Shift multi-exposure method

• US 6,696,227 B2
• Filed: 12/13/2001
• Issued: 02/24/2004
• Est. Priority Date: 02/26/2001
• Status: Expired due to Term

• Current Assignee: Nanya Technology Corporation
• Original Assignee: Nanya Technology Corporation
• Inventors: Chu, Ron-Fu, Hsu, Chung-Wei
• Primary Examiner(s): Duda, Kathleen
• Application Number:
  US10/016,893
• Publication Number:
  US 20020119402A1
• Time in Patent Office: 803 Days
• Field of Search: 430/311, 430/313, 430/322, 430/22, 430/394, 430/396
• US Class Current: 430/322
• CPC Class Codes: G03F 7/70466 Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature stitching G03F7/70475

Abstract

The present invention provides a shift multi-exposure method for defining a regular pattern by a photomask. The method comprises the following steps. First, a photoresist layer comprising a first region and a second region is formed on a substrate. Then, a first pattern is defined on the first region by the photomask. Next, the photomask is moved a predetermined distance, and a second pattern is defined on the second region by the photomask. Finally, development is performed to display the first pattern and the second pattern on the photoresist layer.

Claims

1. A shift multiexposure method for defining a regular pattern by a photomask, the method comprising the following steps:

providing a substrate;

forming a photoresist layer on the substrate, wherein the photoresist layer comprises a first region and a second region;

defining a first pattern on the first region by a photomask;

shifting the photomask a predetermined distance, then defining a second pattern on the second region by the photomask, wherein the predetermined distance is less than half of the wavelength of the exposure; and

performing development to display the first pattern and the second pattern on the photoresist layer, wherein the regular pattern is composed by the first pattern and the second pattern.

2. The shift multi-exposure method as claimed in claim 1, wherein the predetermined distance is between about from 20 nm to 30 nm.

3. A shift multi-exposure method for defining a pattern element by a photomask, the method comprising the following steps:

providing a substrate;

forming a photoresist layer on the substrate, wherein the photoresist layer comprises a first region and a second region;

defining the pattern element on the first region by the photomask;

shifting the photomask a predetermined distance, then defining the pattern element on the second region by the photomask, wherein the predetermined distance is less than half the wavelength of the exposure; and

performing development to display the pattern elements on the photoresist layer, then photoresist layer comprising regular pattern elements.

4. The shift multi-exposure method as claimed in claim 3, wherein the predetermined distance is between about from 20 nm to 30 nm.