Double-sided copper clad laminate for capacitor layer formation and its manufacturing method
First Claim
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1. A multilayered construction suitable for forming capacitors which comprises sequentially attached layers comprising:
- a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.
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Abstract
The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The capacitor comprises a pair of parallel conductive foils separated by a pair of dielectric layers. The dielectric layers are further separated by a heat resistant film layer such that the capacitor exhibits excellent short circuit resistance. The resulting capacitor exhibits excellent void and electrical short resistance.
55 Citations
38 Claims
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1. A multilayered construction suitable for forming capacitors which comprises sequentially attached layers comprising:
- a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A capacitor which comprises sequentially attached layers comprising:
- a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.
- View Dependent Claims (24, 25, 26, 27)
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28. A method of forming a multilayered construction for forming capacitors which comprises sequentially attaching layers comprising a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.
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29. A method of forming a multilayered construction for forming capacitors which comprises attaching a first thermosetting polymer layer to a surface of a first electrically conductive layer;
- attaching a second thermosetting polymer layer to surface of a second electrically conductive layer; and
then laminating the first and second thermosetting polymer layers to opposite surfaces of a heat resistant film layer. - View Dependent Claims (30, 31, 32)
- attaching a second thermosetting polymer layer to surface of a second electrically conductive layer; and
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33. A method of forming a multilayered construction for forming capacitors which comprises attaching a first thermosetting polymer layer to a first surface of a heat resistant film layer;
- attaching a second thermosetting polymer layer to a second opposite surface of the heat resistant film layer;
applying a first electrically conductive layer to the first thermosetting polymer layer and applying a second electrically conductive layer to the second thermosetting polymer layer. - View Dependent Claims (34, 35, 36, 37, 38)
- attaching a second thermosetting polymer layer to a second opposite surface of the heat resistant film layer;
Specification