faceplate on said faceplate, said wedge-shaped fiber optic face plate comprising a plurality of optical fibers aligned lengthwise parallel to each other and a reflective surface oriented at an angle with respect to lengthwise parallel optical fibers to couple light thereto.

17. The method of claim 15, wherein said temporary substrate comprises glass.

18. The method of claim 15, further comprising removing said temporary substrate after the faceplate is mounted to the VCSELs.