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Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure

  • US 6,693,350 B2
  • Filed: 12/18/2002
  • Issued: 02/17/2004
  • Est. Priority Date: 11/24/1999
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a first conductive member;

    a second conductive member;

    a semiconductor chip, which is located between the conductive members;

    a bonding member, which is located between the first conductive member and the semiconductor chip;

    another bonding member, which is located between the second conductive member and the semiconductor chip;

    a molding resin, which is located between the first and second conductive members to seal the semiconductor chip and bonding members; and

    a bonding member anti-sticking means, which is located between the molding resin and a surface of one member selected from the group consisting of the semiconductor chip and the conductive members, wherein the bonding member anti-sticking means has prevented the bonding members from sticking to the surface.

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