Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support
First Claim
Patent Images
1. A method for processing MEMS devices integrated on a semiconductor wafer comprising:
- bonding the semiconductor wafer comprising the MEMS devices onto a support;
dicing the semiconductor wafer into a plurality of independent MEMS devices on the support; and
processing the independent MEMS devices on the support in a treatment environment for semiconductor wafers.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.
-
Citations
18 Claims
-
1. A method for processing MEMS devices integrated on a semiconductor wafer comprising:
-
bonding the semiconductor wafer comprising the MEMS devices onto a support;
dicing the semiconductor wafer into a plurality of independent MEMS devices on the support; and
processing the independent MEMS devices on the support in a treatment environment for semiconductor wafers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
automatically picking the MEMS devices; and
automatically assembling the MEMS devices one-by-one.
-
-
6. The method according to claim 5 wherein automatically picking and assembling comprises using a pick and place apparatus.
-
7. The method according to claim 1 wherein the support comprises a flat frame support.
-
8. The method according to claim 1 wherein the support comprises a waffle package support.
-
9. The method according to claim 1 further comprising protecting at least one face of the support with a protection layer.
-
10. The method according to claim 1 wherein the steps are carried out in an apparatus for treating semiconductor wafers.
-
11. A method for making MEMS devices comprising:
-
forming a plurality of MEMS devices integrated on a semiconductor substrate;
bonding the semiconductor wafer comprising the MEMS devices onto a support using an anhydrous HF-resistant glue;
dicing the semiconductor wafer into a plurality of independent MEMS devices on the support; and
processing the independent MEMS devices on the support in an anhydrous HF solution. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
automatically picking the MEMS devices; and
automatically assembling the MEMS devices one-by-one.
-
-
14. The method according to claim 13 wherein automatically picking and assembling comprises using a pick and place apparatus.
-
15. The method according to claim 11 wherein the support comprises a flat frame support.
-
16. The method according to claim 11 wherein the support comprises a waffle package support.
-
17. The method according to claim 11 further comprising protecting at least one face of the support with a protection layer.
-
18. The method according to claim 11 wherein the steps are carried out in an apparatus for treating semiconductor wafers.
Specification