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Method for manufacturing a substrate-for-wiring/ wiring harness

  • US 6,694,203 B2
  • Filed: 04/02/2002
  • Issued: 02/17/2004
  • Est. Priority Date: 07/07/1997
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a substrate for wiring, comprising the steps of:

  • preparing the substrate, directly drawing a wiring diagram in actual size on the substrate, or fixing a sheet illustrating the wiring diagram in actual size on the substrate, disposing a supporting member for wiring at least a position of locating a binding part in the wiring diagram, wherein said wiring diagram is drawn by using harness information generated by the following steps, inputting entities representing connectors, binding parts, wiring length information of the wirings from an input device, inputting a desired wiring arrangement from the input device by referring to a wiring arrangement diagram generated based on the entities and the length information and displayed on the display device, wherein said wiring arrangement diagram includes lines that correspond to the wirings and do not have a length corresponding to actual length of the wirings, and generating the harness information based on the entities and the length information of the desired wiring arrangement.

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