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Method and device for determining an operating temperature of a semiconductor component

  • US 6,694,282 B2
  • Filed: 03/25/2002
  • Issued: 02/17/2004
  • Est. Priority Date: 03/26/2001
  • Status: Expired due to Term
First Claim
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1. A method for determining an operating temperature of a semiconductor component during operation, the semiconductor component comprising a PROM memory area which can be read from the outside, and a programming device for programming the PROM memory area of the semiconductor component, in which said operating temperature is obtained by interpolation in between a first calibration temperature value and a second calibration temperature value in dependence from an actual measurement, comprising the steps for determining said first and second calibration temperature values:

  • a) generation of a first calibration temperature in the semiconductor component, b) generation of a measurement signal by a multivibrator which comprises a measuring circuit and a driver circuit, the frequency of the measurement signal depending on the temperature of the measuring circuit in the semiconductor component, c) sensing of the frequency of the measurement signal in a predefined measuring interval by means of a frequency counter, d) storage of the sensed frequency in the PROM memory area of the semiconductor component by the programming device, and e) repetition of the steps b) to d) at a second calibration temperature so that the frequency sensed at the first calibration temperature and the frequency sensed at the second calibration temperature are stored in the PROM memory area of the semiconductor component.

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