Device for bonding a wire conductor

• US 6,698,089 B2
• Filed: 07/30/2001
• Issued: 03/02/2004
• Est. Priority Date: 02/12/1996
• Status: Expired due to Term

• Current Assignee: Smartrac IP BV (OEP Technologie BV)
• Original Assignee: David Finn, Manfred Rietzler
• Inventors: Rietzler, Manfred, Finn, David
• Primary Examiner(s): Vo, Peter
• Assistant Examiner(s): Nguyen, Donghai D.
• Application Number:
  US09/918,126
• Publication Number:
  US 20010054230A1
• Time in Patent Office: 946 Days
• Field of Search: 297/45, 297/48, 298/50--54, 298/27, 298/30, 298/43, 29/33.F, 29/33.M, 297/46, 297/47, 297/53, 297/55, 298/28, 298/42--45, 228/6.5, 228/10, 228/110.1, 228/111, 228/170
• US Class Current: 29/748
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07781 the coil being fabricated in a winding process
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48824 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 3/10 : in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: Y10T 29/49142 : including metal fusion
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49153 : with shaping or forcing terminal into base aperture
• CPC Class Codes: Y10T 29/5187 : Wire working
• CPC Class Codes: Y10T 29/5193 : Electrical connector or terminal
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53213 : Assembled to wire-type conductor
• CPC Class Codes: Y10T 29/53235 : Means to fasten by deformation
• CPC Class Codes: Y10T 29/53243 : Multiple, independent conductors

Abstract

Device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area by a wire guide and a portal, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).

Claims

1. A device for wiring a wire shaped conductor to a substrate, the device comprising:

a wire guide having a longitudinal axis for guiding the wire shaped conductor in parallel to a wiring plane of said substrate, said wire guide including a nozzle at a longitudinal end of said wire guide, said wire guide being movable to move said wire against said substrate by means of said nozzle for connection of said wire to said substrate, said wire guide defining a wire passage for receiving and radially surrounding the conductor;

an ultrasonic generator connected to said wire guide to ultrasonically vibrate said wire guide in said longitudinal axis of said wire guide and in a direction transverse to said wiring plane to insert the wire shaped conductor in the wiring plane of the substrate.

2. The device according to claim 1, wherein the wire guide comprises a wire-guidance capillary in communication with said nozzle, said wire-guidance capillary extends in said wire guide substantially parallel to said longitudinal axis.

3. The device according to claim 1, further comprising:

a wire supply channel spaced from said nozzle, said wire supply channel extending obliquely in relation to said longitudinal axis of said wire guide.

4. The device according to claim 1, wherein the ultrasonic generator includes an ultrasonic oscillator arranged to have a variable axis of oscillation.

5. The device according to claim 1, wherein the ultrasonic generator is arranged coaxially with respect to the wire guide.

6. The device according to claim 1, wherein:

said wire guide is a wire-guidance capillary for aligning the wire shaped conductor in the wiring plane of the substrate.

7. The device according to claim 1, further comprising:

a portal connected to said wire guide and movable of said wire guide in said wiring plane while said wire guide is connecting the wire shaped conductor to the substrate.

8. A device for embedding a wire into a wiring plane of a substrate, the device comprising:

a wire guide having a longitudinal axis, said wire guide guiding the wire in parallel to the wiring plane of the substrate, said wire guide including a nozzle at a longitudinal end of said wire guide, said wire guide being movable to move the wire against the substrate by said nozzle for connection of the wire to the substrate;

an ultrasonic generator connected to said wire guide to ultrasonically vibrate said wire guide in said longitudinal axis of said wire guide and in a direction transverse to said wiring plane, said ultrasonic generator vibrates said wire guide to embed the wire into the substrate as the wire guide moves along the substrate;

a portal connected to said wire guide and movable of said wire guide in said wiring plane while said wire guide is connecting the wire to the substrate.