Apparatus and method for creating flexible circuits

• US 6,697,694 B2
• Filed: 02/11/2003
• Issued: 02/24/2004
• Est. Priority Date: 08/26/1998
• Status: Expired due to Term

• Current Assignee: Electronic Materials LLC
• Original Assignee: Electronic Materials LLC
• Inventors: Mogensen, Steven Allen
• Primary Examiner(s): Patel, Ramesh
• Assistant Examiner(s): GAIN, EDWARD F
• Application Number:
  US10/364,184
• Publication Number:
  US 20030149505A1
• Time in Patent Office: 378 Days
• Field of Search: 700/95, 700/119, 700/182, 700/207, 700/118, 700/121, 700/283, 118/325, 264/239, 264/25, 264/308, 427/385.5, 427/407.1, 427/372.2, 427/226, 427/261
• US Class Current: 700/119
• CPC Class Codes: H05K 2203/0534 Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
• CPC Class Codes: H05K 3/125 by ink-jet printing
• CPC Class Codes: H05K 3/1275 by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Abstract

A method and apparatus for forming a flexible circuit of predetermined design, and in particular to the making of a functioning flexible circuit by depositing multiple layers of a variety of materials in fluid or component form in a set configuration onto a substrate. A source for each of the materials is provided. In one embodiment, the materials are applied to the substrate through accurate positioning and moving of the dispensing heads in three dimensions and through accurate control of the amount of material applied. In some embodiments, the substrate is a flexible film. In some embodiments, successive layers of electronic circuitry are formed by successively printing and then curing each layer, one on top of the last, starting with a flexible substrate, such as polyester film. Not only are conductive traces (i.e., wiring) printed (i.e., by dispensing and curing properly selected fluids) using the methods and/or systems described below, but also passive components (such as, for example, resistors, capacitors, and/or inductors), and/or active components (such as, for example, transistors, switches, amplifiers, filters, electric batteries, memory and/or logic).

Claims

1. A system for producing an electronic component on a substrate, the system comprising:

a computer system;

a first dispenser coupled to the computer system, the first dispenser having a first fluid that, upon curing, forms a solid substantially conductive layer;

a second dispenser coupled to the computer system, the second dispenser having a second fluid that, upon curing, forms a semiconducting and substantially solid layer;

a third dispenser coupled to the computer system, the third dispenser having a third fluid that, upon curing, forms a substantially insulating and substantially solid material;

a positioning mechanism coupled to the computer system, wherein the positioning mechanism holds the substrate and moves the substrate and the first dispenser and second dispenser and third dispenser relative to one another in a series of different relative positions as controlled by the computer system;

wherein the computer system further controls a dispensing rate of the first dispenser, second dispenser, and third dispenser to dispense a controlled amount of the first fluid, second fluid, and third fluid in a predetermined pattern on the substrate defined by the series of different relative positions to form a multi-layer electronic circuit;

a monitor coupled to the computer system that monitors one or more characteristics of the first fluid, second fluid, and third fluid; and

a controller coupled to the computer system that controls the one or more characteristics of the first fluid, second fluid, and third fluid based on parameters from the monitor.

2. The system according of claim 1, wherein the substrate is a flexible membrane, and where the positioning mechanism further comprises:

a constraining mechanism that holds the flexible membrane in a substantially flat planar shape.

3. The system according to claim 1, wherein the computer system controls a position and a thickness of the first fluid.

4. The system according to claim 1, further comprising:

a curing station, wherein the computer system controls a curing operation to occur to the substrate at the curing station.

5. A system for producing an electronic component on a substrate, the system comprising:

a computer system;

a first dispenser coupled to the computer system, the first dispenser having a first fluid that, upon curing, forms a solid substantially semiconductive circuit;

a second dispenser coupled to the computer system, the second dispenser having a second fluid that, upon curing, forms a substantially insulating and substantially solid material;

a positioning mechanism coupled to the computer system, wherein the positioning mechanism holds the substrate and moves the substrate and the first and second dispensers relative to one another in a series of different relative positions as controlled by the computer system;

wherein the computer system further controls dispensing rates of the first and second dispensers to dispense a controlled amount of the first and second fluids in a predetermined pattern on the substrate defined by the series of different relative positions to form a semiconductive multi-layer electronic circuit;

a monitor coupled to the computer system that monitors one or more characteristics of the first and second fluids; and

a controller coupled to the computer system that controls the one or more characteristics of the first and second fluids based on parameters from the monitor.

6. The system according to claim 5, wherein the substrate is a flexible membrane, and where the positioning mechanism further comprises:

a constraining mechanism that holds the flexible membrane in a substantially flat planar shape.

7. The system according to 5, further comprising;

a curing station, wherein the computer system controls a curing operation to occur to the substrate at the curing station.