Double-sided copper clad laminate for capacitor layer formation and its manufacturing method

• US 6,693,793 B2
• Filed: 10/15/2001
• Issued: 02/17/2004
• Est. Priority Date: 10/15/2001
• Status: Active Grant

• Current Assignee: Mitsui Mining and Smelting Company Limited
• Original Assignee: Mitsui Mining and Smelting Company Limited
• Inventors: Yamazaki, Kazuhiro, Matsushima, Toshifumi, Kuwako, Fujio
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): THOMAS, ERIC W
• Application Number:
  US09/981,296
• Publication Number:
  US 20030072129A1
• Time in Patent Office: 855 Days
• Field of Search: 361/303-305, 361/306.1, 361/306.2, 361/306.3, 361/311, 361/312, 361/313, 361/323, 29/254.2
• US Class Current: 361/323
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/20 using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 H01G4/12 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2203/0307 Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• CPC Class Codes: H05K 3/384 by plating
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The capacitor comprises a pair of parallel conductive foils separated by a pair of dielectric layers. The dielectric layers are further separated by a heat resistant film layer such that the capacitor exhibits excellent short circuit resistance. The resulting capacitor exhibits excellent void and electrical short resistance.

Claims

1. A multilayered construction suitable for forming capacitors which comprises sequentially attached layers comprising:

a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.

2. The multilayered construction of claim 1 wherein the electrically conductive layers independently comprise a material selected from the group consisting of copper, zinc, brass, chrome, nickel, aluminum, stainless steel, iron, gold, silver, titanium, platinum and combinations thereof.

3. The multilayered construction of claim 1 wherein the electrically conductive layers comprises copper.

4. The multilayered construction of claim 1 wherein the electrically conductive layers comprise copper foils having a surface roughness Rz in the range of from about 0.5 μ

m to about 5 μ

m.

5. The multilayered construction of claim 1 wherein the electrically conductive layers are provided with a bond enhancing treatment on one or both sides thereof.

6. The multilayered construction of claim 1 wherein the electrically conductive layers are provided with a bond enhancing treatment which comprises treatment with metal nodules, nickel, chromium, chromates, zinc, a silane coupling agent or combinations thereof.

7. The multilayered construction of claim 1 wherein the combined thickness of the first thermosetting polymer layer, the heat resistant film layer, and the second thermosetting polymer layer is about 25 μ

m or less.

8. The multilayered construction of claim 1 wherein the thickness of the heat resistant film layer is about 12.5 μ

m or less.

9. The multilayered construction of claim 1 wherein one or both of the first thermosetting polymer layer and the second thermosetting polymer layer comprise an epoxy, a melamine, an unsaturated polyester, a urethane, alkyd, a bis-maleimide triazine, a polyimide, an ester, an allyated polyphenylene ether or combinations thereof.

10. The multilayered construction of claim 1 wherein one or both of the first thermosetting polymer layer and the second thermosetting polymer layer comprise an epoxy and a material which polymerizes with an epoxy.

11. The multilayered construction of claim 1 wherein the heat resistant film layer comprises a polyethylene terephthalate, a polyethylene naphthalate, a polyvinyl carbazole, a polyphenylene sulfide, an aromatic polyamide, a polyimide, a polyamide-polyimide, a polyether-nitrile, a polyether-ether-ketone, or combinations thereof.

12. The multilayered construction of claim 1 wherein the heat resistant film layer comprises an aromatic polyamide.

13. The multilayered construction of claim 1 wherein the heat resistant film layer has a VICAT softening point of about 150°

C. or higher as determined by ISO 306.

14. The multilayered construction of claim 1 wherein the heat resistant film layer comprises an aromatic polyamide;

wherein the electrically conductive layers comprise copper and wherein the first thermosetting polymer layer and the second thermosetting polymer layer comprise an epoxy.

15. The multilayered construction of claim 1 wherein the first thermosetting polymer layer and the second thermosetting polymer layer are attached to the heat resistant film layer by lamination;

wherein the heat resistant film layer has a Young'"'"'s modulus of about 300 kgf/mm² or more, a tensile strength of about 20 kg/mm² or more and an elongation of about 5% or more, and a higher softening temperature than the lamination temperature of the first thermosetting polymer layer and the second thermosetting polymer layer to the heat resistant film layer.

16. The multilayered construction of claim 1 wherein the dielectric constant of each of the first thermosetting polymer layer, the heat resistant film layer, and the second thermosetting polymer layer is about 2.5 or more.

17. The multilayered construction of claim 1 wherein at least one of the first thermosetting polymer layer, the heat resistant film layer, and the second thermosetting polymer layer comprises a powdered filler of a ferroelectric material, barium titanate, boron nitride, aluminum oxide, strontium titanate, barium strontium titanate, or other ceramics or combinations thereof.

18. The multilayered construction of claim 1 wherein at least one of the first thermosetting polymer layer, the heat resistant film layer, and the second thermosetting polymer layer comprises a powdered filler having a dielectric constant of about 10 or higher.

19. The multilayered construction of claim 1 which has a dielectric strength of at least about 19,685 volts/mm thickness.

20. The multilayered construction of claim 1 wherein the heat resistant film has a dielectric breakdown voltage of at least about 20 volts.

21. The multilayered construction of claim 1 wherein the heat resistant film has a dielectric breakdown voltage of at least about 250 volts.

22. The multilayered construction of claim 1 wherein the heat resistant film has a dielectric breakdown voltage of at least about 500 volts.

23. A capacitor which comprises sequentially attached layers comprising:

a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.

24. The capacitor of claim 23 further comprising an electrical connection to the first electrically conductive layer and another electrical connection to the second electrically conductive layer.

25. A printed circuit board comprising the capacitor of claim 23.

26. An electronic device comprising the printed circuit board of claim 25.

27. An electronic device comprising the capacitor of claim 23.

28. A method of forming a multilayered construction for forming capacitors which comprises sequentially attaching layers comprising a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.

29. A method of forming a multilayered construction for forming capacitors which comprises attaching a first thermosetting polymer layer to a surface of a first electrically conductive layer;

attaching a second thermosetting polymer layer to surface of a second electrically conductive layer; and

then laminating the first and second thermosetting polymer layers to opposite surfaces of a heat resistant film layer.

30. The method of claim 29 wherein one or both of the first thermosetting polymer layer and the second thermosetting polymer layer is only partially cured prior to the laminating step.

31. The method of claim 29 wherein a surface of at least one side of the heat resistant film layer is subjected to a bond enhancing treatment prior to lamination.

32. The method of claim 29 wherein the bond enhancing treatment comprises a plasma treatment, a corona treatment, a chemical treatment or combinations thereof.

33. A method of forming a multilayered construction for forming capacitors which comprises attaching a first thermosetting polymer layer to a first surface of a heat resistant film layer;

attaching a second thermosetting polymer layer to a second opposite surface of the heat resistant film layer;

applying a first electrically conductive layer to the first thermosetting polymer layer and applying a second electrically conductive layer to the second thermosetting polymer layer.

34. The method of claim 33 wherein the electrically conductive layers are applied to the thermosetting polymer layers by lamination.

35. The method of claim 33 wherein the electrically conductive layers are applied to the thermosetting polymer layers by vapor deposition, sputtering, plating or combinations thereof.

36. The method of claim 33 comprising laminating the first electrically conductive layer to the first thermosetting polymer layer and laminating the second electrically conductive layer to the second thermosetting polymer layer.

37. The method of claim 33 wherein one or both of the first thermosetting polymer layer and the second thermosetting polymer layer is only partially cured prior to the laminating step.

38. The method of claim 33 wherein a surface of at least one side of the heat resistant film layer is subjected to a bond enhancing treatment prior to lamination.