Laser soldering method and apparatus

• US 6,696,668 B2
• Filed: 04/12/2001
• Issued: 02/24/2004
• Est. Priority Date: 06/26/2000
• Status: Active Grant

• Current Assignee: Fine Device Co., Ltd., Japan Unix Co., Ltd.
• Original Assignee: Fine Device Co., Ltd., Japan Unix Co., Ltd.
• Inventors: Hayakawa, Jun
• Primary Examiner(s): Elve, M. Alexandra
• Assistant Examiner(s): Kerns, Kevin P.
• Application Number:
  US09/832,894
• Publication Number:
  US 20010054637A1
• Time in Patent Office: 1,048 Days
• Field of Search: 219/121.63, 219/121.64, 219/121.75, 219/121.83, 219/121.84, 219/121.85, 228/219, 228/42, 228/20.1, 228/20.5
• US Class Current: 219/121.85
• CPC Class Codes: B23K 1/0056 soldering by means of beams, e.g. lasers, E.B.
• CPC Class Codes: B23K 26/032 using optical means
• CPC Class Codes: B23K 37/0258 Electric supply or control circuits therefor
• CPC Class Codes: B25J 9/1697 Vision controlled systems
• CPC Class Codes: G05B 2219/37555 Camera detects orientation, position workpiece, points of workpiece
• CPC Class Codes: G05B 2219/37563 Ccd, tv camera
• CPC Class Codes: G05B 2219/37572 Camera, tv, vision
• CPC Class Codes: G05B 2219/40611 Camera to monitor endpoint, end effector position
• CPC Class Codes: G05B 2219/45165 Laser machining
• CPC Class Codes: H01R 43/0256 for soldering or welding connectors to a printed circuit board
• CPC Class Codes: H01R 43/0263 for positioning or holding parts during soldering or welding process
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212

Abstract

An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.

Claims

1. A laser soldering method comprising:

a soldering head for projecting a laser beam for soldering toward an object to be soldered; and

an image pickup camera mounted on said soldering head in such a manner that an optical axis thereof coincides with an optical axis of said laser beam,

wherein said camera images the object to be soldered and displays the image on a monitor screen, and displays a projection spot positioned on an optical axis of the laser beam on the monitor screen,

wherein the projection spot is indicated on the monitor screen by a portion surrounded by two vertical parallel lines and two horizontal parallel lines between which a space between the parallel lines is adjustable,

wherein said soldering head and the object to be soldered are moved relative to each other to position said projection spot while the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen,

wherein the laser beam is projected from said soldering head to the object to be soldered, thus, performing soldering, and

wherein a hot inert gas is heated to a specified temperature in advance, completely surrounds the laser beam and is ejected from a gas ejection nozzle provided in said soldering head along the optical axis of the laser beam.

2. A laser soldering apparatus comprising:

a soldering head for projecting a laser beam for soldering toward an object to be soldered;

a laser mechanism connected to said soldering head;

an image pickup camera mounted on said soldering head in such a manner that an optical axis thereof coincides with an optical axis of the laser beam;

a monitor which displays an image of the object to be soldered, which is taken by the camera, on a screen, and which displays a projection spot positioned on the optical axis of the laser beam on the screen; and

a control device for moving said object to be soldered and the soldering head relative to each other,

wherein said projection spot displayed on said monitor screen is indicated by a portion surrounded by two vertical parallel lines and two horizontal parallel lines, and

wherein a size of said projection spot is freely adjusted by changing a space between the parallel lines,

wherein said soldering head includes a gas ejection nozzle for ejecting an inert gas along the optical axis of the laser beam, and

wherein the gas ejection nozzle has a gas supply mechanism for supplying a hot inert gas, which is heated in advance and completely surrounds the laser beam, connected thereto.

3. A soldering apparatus according to claim 2,

wherein said soldering head is mounted on a movable arm, and

wherein the movable arm is controlled by said control device so that said soldering head is moved along the object to be soldered.

4. A soldering apparatus according to claim 2,

wherein said soldering head includes a cylindrical casing having a laser-beam projection aperture at an end thereof, optical lenses disposed in the casing, and a half mirror disposed at a position nearer to a base end of the casing than to the optical lenses in such a manner that said half mirror is disposed at an angle of 45 degrees to the optical axis,

wherein said camera is mounted on the base end of the casing in such a manner that said camera can image the object to be soldered from said projection aperture via the half mirror and the optical lenses, and

wherein an optical fiber for outputting the laser beam from said laser mechanism toward the half mirror is connected to a fiber connecting section formed at the side of the casing at a position corresponding to said half mirror.

5. A soldering apparatus according to claim 4,

wherein the fiber connecting section in said soldering head includes a switch for switching the diameter of the laser beam which is output from the optical fiber.

6. A soldering apparatus according to claim 2, further comprising a solder supply mechanism for supplying solder to a portion to be soldered.