Solid-state image-pickup device and method of mounting solid-state image-pickup device

• US 6,693,674 B1
• Filed: 05/19/1998
• Issued: 02/17/2004
• Est. Priority Date: 05/23/1997
• Status: Expired due to Term

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Wataya, Yukinobu, Sekimoto, Emiko
• Primary Examiner(s): Garber, Wendy R.
• Assistant Examiner(s): Tillery, Rashawn N.
• Application Number:
  US09/080,669
• Time in Patent Office: 2,100 Days
• Field of Search: 348/373, 348/374, 348/375, 348/376, 348/294, 348/340, 348/335, 257/433, 257/432, 257/431, 257/434
• US Class Current: 348/373
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence

Abstract

A pilot opening to the outside is formed at one side end of a package for a solid-state image-pickup device and a guide opening to the outside is formed at a side end opposite to and approximately in parallel with the one side end of the package. The pilot is made to face a pilot pin projecting above a circuit board and a guide pin is inserted into the guide. The solid-state image-pickup device is then fixed at a prescribed position on the circuit board after the pilot comes into contact with the pilot pin. With a solid-state-,image-pickup device and a mounting method thus provided, package size does not become large and mounting is carried out with an extremely high positioning precision.

Claims

1. An electronic device having a chip mounted on a chip-mounting part provided on an upper surface of a package, with electrode pads of said chip being connected to tips of external leads, and a transparent optically flat plate being bonded to said upper surface of said package so that said chip is sealed within said package, said electronic device comprising:

a pilot opening to the outside at a side end of said package; and

a guide opening to the outside, at a side end opposite to and approximately in parallel with said side end,

wherein said pilot opening is cut-out so as to open to the outside and appear as an approximate V-shape in a plan view and said guide opening is cutout so as to open to the outside and appear as an approximate U-shape in a plan view.

2. The electronic device of claim 1, wherein said chip is a solid-state image-pickup element.

3. A method of mounting an electronic device on an electronic component, said electronic device having a pilot and a guide of prescribed shapes respectively provided at side ends approximately opposite to each other, comprising the steps of:

positioning said electronic device on said electronic component by inserting a guide pin protruding from or via said electronic component to said guide with a pilot pin protruding from or via said electronic component being brought into contact with said pilot; and

mounting said electronic device on said electronic component,

wherein said pilot is cut-out so as to open to the outside and appear as an approximate V-shape in a plan view, and said guide is cut-out so as to open to the outside and appear as an approximate U-shape in a plan view.

4. The method of mounting an electronic device of claim 3, wherein said electronic component is a circuit board.

5. The method of mounting an electronic device of claim 4, further comprising the steps of:

preparing a pin support jig on which said pilot pin and said guide pin are provided at a prescribed pin spacing; and

inserting said pilot pin and said guide pin into guide holes of said circuit board provided at a spacing identical to said pin spacing.

6. The method of mounting an electronic device of claim 3, wherein said electronic component is a lens block.

7. The method of mounting an electronic device of claim 3, wherein said electronic device is a solid-state image-pickup device.

8. An electronic device comprising:

a package having a top surface, a bottom surface opposite said top surface, a pilot surface adjacent said top and bottom surfaces, a guide surface opposite said pilot surface and adjacent said top and bottom surfaces, a pilot opening, and a guide opening;

said pilot opening being a groove within said pilot surface that extends from said top surface to said bottom surface, a pilot pin being inserted through said pilot opening;

said guide opening being a groove within said guide surface that extends from said top surface to said bottom surface, a guide pin being inserted through said guide opening,

said pilot opening having a shape different than a shape of said guide opening.

9. The electronic device of claim 8, wherein said electronic device further comprises:

a solid-state device mounted to said package.

10. The electronic device of claim 9, wherein said solid-state device is a solid-state image-pickup element,

a transparent plate being attached to said top surface to encase said solid-state device within said package,

electrode pads of said solid-state device being connected to tips of external leads.

11. The electronic device of claim 8, wherein said pilot opening is located at a first distal end of said package, and said guide opening is located at a second distal end of said package, said second distal end being opposite to said first distal end.

12. The electronic device of claim 8, wherein said pilot opening has an approximate V-shape in a plan view, and said guide opening has an approximate U-shape in said plan view.

13. A method of mounting an electronic device on an electronic component comprising the steps of:

inserting a pilot pin through a pilot opening of said electronic device;

inserting a guide pin through a guide opening of said electronic device;

said electronic device including a package having a top surface, a bottom surface opposite said top surface, a pilot surface adjacent said top and bottom surfaces, a guide surface opposite said pilot surface and adjacent said top and bottom surfaces, said pilot opening, and said guide opening,

said pilot opening being a groove within said pilot surface that extends from said top surface to said bottom surface,

said guide opening being a groove within said guide surface that extends from said top surface to said bottom surface

said pilot opening having a shape different than a shape of said guide opening.

14. The method of mounting an electronic device of claim 13, further comprising the steps of:

inserting said pilot pin through a first insertion hole of said electronic component;

inserting said guide pin through a second insertion hole of said electronic component;

mating said electronic device with said electronic component.

15. The method of mounting an electronic device of claim 14, wherein said pilot pin and said guide pin are disposed on a pin support jig at a prescribed pin spacing.

16. The method of mounting an electronic device of claim 14, wherein said electronic component is a circuit board.

17. The method of mounting an electronic device of claim 14, further comprising the steps of:

removing said pilot pin from said first insertion hole;

removing said guide pin from said second insertion hole.

18. The method of mounting an electronic device of claim 13, wherein said pilot opening has an approximate V-shape in a plan view, and said guide opening has an approximate U-shape in said plan view.

19. A camera comprising:

a solid-state image-pickup device, said solid-state image-pickup device including a package, a solid-state image-pickup element, and a lens block;

said solid-state image-pickup element mounted on an image-pickup element mounting part provided on a top surface of said package,

electrode pads of said solid-state image-pickup element being connected to tips of external leads;

a transparent optically flat plate being bonded to said top surface of said package to encase said image-pickup element within said package;

said package having said top surface, a bottom surface opposite said top surface, a pilot surface adjacent said top and bottom surfaces, a guide surface opposite said pilot surface and adjacent said top and bottom surfaces, said pilot opening, and said guide opening,

said pilot opening being a groove within said pilot surface that extends from said top surface to said bottom surface, a pilot pin being inserted through said pilot opening,

said guide opening being a groove within said guide surface that extends from said top surface to said bottom surface, a guide pin being inserted through said pilot opening;

said pilot pin and said guide pin extending from said lens block,

said pilot opening having a shape different than a shape of said guide opening.

20. The camera of claim 19, wherein said pilot opening has an approximate V-shape in a plan view, and said guide opening has an approximate U-shape in said plan view.

21. An electronic device comprising:

a package having a top surface, a bottom surface opposite said top surface, a pilot surface adjacent said top and bottom surfaces, a guide surface opposite said pilot surface and adjacent said top and bottom surfaces, a pilot opening, and a guide opening;

said pilot opening being a groove within said pilot surface that extends from said top surface to said bottom surface, a pilot pin being inserted through said pilot opening;

said guide opening being a groove within said guide surface that extends from said top surface to said bottom surface, a guide pin being inserted through said guide opening,

said pilot opening being unbounded by said pilot surface and said guide opening being unbounded by said guide surface.

22. A method of mounting an electronic device on an electronic component comprising the steps of:

inserting a pilot pin through a pilot opening of said electronic device;

inserting a guide pin through a guide opening of said electronic device;

said electronic device including a package having a top surface, a bottom surface opposite said top surface, a pilot surface adjacent said top and bottom surfaces, a guide surface opposite said pilot surface and adjacent said top and bottom surfaces, said pilot opening, and said guide opening,

said pilot opening being a groove within said pilot surface that extends from said top surface to said bottom surface,

said guide opening being a groove within said guide surface that extends from said top surface to said bottom surface,

said pilot opening being unbounded by said pilot surface and said guide opening being unbounded by said guide surface.

23. A camera comprising:

a solid-state image-pickup device, said solid-state image-pickup device including a package, a solid-state image-pickup element, and a lens block;

said solid-state image-pickup element mounted on an image-pickup element mounting part provided on a top surface of said package,

electrode pads of said solid-state image-pickup element being connected to tips of external leads;

a transparent optically flat plate being bonded to said top surface of said package to encase said image-pickup element within said package;

said package having said top surface, a bottom surface opposite said top surface, a pilot surface adjacent said top and bottom surfaces, a guide surface opposite said pilot surface and adjacent said top and bottom surfaces, said pilot opening, and said guide opening,

said pilot opening being a groove within said pilot surface that extends from said top surface to said bottom surface, a pilot pin being inserted through said pilot opening,

said guide opening being a groove within said guide surface that extends from said top surface to said bottom surface, a guide pin being inserted through said pilot opening;

said pilot pin and said guide pin extending from said lens block,

said pilot opening being unbounded by said pilot surface and said guide opening being unbounded by said guide surface.