Circuit module and method for mounting the same

• US 6,696,909 B2
• Filed: 12/13/2000
• Issued: 02/24/2004
• Est. Priority Date: 12/13/1999
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Inoue, Keiji, Ohta, Yoshiteru, Ishige, Tsutomu
• Primary Examiner(s): Nguyen, Tuyen T.
• Application Number:
  US09/736,062
• Publication Number:
  US 20010004941A1
• Time in Patent Office: 1,168 Days
• Field of Search: 336/90, 336/92, 336/98, 336/65, 336/67, 336/68, 336/196, 336/197, 336/200, 336/210, 361/752
• US Class Current: 336/200
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2203/082 Suction, e.g. for holding solder balls or components
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure

Abstract

A circuit module has a circuit board on which electronic components are mounted and a covering member which has a plate portion and one or more supporting portions. The supporting portions fix the plate portion parallel to the surface of the circuit board. The covering member can be chucked by a chucking device to mount the circuit module to a mother circuit board.

Claims

1. A circuit module comprising:

a covering member which has a plate portion and at least one supporting portion; and

a multi-layer circuit board having electric wires between layers;

a transformer including coils, which are defined by coil patterns disposed in the multi-layer circuit board, and cores, which form magnetic paths by one or more leg portions of the cores being disposed in through holes of the circuit board positioned at a center and in a surrounding region of the coils;

wherein the at least one supporting portion fixes the plate portion in parallel to the surface of the circuit board, the covering member is defined by a portion of the at least one supporting portion extending from the plate portion in the direction perpendicular to the plate portion, the at least one supporting portion is provided with attaching portions at distal ends, and the attaching portions are engaged with the through holes in the circuit board.

2. The circuit module according to claim 1, wherein two cores are provided, the two cores attached to each other from upper and lower sides of the circuit board, and being fixed to each other by an elastic metal fitting, and wherein one of the cores is immovably held between the plate portion of the covering member and the multi-layer circuit board.

3. The circuit module according to claim 1, wherein the covering member comprises a pressing portion for pressing the leg portions of one of the cores against an inner wall of the through holes.

4. The circuit module according to claim 2, wherein the covering member comprises a pressing portion for pressing the leg portions of one of the cores against an inner wall of the through holes.

5. The circuit module according to claim 1, wherein the cover member further comprises a pressing portion for pressing the leg portions of one of the cores against an inner wall of the through holes and the pressing portion has a tongue piece which is inserted into one of the through holes.

6. The circuit module according to claim 1, wherein the supporting portions have a pressing portion for pressing a side of the cores.

7. The circuit module according to claim 1, wherein the plate portion has a resilient portion for pressing a top of the cores.

20. The circuit module according to claim 2, wherein the cover member further comprises a pressing portion for pressing the leg portions of one of the cores against an inner wall of the at least one through hole and the pressing portion has a tongue piece which is inserted into the at least one through hole.

8. A circuit module having a multi-layer circuit board on on which a transformer is disposed and on which at least one electronic component other than the transformer is mounted, the transformer including coils which are defined by coil patterns disposed in the multi-layer circuit board, at least one through hole which is drilled in the multi-layer circuit board at a center and in the surrounding region of the coils, and cores forming magnetic paths by one or more leg portions being disposed in the at least one through hole, the circuit module comprising:

a covering member which a has plate portion and at least one supporting portion;

wherein the at least one supporting portion is engaged with the at least one through hole so as to arrange the plate portion to be parallel to the multi-layer circuit board.

9. The circuit module according to claim 8, wherein the at least one supporting portion is provided with attaching portions at distal ends, the attaching portions including a step portion which contacts one of the surfaces of the multi-layer circuit board and hook portions which are engaged with the edges of the at least one through holes at an opposite surface of the multi-layer circuit board.

10. The circuit module according to claim 8, wherein two cores being provided, the two cores are attached to each other from upper and lower sides of the circuit board, and being fixed to each other by an elastic metal fitting, and wherein the at least one supporting portions of the covering member have dimensions such that the plate portion presses one of the cores against the surface of the multi-layer circuit board.

11. The circuit module according to claim 9, wherein two cores are provided, the two cores being attached to each other from upper and lower sides of the circuit board, and being fixed to each other by an elastic metal fitting, and wherein the at least one supporting portions of the covering member have dimensions such that the plate portion presses one of the cores against the surface of the multi-layer circuit board.

12. The circuit module according to claim 8, wherein the covering member comprises a pressing portion for pressing the leg portions of one of the cores against an inner wall of the at least one through hole.

13. The circuit module according to claim 9, wherein the covering member comprises a pressing portion for pressing the leg portions of one of the cores against an inner wall of the at least one through hole.

14. The circuit module according to claim 10, wherein the covering member comprises a pressing portion for pressing the leg portions of one of the cores against an inner wall of the at least one through hole.

15. The a circuit module according to claim 8, wherein the plate portion of the covering member is provided with a protrusion on a bottom surface, the protrusion contacting a top of one of the at least one electronic component other than the transformer.

16. The circuit module according to claim 9, wherein the late portion of the covering member is provided with a protrusion on a bottom surface, the protrusion contacting a top portion of one of the at least one electronic component other than the transformer.

17. The circuit module according to claim 10, wherein the plate portion of the covering member is provided with a protrusion on a bottom surface, the protrusion contacting a top portion of one of the at least one electronic component other than the transformer.

18. The circuit module according to claim 12, wherein the plate portion of the covering member is provided with a protrusion on a bottom surface, the protrusion contacting a top portion of one of the at least one electronic component other than the transformer.

19. The circuit module according to claim 9, wherein the attaching portions further include another step portion which contacts the same surface of the multi-layer circuit board as the step portion on the opposite side of the at least one through hole.

21. The circuit module according to claim 8, wherein the supporting portions have a pressing portion for pressing a side of the cores.

22. The circuit module according to claim 8, wherein the plate portion has a resilient portion for pressing a top of the cores.