Method of forming a semiconductor device
First Claim
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1. A method of forming a semiconductor device, comprising:
- conformally stacking a non-oxidized silicon layer as a liner on a semiconductor substrate having at least one concave region;
coating a spin-on-glass (SOG) layer on the liner to fill the concave region; and
curing the SOG layer.
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Abstract
A method of forming a semiconductor device includes a liner is conformally stacked on a semiconductor substrate before coating an SOG layer thereon, and then curing the SOG layer, preferably in an ambient of oxygen radicals formed at a temperature of 1000° C. or higher when oxygen and hydrogen are supplied. The oxygen radicals are preferably formed by irradiating ultraviolet rays to ozone or forming oxygen plasma. The SOG layer is preferably made of a polysilazane-based material that may promote a conversion of the SOG layer into a silicon oxide layer.
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15 Claims
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1. A method of forming a semiconductor device, comprising:
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conformally stacking a non-oxidized silicon layer as a liner on a semiconductor substrate having at least one concave region;
coating a spin-on-glass (SOG) layer on the liner to fill the concave region; and
curing the SOG layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification